Two phase heat transfer devices based on the miniature version of loop heat pipe (LHP) can provide very promising cooling solutions for the compact electronic devices due to their high heat flux management capability and long distance heat transfer with minimal temperature losses. This paper discusses the effect of the wick properties on the heat transfer characteristics of the miniature LHP. The miniature model of the LHP with disk-shaped evaporator, 10 mm thick and 30 mm disk diameter, was designed using copper containment vessel and water as the working fluid, which is the most acceptable combination in electronic cooling applications. In the investigation, wick structures with different physical properties including thermal conductivity, pore radius, porosity, and permeability and with different structural topology including monoporous or biporous evaporating face were used. It was experimentally observed that copper wicks are able to provide superior thermal performance than nickel wicks, particularly for low to moderate heat loads due to their low heat conducting resistance. With monoporous copper wick, maximum evaporator heat transfer coefficient of and evaporator thermal resistance of were achieved. For monoporous nickel wick, the corresponding values were for and for . Capillary structure with smaller pore size, high porosity, and high permeability showed better heat transfer characteristics due to sufficient capillary pumping capability, low heat leaks from evaporator to compensation chamber and larger surface area to volume ratio for heat exchange. In addition to this, biporous copper wick structure showed much higher heat transfer coefficient of than monoporous copper wick due to improved evaporative heat transfer at wick wall interface and separated liquid and vapor flow pores. The present work was able to classify the importance of the wick properties in the improvement of the thermal characteristics for miniature loop heat pipes.
Effect of Wick Characteristics on the Thermal Performance of the Miniature Loop Heat Pipe
Singh, R., Akbarzadeh, A., and Mochizuki, M. (June 4, 2009). "Effect of Wick Characteristics on the Thermal Performance of the Miniature Loop Heat Pipe." ASME. J. Heat Transfer. August 2009; 131(8): 082601. https://doi.org/10.1115/1.3109994
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