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Keywords: scanning electron microscopy
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041007.
Published Online: December 9, 2011
... ( 11 ), pp. 1097 – 1099 . 10.1007/s10854-007-9474-3 14 Available online: http://www.q-tech.com/assets/tests/std883_2019.pdf 13 02 2011 28 06 2011 09 12 2011 09 12 2011 alumina bonding processes deformation foils gold scanning electron microscopy shear...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021005.
Published Online: June 23, 2011
... one of the most important structural materials, often in very demanding environments. stainless steel microstructure surface treatment electronic packaging electronics packaging grain boundaries grain size scanning electron microscopy stainless steel surface treatment X-ray...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021003.
Published Online: June 22, 2011
... silicon chip alumina substrate adhesive bonding alumina ductility elemental semiconductors gold integrated circuit bonding scanning electron microscopy silicon thermal expansion 22 10 2010 26 02 2011 22 06 2011 22 06 2011 2011 American Society of Mechanical...
Journal Articles
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020905.
Published Online: June 7, 2011
... analysis of the particle size distributions in pristine and functionalized graphite nanoplatelets based on scanning electron microscopy showed an increasing degree of exfoliation of the functionalized material. We compare the performance of the functionalized graphite nanoplatelets and carbon nanotubes...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041014.
Published Online: December 9, 2010
... to determine the reliability of the gold ball bonds ( 5 6 7 ). ball bonding bonding parameters gold aluminide surface topographical aluminium alloys gold alloys integrated circuit metallisation integrated circuit packaging lead bonding scanning electron microscopy surface topography...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011014.
Published Online: February 18, 2009
... solder bumps. Scanning electron microscopy and energy dispersive X-ray analysis were used to investigate the intermetallic compound and microvoids of cross-sectioned solder bump. Shear test was used to evaluate the reliabilities of the SnAg bumps. The 13 × 13 area-array Sn/3.0Ag solder bumps of 70 μ m...
Journal Articles
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. December 2008, 130(4): 045001.
Published Online: November 14, 2008
.... No bonding medium is used. Scanning electron microscopy images on cross sections of bonded samples exhibit a perfect Ag–Cu bond. 18 12 2007 17 03 2008 14 11 2008 bonding processes copper electronics packaging scanning electron microscopy silver thermal expansion bonding...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
Published Online: February 14, 2006
...) heat sinks adhesives contact resistance scanning electron microscopy radiography acoustic microscopy materials testing thermal interface materials interfacial resistance radiography SEM acoustic microscopy The joint between a thermal interface material (TIM) and a heat spreader...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
... of the Al bond pad. In addition, by comprehension of the effects of the multiple zincation process, the study includes investigating the Al dissolution rate and adhesion strength between eutectic a 37 Pb ∕ 63 Sn solder ball and an under bump metallurgy (UBM) interface. Scanning electron microscopy, energy...
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 43–46.
Published Online: March 21, 2005
.... The effects of high temperature and high humidity on the bond strength of ACA joints were measured using 90 deg peel test as well as by microstructural examination. It was found that aging generally caused a decrease in peel strength, especially the results of scanning electronic microscopy showed...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
Published Online: March 14, 2003
... mount technology printed circuit accessories printed circuit testing adhesives impact testing impact strength filled polymers conducting polymers shear strength bending strength scanning electron microscopy 04 December 2000 01 May 2002 14 03 2003 2003 ASME ...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
Published Online: December 12, 2002
... interconnections circuit reliability scanning electron microscopy failure (mechanical) Surface mount technology (SMT) continues to be significantly important to the electronics manufacturing industry. Currently, SMT mainly uses lead-tin as soldering material. When components and assemblies soldered...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 310–313.
Published Online: July 26, 2002
... integrated circuit interconnections electronic speckle pattern interferometry scanning electron microscopy flip-chip devices integrated circuit packaging displacement measurement strain measurement thermal stresses thermal expansion integrated circuit reliability image processing One...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 290–294.
Published Online: July 14, 1999
... reliability scanning electron microscopy cooling solidification sliding friction printed circuit testing Plastic BGA Solder Joint Reliability Cooling Rate Solidification Shear Cycle Test and Fatigue Life Recent advances in semiconductor devices have produced small feature sizes...