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Journal Articles

Critical Heat Flux Condition and Post-Critical Heat Flux Heat Transfer of Carbon Dioxide at High Reduced Pressures in a Microchannel

Anatoly Parahovnik, Esther White, Yoav Peles

J. Heat Mass Transfer. April 2023, 145(4): 041606.

Paper No: HT-22-1454

DOI: https://doi.org/10.1115/1.4056821

Published Online: February 21, 2023

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Topics: Carbon dioxide, Critical heat flux, Flow (Dynamics), Heat transfer coefficients, Microchannels, Temperature, Heat transfer, Pressure, Heat flux

Journal Articles

Microfluidic Transport in Ternary Liquid Layers Due to Sinusoidal Thermocapillary Actuation

Shubham Agrawal, Prasanta K. Das, Purbarun Dhar

J. Heat Mass Transfer. July 2023, 145(7): 072503.

Paper No: HT-22-1459

DOI: https://doi.org/10.1115/1.4056822

Published Online: February 21, 2023

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Topics: Fluids, Microchannels, Temperature, Microfluidics, Flow (Dynamics), Surface tension, Momentum, Deformation

Includes: Supplementary data

Journal Articles

Investigation of Conjugate Effects on Forced Convection in Diamond (Diverging–Converging) Microchannels

Sandeep Goli, Sandip K. Saha, Amit Agrawal

J. Heat Mass Transfer. July 2023, 145(7): 072502.

Paper No: HT-22-1469

DOI: https://doi.org/10.1115/1.4056691

Published Online: February 8, 2023

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Topics: Diamonds, Fluids, Heat conduction, Heat flux, Microchannels, Temperature, Heat transfer, Flow (Dynamics), Thermal conductivity, Reynolds number

Includes: Supplementary data

Journal Articles

Additive Manufacturing of a High Temperature, Ni-Based Superalloy Compact Heat Exchanger: A Study on the Role of Select Key Printing Parameters

Fabio Battaglia, Xiang Zhang, Martinus A. Arie, Amir Shooshtari, Andres Paul Sarmiento, Michael Ohadi

J. Heat Mass Transfer. April 2023, 145(4): 041901.

Paper No: HT-22-1629

DOI: https://doi.org/10.1115/1.4056484

Published Online: January 4, 2023

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Topics: Additive manufacturing, Heat exchangers, Lasers, Manifolds, Manufacturing, Microchannels, Printing, Superalloys, High temperature, Design

Journal Articles

Thermal Performance Optimization of the Three-Dimensional Integrated Circuits Employing the Integrated Chip-Size Double-Layer or Multi-Layer Microchannels

Sainan Lu, Kambiz Vafai

J. Heat Mass Transfer. March 2023, 145(3): 032501.

Paper No: HT-22-1442

DOI: https://doi.org/10.1115/1.4055245

Published Online: December 9, 2022

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Topics: Copper, Flat heat pipes, Heat sinks, Integrated circuits, Microchannels, Nanofluids, Optimization, Temperature, Weight (Mass)

Journal Articles

A Theoretical Model to Predict Pool Boiling Critical Heat Flux for Micro/Nano-Structured Surfaces

A. Bharadwaj, R. D. Misra

J. Heat Transfer. October 2022, 144(10): 101601.

Paper No: HT-22-1066

DOI: https://doi.org/10.1115/1.4054899

Published Online: July 19, 2022

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Topics: Bubbles, Critical heat flux, Microchannels, Surface roughness, Vapors

Journal Articles

Analytical Study on Intricacies of Axial Conduction in Microchannel Heat Sinks

Indrasis Mitra, Indranil Ghosh

J. Heat Transfer. September 2022, 144(9): 094502.

Paper No: HT-22-1012

DOI: https://doi.org/10.1115/1.4054772

Published Online: June 22, 2022

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Topics: Flow (Dynamics), Fluids, Heat, Heat conduction, Heat sinks, Temperature, Temperature profiles, Microchannels, Reynolds number

Journal Articles

Insight to Innovation: An Overview of Research Journey of Dr. Satish Kandlikar

Pruthvik Raghupathi, Alyssa Owens, Mark Steinke, Ting Yu Lin, Ankit Kalani, Debora Moreira, Jose-Luis Gonzalez-Hernandez, Zujie Lu, Rupak Banerjee, Michael Daino, Arvind Jaikumar, Aranya Chauhan, Aniket Rishi, Isaac Parez-Raya, Travis Emery, Fernando Guimarães Aguilar

