... underfilled with one of five different materials after soldering with SnCu, SAC305, and SnPb. adhesion copper alloys flip-chip devices lead alloys reliability solders stress analysis thermal expansion thermal shock tin alloys So far, flip chip assembly is exempt from the requirement...

... technology finite elements stress analysis micromechanics elastic moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding 12 07 2008 16 09 2009 29 10 2009 2009 American Society of Mechanical...

...Samson Yoon; Changsoo Jang; Bongtae Han A nonlinear finite element modeling (FEM) scheme to analyze the combined effect of thermal and hygroscopic deformation is presented. The scheme employs the conventional moisture diffusion, heat transfer, and stress analysis routines available...

... 2006 active networks cracks electrical faults finite element analysis friction integrated circuit bonding integrated circuit manufacture lead bonding stress analysis A higher level of circuitry integration is the primary driving force for the semiconductor industry. Increasing...

... stresses stress analysis thermal expansion failure analysis elastic moduli encapsulation bending shrinkage finite element analysis Residual Stress Underfill Resins Bi-Material Strip Bending (BMSB) Finite Element Method Polymeric encapsulant plays a critical role in integrated...

... the stress exceeds ∼ 7 MPa . The relative dielectric constant is higher during loading than subsequent unloading. 24 08 2004 24 08 2004 alumina permittivity electronics packaging compressive strength stress analysis thermal stresses Alumina (aluminum oxide, Al 2 O 3...

...., 1988, Vibration Analysis for Electronic Equipment , 2nd ed., John Wiley & Sons, Inc., New York, pp. 275–326. Meekisho , L. , and Nelson-Owusu , K. , 2000 , “ Stress Analysis of Solder Joint with Torsional Eccentricity Subjected to Based Excitation ,” Journal of Mathematical...

... 15 12 2003 integrated circuit packaging boundary-elements methods delamination stress analysis fracture mechanics Electrical and mechanical failures in integrated circuit (IC) packages are often caused by delamination occurring at the plastic-die and plastic-pad interfaces within...

...John H. Lau; Stephen H. Pan In this study, a three-dimensional (3D) nonlinear stress analysis of the tin whisker initiation on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to a compressive stress acting at the Sn layer which is generated by the spontaneous...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 optoelectronic devices glass stress analysis boundary-value problems packaging birefringence thermal expansion internal stresses thermal stresses In most...

... analysis, and the result was found that heat was transferred and spread from the die to the ACF and its conducting particle very quickly; in around 0.5 sec the ACF can reach the bonding temperature of 220°C. For the mechanical stress analysis of the conducting particle, the degree of the deformation...

... packaging metallisation thermal conductivity finite element analysis stress analysis thermal expansion substrates modelling internal stresses Semiconductor laser diodes are the primary components of various optoelectronic applications. Unlike the ordinary semiconductors, a laser...

... stress model could be developed based on the static stress simulation and fracture mechanics methodology could be applied in the model to make the simulation more accurate as well. microassembling packaging failure analysis delamination finite element analysis stress analysis adhesion voids...

... are consistent with interfacial stress analysis. The three-layer cases I and II have the highest and nearly the same J -integral value. The value of the J -integral is slightly lower for the bi-material case while the three-layer case III has the lowest J -integral value. This result is consistent...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD September 1, 2000, Associate Editor: B. Michel. 01 September 2000 14 03 2003 piezoelectric devices piezoelectric thin films micromechanical devices finite element analysis stress analysis stress-strain relations...

... , θ = θ i These fracture parameters characterize a singular stress field near the junction along the material interface specified by the angle θ i . A two-dimensional stress analysis of the package with ultra-thin chips under thermal loading is performed...

.... Associate Editor: E. Suhir. 06 August 2002 12 12 2002 photonic switching systems soldering seals (stoppers) thermal analysis materials handling creep stress analysis finite element analysis fatigue testing tin alloys indium alloys thermal stress cracking packaging...

... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 internal stresses laminates light interferometry moire fringes nondestructive testing stress analysis The subject of residual stress due to coefficient...

..., a direct-stress analysis method—referred to as the multi-domain method (MDM)—can be used to calculate effective local stiffness of ball grid array assemblies. The fast and accurate MDM is based on nested multi-field displacement superposition and is similar in concept to p-type FEM. It is similar...

... thermal stresses stress analysis bending thermal management (packaging) composite material interfaces thermal expansion differential equations thermoelasticity The study of thermal mismatch induced stresses and their role in mechanical failure is one relevant topic to composite materials...