... 2012 13 02 2012 heat transfer phase change materials pipe flow thermal management (packaging) two-phase flow micro-encapsulated phase change material thermal boundary layer enhancement of heat transfer A phase change material (PCM) is a substance with a high latent heat...

... exchangers plates (structures) thermal management (packaging) equivalent fin height heat flow choke forced cooled electronic chassis unequal heat loading Interest in the forced cooled electronic chassis or cold plate to provide an acceptable microclimate for electronic components within...

... nanostructured materials oxidation power semiconductor devices semiconductor device models thermal management (packaging) 08 07 2010 02 05 2011 11 08 2011 11 08 2011 We report the heat transfer performance of microfabricated Cu post wicks. CuO nanostructures integrated onto...

... flow silicon thermal management (packaging) pool boiling heat transfer enhancement microchannels grooves bubble dynamics During pool boiling, the latent heat involved with the phase change from liquid to vapor becomes significant in the heat removal process. The substantial increase...

... ( 2 ). carbon foam thermal management electronics cooling carbon foams forced convection heat sinks thermal management (packaging) 10 05 2010 14 11 2010 02 02 2011 02 02 2011 2011 American Society of Mechanical Engineers ...

... dendrites dielectric liquids flow through porous media heat transfer microfluidics nanoporous materials thermal management (packaging) pool boiling enhancement copper nanodendrites electrochemical deposition electronics cooling dielectric liquids The ever increasing transistor...

... 04 2010 01 04 2010 computational fluid dynamics finite volume methods Galerkin method heat transfer matrix decomposition thermal management (packaging) Practical applications of computational fluid dynamics (CFD) for heat transfer analysis often present situations where...

... temperature measurement thermal management (packaging) thermometers 19 06 2009 23 09 2009 09 03 2010 09 03 2010 Total thin-film evaporation area comparisons between nano- and micropillarlike wick structures The geometric analysis of the film evaporation regions of wick...

... integrated circuit interconnections integrated circuit packaging microchannel flow microprocessor chips refrigerants thermal management (packaging) two-phase flow 02 02 2009 25 09 2009 19 02 2010 19 02 2010 2010 American Society of Mechanical Engineers ...

... sinks heat transfer laminar flow microchannel flow thermal management (packaging) 30 09 2008 11 04 2009 18 02 2010 18 02 2010 2010 American Society of Mechanical Engineers ...

... control thermal management (packaging) thermoelectric devices thermo-electric cooling thermal control conduction thermal management Passive thermal control is not adequate for scientific instruments with temperature limitations and constraints. Instead, cooling requirements...

... cooling fans heat conduction heat sinks thermal management (packaging) turbulence electronics cooling low profile portable electronics radial fans and heat sinks thermal management Performance and profile, or height, are two features that give companies a competitive advantage...

.... 10 10 2007 03 06 2008 23 09 2008 chip scale packaging copper elemental semiconductors evaporation heat pipes microprocessor chips porosity silicon statistical analysis thermal management (packaging) thermal resistance heat pipe vapor chamber nonuniform heating...

.... , 1996 , Thermal Contact Conductance , Springer-Verlag , New York . 06 07 2007 17 06 2008 02 09 2008 carbon nanotubes photoacoustic effect plasma CVD silicon silver thermal conductivity thermal management (packaging) thermal resistance As semiconductor technology...

... at an optimum location in either impingement or cross flow position, it can provide similar enhancements. 19 12 2006 25 06 2007 23 04 2008 cooling heat transfer jets microfluidics thermal management (packaging) synthetic jets electronics cooling thermal management impingement...

... were fiber-structure dependent. carbon fibres graphite nanostructured materials phase change materials thermal management (packaging) paraffin graphite nanofiber phase change material (PCM) thermal management Phase change materials (PCMs) are materials that undergo a phase...

... energy conservation and potential economic savings. exergy second-law analysis data center thermal management electronics cooling energy efficiency air conditioning cooling thermal management (packaging) total energy systems 10 07 2006 25 05 2007 04 02 2008...

... sinks are provided. 11 04 2006 23 02 2007 cooling heat sinks heat transfer integrated circuit packaging thermal management (packaging) conjugate heat transfer thermal management microelectronics micro-fabrication microchannel liquid cooling Heat removal has...

... management (packaging) flat evaporator novel design electronic cooling miniature loop heat pipe mLHP thermal control Compact electronic devices such as notebooks with high performance microprocessors have been developed to meet the extensive data and graphic processing requirements...

... applications. spray cooling thermal management fins heat sink evaporation cooling thermal management (packaging) heat sinks microchannel flow sprays nozzles 21 07 2006 18 01 2007 2007 American Society of Mechanical Engineers ...