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Keywords: viscoplastic modelClose
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011205.
Paper No: EP-22-1001
Published Online: August 3, 2022
...Yuqian Xu; Qiwen Zeng; Yuexing Wang; Mingyong Wu; Xiangyu Chen; Gang Chen The Anand model is a unified viscoplastic model, which is widely employed to describe the solder material deformation. The parameters in the Anand model for a certain material are usually identified by using the classical...