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Proceedings Papers

Improvement of the Form Accuracy Ground by a Slender Wheel in Internal Grinding

Takashi Onishi, Yusuke Nakabayashi, Moriaki Sakakura, Go Ichiba, Kazuhito Ohashi

Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T03A025, September 3, 2020

Paper No: LEMP2020-8595

DOI: https://doi.org/10.1115/LEMP2020-8595

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Topics: Deformation, Errors, Grinding, Wheels

Proceedings Papers

Proposing a New Evaluation Method in Si Wafer Rotary Grinding

Jumpei Kusuyama, Bima Kawase, Yohichi Nakao, Masaki Kanazawa, Kazumasa Ishikawa

Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T03A027, September 3, 2020

Paper No: LEMP2020-8601

DOI: https://doi.org/10.1115/LEMP2020-8601

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Topics: Evaluation methods, Grinding, Semiconductor wafers, Surface roughness

Proceedings Papers

Study on Polishing Method Using Double Magnet System by Superconductive Assisted Machining Method

Keisuke Suzuki, Tatsuya Nakasaki, Hidetaka Nakashima, Panart Kajornrunruan, Misaki Onomata, Yushi Kinoshita, Ruizhe Zhang, Edmund Soji Otabe

Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T03A009, September 3, 2020

Paper No: LEMP2020-8553

DOI: https://doi.org/10.1115/LEMP2020-8553

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Topics: Grinding, Machining, Magnets, Polishing

Proceedings Papers

Development of the cBN Electroplated End-Mill for High Precision Machining of CFRP

Shinnosuke Yamashita, Tatsuya Furuki, Hiroyuki Kousaka, Toshiki Hirogaki, Eiichi Aoyama, Kiyofumi Inaba, Kazuna Fujiwara

Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T03A028, September 3, 2020

Paper No: LEMP2020-8604

DOI: https://doi.org/10.1115/LEMP2020-8604

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Topics: Carbon reinforced plastics, Cutting, Grinding, Machining

Proceedings Papers

Effect of Steady Rest in Cylindrical Traverse Grinding of Slender Workpiece

Hidetaka Fujii, Takashi Onishi, Chinhu Lin, Moriaki Sakakura, Kazuhito Ohashi

Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T03A001, September 3, 2020

Paper No: LEMP2020-8507

DOI: https://doi.org/10.1115/LEMP2020-8507

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Topics: Deformation, Grinding

Proceedings Papers

Removal Machining Performances by Using Inert Gas Filled Micro Bubble Coolant

Manabu Iwai, Ryouta Yamashita, Satoshi Anzai, Shinichi Ninomiya

Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T03A011, September 3, 2020

Paper No: LEMP2020-8558

DOI: https://doi.org/10.1115/LEMP2020-8558

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Topics: Coolants, Grinding, Machining, Microbubbles

Proceedings Papers

Investigation of Crystallographic Aspects of Subsurface Damage Induced by Grinding Using Micro-Raman Tomographic Imaging

Teppei Onuki, Shunsuke Kan, Wangpiao Lin, Wentong Lu, Kousuke Hasegawa, Hirotaka Ojima, Jun Shimizu, Libo Zhou

Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T03A002, September 3, 2020

Paper No: LEMP2020-8514

DOI: https://doi.org/10.1115/LEMP2020-8514

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Topics: Damage, Grinding, Imaging, Sapphire

Proceedings Papers

Micro Grooving of Cemented Carbide Using PCD Blade

Keishi Yamaguchi, Takumi Sugimoto, Minoru Ota, Kai Egashira

Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T03A021, September 3, 2020

Paper No: LEMP2020-8579

DOI: https://doi.org/10.1115/LEMP2020-8579

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Topics: Blades, Machine tools, Statistical process control, Manufacturing, Wear, Wire, Bearings, Disks, Electrical discharge machining, Electrodes

Proceedings Papers

Performance Improvement of Ultrasonic-Assisted Grinding Using PCD Micropin Tools

Kai Egashira, Keishi Yamaguchi, Minoru Ota

Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T08A010, September 3, 2020

Paper No: LEMP2020-8552

DOI: https://doi.org/10.1115/LEMP2020-8552

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Topics: Electrical discharge machining, Grinding

Proceedings Papers

Grinding Performance and Delamination Analysis of FeSiB Metallic Glass Laminate

Zhenglong Fang, Keisuke Nagato, Naohiko Sugita, Masayuki Nakao

Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T05A004, September 3, 2020

Paper No: LEMP2020-8520

DOI: https://doi.org/10.1115/LEMP2020-8520

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Topics: Delamination, Grinding, Laminates, Metallic glasses, Cutting, Crystallization, Wear, Circuits, Deformation, Diffraction patterns

Proceedings Papers

Measurement and Evaluation of the Static Friction Coefficient Between Fixed Coupling Surfaces Under Face Contact and High Contact Pressure

Fumihiko Inagaki, Noboru Morita, Hirofumi Hidai, Souta Matsusaka, Tatsuo Ohmori, Akira Chiba, Yuichiro Matsumoto, Shinji Shimizu

Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T08A006, September 3, 2020

Paper No: LEMP2020-8530

DOI: https://doi.org/10.1115/LEMP2020-8530

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Topics: Pressure, Stiction, Grinding, Surface roughness, Sliding friction, Steel, Stiffness

NARROW

Improvement of the Form Accuracy Ground by a Slender Wheel in Internal Grinding

Proposing a New Evaluation Method in Si Wafer Rotary Grinding

Study on Polishing Method Using Double Magnet System by Superconductive Assisted Machining Method

Development of the cBN Electroplated End-Mill for High Precision Machining of CFRP

Effect of Steady Rest in Cylindrical Traverse Grinding of Slender Workpiece

Removal Machining Performances by Using Inert Gas Filled Micro Bubble Coolant

Investigation of Crystallographic Aspects of Subsurface Damage Induced by Grinding Using Micro-Raman Tomographic Imaging

Micro Grooving of Cemented Carbide Using PCD Blade

Performance Improvement of Ultrasonic-Assisted Grinding Using PCD Micropin Tools

Grinding Performance and Delamination Analysis of FeSiB Metallic Glass Laminate

Measurement and Evaluation of the Static Friction Coefficient Between Fixed Coupling Surfaces Under Face Contact and High Contact Pressure

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