... 14 09 2010 23 08 2011 23 12 2011 23 12 2011 elemental semiconductors finite element analysis microprocessor chips semiconductor device models semiconductor device packaging silicon temperature distribution thermal analysis thermal management (packaging) transistors...

... 16 09 2011 09 12 2011 09 12 2011 cooling forced convection liquid metals thermal management (packaging) thermal resistance liquid metal thermosyphon effect thermal management chip cooling LED self support heat driven heat transfer enhancement With the rapid...

... management challenges, and advanced 2D thermal management solutions are discussed. 04 06 2010 18 07 2011 09 12 2011 09 12 2011 integrated circuit packaging thermal management (packaging) three-dimensional integrated circuits 3D chip stacks thermal management through...

... flow system to persist in time (to survive) its configuration must evolve in such a way that it provides an easier access to the currents that flow through it [( 1 ), 3 ]. minimisation thermal management (packaging) thermal resistance 13 05 2011 10 08 2011 09 12 2011 09...

... of the MWD tool assembly and Table 1 lists the various modules and their functions. cooling heat exchangers oil drilling thermal management (packaging) thermoelectric devices 15 06 2010 19 07 2011 09 12 2011 09 12 2011 2011 American Society of Mechanical Engineers ...

... integrated circuits integrated circuit interconnections integrated optoelectronics optical interconnections printed circuits system-in-package thermal management (packaging) three-dimensional integrated circuits optoelectronics embedded 3D hybrid integration system in package thermal design...

..., it is found that the effects of variation in substrate material properties are negligible. 04 05 2010 18 01 2011 23 06 2011 23 06 2011 bronze heat transfer microchannel flow nitrogen silicon compounds slip flow thermal conductivity thermal management (packaging...

... carbon nanotubes flexible electronics light emitting diodes thermal management (packaging) thin film transistors CNTs have quasi 1D structure with unique electrical, optical, mechanical, and thermal properties which make them very attractive for a wide range of applications [( 1...

... materials oxidation particle size polymers Raman spectroscopy scanning electron microscopy statistical analysis thermal conductivity thermal management (packaging) graphite nanoplatelet (GNP) thermal interface materials particle size polymer composites thermal properties...

... Systems (ITherm), 2010. cooling heat transfer network servers thermal management (packaging) 07 04 2010 02 12 2010 09 03 2011 09 03 2011 The trend in chiller system power demand per Fig. 6 can be divided into two sections. By moving below 12.5 ° C rack...

... computational fluid dynamics cooling light emitting diodes optimisation printed circuits semiconductor device packaging thermal management (packaging) light-emitting diode printed circuit board LED array thermal modeling Oon , S. L. , 2009 , “ The Latest LED Technology...

... thermal cooling gallium arsenide gallium compounds genetic algorithms heterojunction bipolar transistors III-V semiconductors indium compounds semiconductor device packaging thermal management (packaging) thermal resistance thermal stability 29 05 2010 03 12 2010 09 03...

... computer centres cooling electric conduits thermal management (packaging) 13 10 2009 02 12 2010 09 03 2011 09 03 2011 Center for Information Technology , 2008 , “ Energy Efficient Equipment in the NIH Data Center ,” National Institutes of Health, Spring [Number 240...

... optical transceivers for transmitting and receiving data over fiber-optic cables. DELPHI multisource DOTCOMP compact thermal model boundary-condition independent models computational fluid dynamics electronics packaging natural convection thermal analysis thermal management...

.... diamond fluid oscillations gold heat pipes microfluidics pipe flow thermal management (packaging) thermal resistance 06 04 2010 31 07 2010 24 11 2010 24 11 2010 2010 American Society of Mechanical Engineers ...

... processes light emitting diodes semiconductor device reliability silver thermal management (packaging) high-power LED die shear die-attach material reliability Light emitting diode (LED) manufactured with p - n junction was first available in the 1960s. Compared with current...

... 179.56 199.20 218.85 23 12 2009 24 02 2010 09 09 2010 air conditioning computer centres cooling power consumption thermal management (packaging) data center energy efficiency coordinated optimization IT power minimization workload distribution Data...

... of various functional units with distinct powers, frequencies, and operating voltages. delays integrated circuit packaging microprocessor chips minimisation thermal management (packaging) 28 10 2009 03 05 2010 25 06 2010 25 06 2010 2010 American Society...

.... The only difference between passive and active solid-state cooling is the utilization of a thermoelectric module (TEM) sandwiched between the processor and the passive or active heat sink. cooling integrated circuit packaging integrated circuit reliability thermal management (packaging...

... the chances for TIM delamination. 21 01 2010 06 05 2010 11 06 2010 11 06 2010 assembling ball grid arrays electronics industry finite element analysis moisture polymers reliability thermal management (packaging) thermal resistance thermal interface material debonding...