J. Heat Transfer. August 2022, 144(8): 080801.

Paper No: HT-21-1172

DOI: https://doi.org/10.1115/1.4054167

Published Online: May 24, 2022

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Topics: Boiling, Bubbles, Critical heat flux, Flow (Dynamics), Heat transfer, Microchannels, Pool boiling, Vapors, Water, Surface roughness

Journal Articles

Heat Transfer and Pressure Drop in Single-Phase Flows in Tapered Microchannels

Debora C. Moreira, Gherhardt Ribatski, Satish G. Kandlikar

J. Heat Transfer. July 2022, 144(7): 072502.

Paper No: HT-21-1651

DOI: https://doi.org/10.1115/1.4054351

Published Online: May 11, 2022

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Topics: Flow (Dynamics), Fluids, Heat flux, Heat transfer, Microchannels, Pressure drop, Temperature, Reynolds number, Heat transfer coefficients, Copper

Journal Articles

Flow Pattern Analysis and Heat Transfer Characteristics During Subcooled Flow Boiling in a Rectangular Microchannel on ZnO Microrod Surface

Yuhao Lin, Junye Li, Jia Sun, Wei Li, Yanlong Cao

J. Heat Transfer. December 2021, 143(12): 124501.

Paper No: HT-20-1681

DOI: https://doi.org/10.1115/1.4052434

Published Online: October 11, 2021

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Topics: Boiling, Bubbly flow, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Microchannels, Subcooling, Slug flows, Bubbles, Heat flux

Journal Articles

Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)

Sevket U. Yuruker, Raphael K. Mandel, Patrick McCluskey, Michael M. Ohadi

J. Heat Transfer. October 2021, 143(10): 101501.

Paper No: HT-21-1514

DOI: https://doi.org/10.1115/1.4051999

Published Online: September 8, 2021

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Topics: Cooling, Electronics, Flow (Dynamics), Heat, Heat sinks, Manifolds, Manufacturing, Microchannels, Switches, Thermal management

Journal Articles

Onset of Boiling, Heat Transfer, and Flow Patterns of Flow Boiling on the Superhydrophobic Porous Copper Surface in a Microchannel

Yuhao Lin, Junye Li, Jia Sun, Wei Li, Yanlong Cao

J. Heat Transfer. August 2021, 143(8): 081602.

Paper No: HT-20-1651

DOI: https://doi.org/10.1115/1.4051324

Published Online: June 28, 2021

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Topics: Boiling, Copper, Flow (Dynamics), Heat transfer, Microchannels, Subcooling, Heat transfer coefficients, Heat flux, Flux (Metallurgy), Heat

Journal Articles

Experimental Investigation on the Change in Flow Boiling Characteristics Due to Boiling-Induced Copper Ageing

Prasanna Jayaramu, Shashwat Jain, Sateesh Gedupudi, Sarit K. Das

J. Heat Transfer. July 2021, 143(7): 074502.

Paper No: HT-19-1598

DOI: https://doi.org/10.1115/1.4051124

Published Online: May 31, 2021

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Topics: Boiling, Copper, Flow (Dynamics), Oxidation, Heat transfer, Pressure drop, Microchannels, Water, Heat transfer coefficients, Temperature

Includes: Supplementary data

Journal Articles

Numerical Investigation on Bubble Growth and Merger in Microchannel Flow Boiling With Self-Rewetting Fluid

Wei Li, Yuhao Lin, Yang Luo

J. Heat Transfer. June 2021, 143(6): 062501.

Paper No: HT-20-1530

DOI: https://doi.org/10.1115/1.4050716

Published Online: April 22, 2021

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Topics: Boiling, Bubbles, Fluids, Microchannel flow, Water, Heat flux, Surface tension, Temperature, Flow (Dynamics), Heat transfer

Journal Articles

Heat Transfer Coefficient, Pressure Gradient, and Flow Patterns of R1234yf Evaporating in Microchannel Tube

Houpei Li, Pega Hrnjak

J. Heat Transfer. April 2021, 143(4): 042501.

Paper No: HT-19-1251

DOI: https://doi.org/10.1115/1.4049635

Published Online: February 23, 2021

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Topics: Flow (Dynamics), Heat transfer coefficients, Microchannels, Pressure gradient, Vapors, Heat flux, Pressure drop, Heat transfer, Evaporation, Pressure

Includes: Supplementary data

Journal Articles

Visualization of Flow Boiling Experiments on Micro/Nanoscale Structured Surfaces in Microchannel

