Evaluation of Compact and Effective Air-Cooled Carbon Foam Heat Sink

This study investigates a V-shaped corrugated carbon foam heat sink for thermal management of electronics with forced air convection. Experiments were conducted to determine the heat sink performance in terms of heat transfer coefficient and pressure drop. The test section, with overall dimensions of $51mmL×51mmW×19mmH$⁠, enabled up to 166 W of heat dissipation, and $3280W/m2K$ and $2210W/m2K$ heat transfer coefficients, based on log mean and air inlet temperatures, respectively, at 7.8 m/s air flow speed, and 1320 Pa pressure loss. Compared to a solid carbon foam, the V-shaped corrugated structure enhances the heat transfer, and at the same time reduces the flow resistance. Physical mechanisms underlying the observed phenomena are briefly explained. With benefits that potentially can reduce overall weight, volume, and cost of the air-cooled electronics, the present V-shaped corrugated carbon foam emerges as an alternative heat sink.