... that the energy release rates at reflow temperature are the suitable criteria for the estimation of interface delamination. Furthermore, it is found that underfill material properties (elastic modulus, CTE, and chemical cure shrinkage), fillet height, and silicon die thickness can be optimized to reduce the risk...

..., the chemical cure shrinkage exerts important influence on the total deformation. Due to the complexity and time consuming of the calculation, it is almost impossible for an industry to carry out the numerical simulation using viscoelastic property, which is the most close to the real material property...

...Shiang-Yu Teng; Sheng-Jye Hwang Warpage during integrated circuit encapsulation process is a serious problem. Previous researchers had focused on warpage analysis with thermal-induced shrinkage and the cure-induced shrinkage was neglected. A new approach considering both cure- and thermal-induced...

... stresses stress analysis thermal expansion failure analysis elastic moduli encapsulation bending shrinkage finite element analysis Residual Stress Underfill Resins Bi-Material Strip Bending (BMSB) Finite Element Method Polymeric encapsulant plays a critical role in integrated...

...A. J. Hudson; S. C. Martin; M. Hubert; J. K. Spelt This paper describes an optical method that has been developed to accurately measure shrinkage during the cure of adhesives treated with UV light. The experiment was designed to measure changes in the volume of very small quantities of material...

..., 80, and 100 kgf / cm 2 were applied. The total number of conditions in this experiment is 8. Volume change of EMC due to thermal expansion, cure shrinkage, and thermal contraction under fixed temperature and pressure was measured. For higher pressure, the final volume change will be higher...