... test accelerates the creep strain rate due to the diffusive flow, relatively. 14 11 2005 12 05 2006 solders deformation indentation creep testing surface morphology stress relaxation finite element analysis Tin-based alloys are commonly used in microelectronics...

... Zincating Deposits on the Al Pads of Si Chips ,” Thin Solid Films 0040-6090 , 288 ( 1–2 ), pp. 36 – 40 . Yau , E.-W.-C. , Gong , J.-F. , and Chan , P. , 2003 , “ Al Surface Morphology Effect on Flip-Chip Solder Bump Shear Strength ,” Microelectron. Reliab. 0026-2714 , 44 ( 2 ), pp...

... surface morphology ageing corrosion testing swelling humidity On the other hand, the conventional tin-lead (Sn-Pb) soldering as an interconnection method has been used widely in flip chips packaging for decades. The soldering can offer a large degree of flexibility in an assembly with low...

... 4024) and the damage mechanism of interconnect bump with BCB bumping dielectrics upon temperature cycling. Adhesion and fracture surface morphology after die shear testing show that the weakening and delamination of BCB passivation layer at the die corner is the main cause of the reduction of die...

.... 01 March 2003 30 04 2004 silicon elemental semiconductors surface roughness surface morphology fracture toughness polishing sputter etching grinding 7 Fracture strength vs. fine-grinding depth 4 Roughness (Ra) vs. wafer thinning conditions Figure...