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Journal Articles

Marangoni and Variable Viscosity Phenomena in Picoliter Size Solder Droplet Deposition

M. Dietzel, S. Haferl, Y. Ventikos, D. Poulikakos
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. April 2003, 125(2): 365–376.
https://doi.org/10.1115/1.1532014
Published Online: March 21, 2003
View Article titled, Marangoni and Variable Viscosity Phenomena in Picoliter Size Solder Droplet Deposition
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Topics: Drops, Solders, Surface tension, Temperature, Viscosity, Solidification, Navier-Stokes equations
Journal Articles

An Experimental Study of Molten Microdroplet Surface Deposition and Solidification: Transient Behavior and Wetting Angle Dynamics

D. Attinger, Z. Zhao, D. Poulikakos
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. August 2000, 122(3): 544–556.
https://doi.org/10.1115/1.1287587
Published Online: April 11, 2000
View Article titled, An Experimental Study of Molten Microdroplet Surface Deposition and Solidification: Transient Behavior and Wetting Angle Dynamics
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Topics: Drops, Solders, Solidification, Wetting, Temperature, Dynamics (Mechanics)
Journal Articles

An Investigation of Key Factors Affecting Solder Microdroplet Deposition

B. Xiong, C. M. Megaridis, D. Poulikakos, H. Hoang
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1998, 120(1): 259–270.
https://doi.org/10.1115/1.2830051
Published Online: February 1, 1998
View Article titled, An Investigation of Key Factors Affecting Solder Microdroplet Deposition
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Topics: Solders, Contact resistance, Modeling, Shapes, Solidification, Drops, Electronic equipment, Electronics, Fluids, Liquid metals
Journal Articles

Transport Phenomena in Picoliter Size Solder Droplet Dispension

J. M. Waldvogel, D. Poulikakos, D. B. Wallace, R. Marusak
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1996, 118(1): 148–156.
https://doi.org/10.1115/1.2824028
Published Online: February 1, 1996
View Article titled, Transport Phenomena in Picoliter Size Solder Droplet Dispension
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Topics: Drops, Heat transfer, Solders, Transport phenomena, Computer simulation, Temperature, Composite materials, Convection, Deformation, Electronic components