Measurement of the thermal boundary conductance (TBC) by use of a nondestructive optical technique, transient thermoreflectance (TTR), is presented. A simple thermal model for the TTR is presented with a discussion of its applicability and sensitivity. A specially prepared sample series of Cr, Al, Au, and Pt on four different substrates (Si, sapphire, GaN, and AlN) were tested at room temperature and the TTR signal fitted to the thermal model. The resulting TBC values vary by more than a factor of 3 It is shown that the diffuse mismatch model (DMM) tended to overpredict the TBC of interfaces with materials having similar phonon spectra, while underpredicting the TBC for interfaces with dissimilar phonon spectra. The DMM only accounts for diffuse elastic scattering. Other scattering mechanisms are discussed which may explain the failure of the DMM at room temperature.
Measurement of Thermal Boundary Conductance of a Series of Metal-Dielectric Interfaces by the Transient Thermoreflectance Technique
Manuscript received December 12, 2003; revision received September 21, 2004. Review conducted by: K. Kihm.
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Stevens, R. J., Smith, A. N., and Norris, P. M. (March 24, 2005). "Measurement of Thermal Boundary Conductance of a Series of Metal-Dielectric Interfaces by the Transient Thermoreflectance Technique." ASME. J. Heat Transfer. March 2005; 127(3): 315–322. https://doi.org/10.1115/1.1857944
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