Predicting Temperatures of Stacked Heat Sinks With a Shroud

Petrie, T. W.; Bajabir, A. A.; Petrie, D. J.; Kroll, J. W.

doi:10.1115/1.3250568

T. W. Petrie,

T. W. Petrie

Department of Mechanical Engineering, Marquette University, Milwaukee, WI 53233

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A. A. Bajabir,

A. A. Bajabir

Department of Mechanical Engineering, Marquette University, Milwaukee, WI 53233

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D. J. Petrie,

D. J. Petrie

Electronic Packaging, Electromechanical Research Department, Eaton Corporation, Operations and Technical Center, Milwaukee, WI 53216

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J. W. Kroll

Electromechanical Technology, Eaton Corporation, Operations and Technical Center, Milwaukee, WI 53216

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T. W. Petrie

Department of Mechanical Engineering, Marquette University, Milwaukee, WI 53233

A. A. Bajabir

Department of Mechanical Engineering, Marquette University, Milwaukee, WI 53233

D. J. Petrie

Electronic Packaging, Electromechanical Research Department, Eaton Corporation, Operations and Technical Center, Milwaukee, WI 53216

J. W. Kroll

Electromechanical Technology, Eaton Corporation, Operations and Technical Center, Milwaukee, WI 53216

J. Heat Transfer. Aug 1988, 110(3): 802-807 (6 pages)

https://doi.org/10.1115/1.3250568

Published Online: August 1, 1988

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