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Keywords: thermal aging
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021116.
Paper No: EP-21-1062
Published Online: March 11, 2022
..., data on thermally aged SAC solder alloys at high strain rate levels at low operating temperatures are not available in published literature. In this paper, materials characterization of thermally aged SAC (SAC105 and SAC-Q) solder at low operating temperatures (−65 °C to 0 °C) and at high strain rates...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021005.
Paper No: EP-20-1080
Published Online: October 8, 2020
... of Anand parameters for unaged and aged SAC (SAC105 and SAC-Q) lead-free solder alloys at high strain rates has been investigated induced under sustained periods of thermal aging. The thermal aged lead-free SAC solder alloys specimen has been tested at high strain rates (10–75 per sec) at elevated...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
Published Online: August 14, 2006
... lateral conductivity. The ability to mass cure the adhesive while applying the magnetic field reduced the assembly time considerably. Placement accuracy was still found to be very critical. Shear testing of adhesive joints after thermal aging showed significance past 500 h and after temperature–humidity...
