We report a theoretical study of heat conduction across metal-dielectric interfaces in devices and structures of practical interest. At cryogenic temperatures, the thermal interface resistance between electrodes and a substrate is responsible for substantial reduction in the maximum permissible peak power in Josephson junctions. The thermal interface resistance is much smaller at elevated temperatures but it still plays a critical role in nanoscale devices and structures, especially nanolaminates that consist of alternating metal and dielectric layers. A theoretical model is developed to elucidate the impact of spatial nonequilibrium between electrons and phonons on heat conduction across nanolaminates. The diffuse mismatch model is found to provide reasonable estimates of the intrinsic thermal interface resistance near room temperature as well as at cryogenic temperatures.
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e-mail: just@seas.ucla.edu
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September 2006
This article was originally published in
Journal of Heat Transfer
Research Papers
Nanoscale Heat Conduction Across Metal-Dielectric Interfaces
Y. “Sungtaek” Ju,
Y. “Sungtaek” Ju
Department of Mechanical and Aerospace Engineering,
e-mail: just@seas.ucla.edu
University of California
, Los Angeles, CA 90095-1597
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Ming-Tsung Hung,
Ming-Tsung Hung
Department of Mechanical and Aerospace Engineering,
University of California
, Los Angeles, CA 90095-1597
Search for other works by this author on:
Takane Usui
Takane Usui
Department of Mechanical and Aerospace Engineering,
University of California
, Los Angeles, CA 90095-1597
Search for other works by this author on:
Y. “Sungtaek” Ju
Department of Mechanical and Aerospace Engineering,
University of California
, Los Angeles, CA 90095-1597e-mail: just@seas.ucla.edu
Ming-Tsung Hung
Department of Mechanical and Aerospace Engineering,
University of California
, Los Angeles, CA 90095-1597
Takane Usui
Department of Mechanical and Aerospace Engineering,
University of California
, Los Angeles, CA 90095-1597J. Heat Transfer. Sep 2006, 128(9): 919-925 (7 pages)
Published Online: March 1, 2006
Article history
Received:
July 22, 2005
Revised:
March 1, 2006
Citation
Ju, Y. “., Hung, M., and Usui, T. (March 1, 2006). "Nanoscale Heat Conduction Across Metal-Dielectric Interfaces." ASME. J. Heat Transfer. September 2006; 128(9): 919–925. https://doi.org/10.1115/1.2241839
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