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Keywords: temperature-humidity aging
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
Published Online: August 14, 2006
... current was also determined. Preliminary experiments and findings, discussed in this paper, show the viability of the ACA for mixed SMT assembly. Further experimentations will include in situ contact resistance measurements during thermal aging, temperaturehumidity aging, drop testing and thermal shock...