...Xingjun Yao; Weijie Jiang; Jiahui Yang; Junjie Fang; Wenjun Zhang This paper presents a new approach to formulating an analytical model for the underfill process in flip-chip packaging to predict the flow front and the filling time. The new approach is based on the concept of surface energy along...

... surface energy thermal conductivity thermal diffusion film thermal conductivity pyroelectric coefficient measurement infrared sensor IRFPA One of the highest growth markets in the field of infrared imaging is for low-cost devices for use in firefighting, security, automotive...