Wei Li, Junye Li, Kan Zhou, Hua Zhu, Zhengjiang Zhang, Jincai Du

J. Heat Transfer. April 2021, 143(4): 044503.

Paper No: HT-20-1272

DOI: https://doi.org/10.1115/1.4049843

Published Online: February 22, 2021

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Topics: Boiling, Flow (Dynamics), Image processing, Microchannel flow, Microchannels, Nanoscale phenomena, Visualization, Bubbles, Transients (Dynamics), Subcooling

Journal Articles

Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches

Tomas Moreno-Torres, Daniel Lorenzini, Yogendra Joshi, Abel Hernandez-Guerrero, J. Luis Luviano-Ortiz

J. Heat Transfer. April 2021, 143(4): 044502.

Paper No: HT-20-1769

DOI: https://doi.org/10.1115/1.4049639

Published Online: February 2, 2021

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Topics: Computer simulation, Cooling systems, Density, Experimental design, Heat, Microfluidics, Pressure drop, Silicon, Temperature, Fins

Journal Articles

Analysis of Burnett Stresses and Entropy Generation for Pressure-Driven Plane Poiseuille Flow

Upendra Yadav, Amit Agrawal

J. Heat Transfer. March 2021, 143(3): 032102.

Paper No: HT-20-1457

DOI: https://doi.org/10.1115/1.4048969

Published Online: January 18, 2021

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Topics: Entropy, Knudsen number, Microchannels, Pressure, Stress

Journal Articles

The UGKS Simulation of Microchannel Gas Flow and Heat Transfer Confined Between Isothermal and Nonisothermal Parallel Plates

Lianfu Dai, Huiying Wu, Jun Tang

J. Heat Transfer. December 2020, 142(12): 122501.

Paper No: HT-20-1245

DOI: https://doi.org/10.1115/1.4048255

Published Online: October 5, 2020

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Topics: Gas flow, Heat transfer, Microchannels, Plates (structures), Pressure, Temperature, Temperature distribution, Density, Mean free path, Microchannel flow

Journal Articles

Experimental Comparison of Flow Boiling Heat Transfer in High Aspect Ratio Microchannels With Plain and Grooved Walls

Xiao Cheng, Huiying Wu

J. Heat Transfer. December 2020, 142(12): 121602.

Paper No: HT-19-1683

DOI: https://doi.org/10.1115/1.4048094

Published Online: September 18, 2020

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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Temperature, Heat sinks, Pressure drop, Heat flux, Evaporation

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Journal citation

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Supplemental Material

Critical Heat Flux Condition and Post-Critical Heat Flux Heat Transfer of Carbon Dioxide at High Reduced Pressures in a Microchannel

Microfluidic Transport in Ternary Liquid Layers Due to Sinusoidal Thermocapillary Actuation

Investigation of Conjugate Effects on Forced Convection in Diamond (Diverging–Converging) Microchannels

Additive Manufacturing of a High Temperature, Ni-Based Superalloy Compact Heat Exchanger: A Study on the Role of Select Key Printing Parameters

Thermal Performance Optimization of the Three-Dimensional Integrated Circuits Employing the Integrated Chip-Size Double-Layer or Multi-Layer Microchannels

A Theoretical Model to Predict Pool Boiling Critical Heat Flux for Micro/Nano-Structured Surfaces

Analytical Study on Intricacies of Axial Conduction in Microchannel Heat Sinks

Insight to Innovation: An Overview of Research Journey of Dr. Satish Kandlikar

Heat Transfer and Pressure Drop in Single-Phase Flows in Tapered Microchannels

Flow Pattern Analysis and Heat Transfer Characteristics During Subcooled Flow Boiling in a Rectangular Microchannel on ZnO Microrod Surface

Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)

Onset of Boiling, Heat Transfer, and Flow Patterns of Flow Boiling on the Superhydrophobic Porous Copper Surface in a Microchannel

Experimental Investigation on the Change in Flow Boiling Characteristics Due to Boiling-Induced Copper Ageing

Numerical Investigation on Bubble Growth and Merger in Microchannel Flow Boiling With Self-Rewetting Fluid

Heat Transfer Coefficient, Pressure Gradient, and Flow Patterns of R1234yf Evaporating in Microchannel Tube

Visualization of Flow Boiling Experiments on Micro/Nanoscale Structured Surfaces in Microchannel

Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches

Analysis of Burnett Stresses and Entropy Generation for Pressure-Driven Plane Poiseuille Flow

The UGKS Simulation of Microchannel Gas Flow and Heat Transfer Confined Between Isothermal and Nonisothermal Parallel Plates

Experimental Comparison of Flow Boiling Heat Transfer in High Aspect Ratio Microchannels With Plain and Grooved Walls

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