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Keywords: copper
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. December 2013, 135(12): 121501.
Paper No: HT-12-1308
Published Online: September 27, 2013
...Bradley Bon; James Klausner; Edward McKenna Table 2 Crystal structure for three different copper crystal planes. Atoms colored black are those positioned at the top layer. Atoms colored grey are atoms in the layer just beneath the top layer of the crystal. Crystal plane Planar...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 2012, 134(2): 021502.
Published Online: December 13, 2011
...) on the outside surface of a smooth copper tube were measured at the saturation temperature of 6.7 °C; water flows inside the tube and provides heat to the refrigerants to boil (thus, water-heated boiling). Measurements showed that the refrigerant of a higher vapor pressure has a higher heat transfer coefficient...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. January 2012, 134(1): 012602.
Published Online: November 29, 2011
... of such devices. Three sintered copper wick samples employed in commercial heat pipes are characterized in this work in terms of their thermal transport properties––porosity, effective thermal conductivity, permeability, and interfacial heat transfer coefficient. The commercially available samples of nearly...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. December 2011, 133(12): 121502.
Published Online: October 6, 2011
...Kleber Vieira de Paiva; Marcia Barbosa Henriques Mantelli; Leonardo Kessler Slongo This work presents a theoretical and experimental analysis of a copper mini heat pipe (MHP), fabricated from a sandwich formed between cylindrical wires and flat plates, which are welded by means of diffusion process...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 2011, 133(11): 111501.
Published Online: August 31, 2011
... nanoparticles, which are known for their good heat transfer characteristics in bulk regime, reported drastic enhancement in thermal conductivity. The present paper investigates into the pool boiling characteristics of metallic nanofluids, in particular of Cu - H 2 O nanofluids, on flat copper heater surface...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. October 2011, 133(10): 101502.
Published Online: August 11, 2011
... and the critical heat flux >500 W/cm 2 over 2 mm × 2 mm heating areas are demonstrated. Copper oxide nanostructures formed on the micropost surfaces significantly enhance the critical heat flux without compromising the effective heat transfer coefficient. An approximate numerical model is developed to help...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. October 2011, 133(10): 101801.
Published Online: August 11, 2011
... applications. 21 12 2009 25 04 2011 11 08 2011 11 08 2011 chemically reactive flow copper design engineering flow measurement heat exchangers maintenance engineering nickel pipe flow thermal resistance velocity measurement fouling 90/10 Cu/Ni tube heat transfer...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 2011, 133(8): 081503.
Published Online: May 3, 2011
... . 10.1016/S0017-9310(00)00057-0 El-Genk , M. S. , and Bostanci , H. , 2003 , “ Saturation Boiling of HFE-7100 from a Copper Surface, Simulating a Microelectronic Chip ,” Int. J. Heat Mass Transfer 0017-9310 , 46 , pp. 1841 – 1854 . 10.1016/S0017-9310(02)00489-1 El-Genk , M. S...
Journal Articles
Publisher: ASME
Article Type: Photo Gallery
J. Heat Mass Transfer. August 2011, 133(8): 080908.
Published Online: April 28, 2011
...Jessica Sheehan; Avram Bar-Cohen cooling copper evaporation flow visualisation infrared imaging microchannel flow microfabrication micro-optomechanical devices sapphire two-phase flow 28 04 2011 28 04 2011 2011 American Society of Mechanical Engineers ...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. May 2011, 133(5): 054503.
Published Online: February 2, 2011
...T. Grosan; I. Pop The classical problem of forced convection boundary layer flow and heat transfer past a needle with variable wall temperature using nanofluids is theoretically studied. The similarity equations are solved numerically for two types of metallic or nonmetallic, such as copper (Cu...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 2011, 133(5): 052401.
Published Online: February 1, 2011
... 2010 01 02 2011 01 02 2011 alumina aluminium convection copper copper compounds gold liquid theory nanofluidics nickel organic compounds thermal conductivity titanium compounds viscosity water nanofluid convective heat transfer coefficient thermal conductivity...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. March 2011, 133(3): 031004.
Published Online: November 15, 2010
...Calvin H. Li; Ting Li; Paul Hodgins; G. P. Peterson Spherical glass and copper beads have been used to create bead packed porous structures for an investigation of two-phase heat transfer bubble dynamics under geometric constraints. The results demonstrated a variety of bubble dynamics...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. July 2010, 132(7): 071501.
Published Online: April 28, 2010
...Mohamed S. El-Genk; Amir F. Ali Experiments are performed to investigate saturation boiling of degassed PF-5060 dielectric liquid on microporous copper dendrite surface layers deposited on 10 × 10 mm 2 Cu substrates. The electrochemically deposited surface layers are of different thicknesses...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. June 2010, 132(6): 062501.
Published Online: March 24, 2010
... for Ra = 10 4 and at θ = 30 deg for Ra = 10 5 and 10 6 . Eastman , J. A. , Choi , S. U. S. , Yu , W. , and Thompson , L. J. , 2001 , “ Anomalously Increased Effective Thermal Conductivity of Ethylene Glycol-Based Nanofluids Containing Copper Nanoparticles ,” Appl. Phys. Lett...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. January 2010, 132(1): 012403.
Published Online: October 26, 2009
... and reduced the heat capacity measurement errors. Heat capacities of copper thin films with thicknesses from 20 nm to 340 nm are measured in the temperature range from 300 K to 420 K in vacuum of 1 mPa. The specific heat of the 340 nm Cu film is close to the literature data of bulk Cu. For the thinner films...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. September 2009, 131(9): 091001.
Published Online: June 19, 2009
...Wen-Jei Yang; Nengli Zhang; Daniel L. Vrable This paper introduces a novel heat transfer enhancement surface, referred to as metal-graphite composite surface. It is comprised of high thermal conductivity graphite microfibers interspersed within a metal matrix (copper or aluminum) to enhance...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 2009, 131(8): 081902.
Published Online: June 5, 2009
...R. Kathiravan; Ravi Kumar; Akhilesh Gupta; Ramesh Chandra Copper nanoparticles with an average size of 10 nm are prepared by the sputtering method and are characterized using different techniques, viz., X-ray diffraction spectrum, atomic force microscopy, and transmission electron microscopy...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. December 2008, 130(12): 121501.
Published Online: September 23, 2008
...Je-Young Chang; Ravi S. Prasher; Suzana Prstic; P. Cheng; H. B. Ma This paper reports the test results of vapor chambers using copper post heaters and silicon die heaters. Experiments were conducted to understand the effects of nonuniform heating conditions (hot spots) on the evaporative thermal...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. October 2008, 130(10): 102201.
Published Online: August 6, 2008
..., aluminum, copper, silver, Constantan, and silicon; covering a range of Reynolds number (220–900), Ekman number ( 7.08 × 10 − 5 – ∞ ) , nozzle-to-target spacing ( β = 0.25 – 1.0 ) , disk thicknesses to nozzle diameter ratio ( b ∕ d n = 0.25 – 1.67 ) , and Prandtl number (1.29–124.44) using ammonia ( N H 3...