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Volume 146, Issue 7

July 2024

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ISSN 1087-1357

EISSN 1528-8935

In this Issue

Special Section: Semiconductor
Research Papers

Special Section: Semiconductor

Measurement of Thermal Field Temperature Distribution Inside Reaction Chamber for Epitaxial Growth of Silicon Carbide Layer

Shiwei Deng, Yancheng Wang, Jiafeng Cheng, Wenjie Shen, Deqing Mei

J. Manuf. Sci. Eng. July 2024, 146(7): 070901. doi: https://doi.org/10.1115/1.4065021

Abstract

View articletitled, Measurement of Thermal Field Temperature Distribution Inside Reaction Chamber for Epitaxial Growth of Silicon Carbide Layer

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Topics: Gas flow , Silicon carbide , Temperature , Temperature distribution , Flow (Dynamics) , High temperature

Classification of Chip-Level Defect Types in Wafer Bin Maps Using Only Wafer-Level Labels

Hyuck Lee, Hyeonwoo Kim, Heeyoung Kim

J. Manuf. Sci. Eng. July 2024, 146(7): 070902. doi: https://doi.org/10.1115/1.4065226

Abstracts

View articletitled, Classification of Chip-Level Defect Types in Wafer Bin Maps Using Only Wafer-Level Labels

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Topics: Cams , Image segmentation , Semantics , Semiconductor wafers , Trains

Few-Shot Classification of Wafer Bin Maps Using Transfer Learning and Ensemble Learning

Hyeonwoo Kim, Heegeon Yoon, Heeyoung Kim

J. Manuf. Sci. Eng. July 2024, 146(7): 070903. doi: https://doi.org/10.1115/1.4065255

Abstracts

View articletitled, Few-Shot Classification of Wafer Bin Maps Using Transfer Learning and Ensemble Learning

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Topics: Semiconductor wafers , Trains , Feature extraction , Algorithms , Ablation (Vaporization technology)

Auto-Labeling for Pattern Recognition of Wafer Defect Maps in Semiconductor Manufacturing

Shu-Kai S. Fan, Pei-Chen Chen, Chih-Hung Jen, Kanchana Sethanan

J. Manuf. Sci. Eng. July 2024, 146(7): 070904. doi: https://doi.org/10.1115/1.4065118

Abstracts

View articletitled, Auto-Labeling for Pattern Recognition of Wafer Defect Maps in Semiconductor Manufacturing

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Topics: Semiconductor wafers , Integrated circuit fabrication

Hole Edge Metrology and Inspection by Edge Diffractometry

Kuan Lu, ChaBum Lee

J. Manuf. Sci. Eng. July 2024, 146(7): 070905. doi: https://doi.org/10.1115/1.4065314

Abstracts

View articletitled, Hole Edge Metrology and Inspection by Edge Diffractometry

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Topics: Diffraction , Diffraction patterns , Inspection , Metrology , Surface roughness , Geometry

Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation

Changheon Han, Heebum Chun, Jiho Lee, Fengfeng Zhou, Huitaek Yun, ChaBum Lee, Martin B.G. Jun

J. Manuf. Sci. Eng. July 2024, 146(7): 070906. doi: https://doi.org/10.1115/1.4065276

Abstracts

View articletitled, Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation

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Topics: Resolution (Optics) , Semiconductor wafers , Inspection

Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies

Fengfeng Zhou, Xingyu Fu, Siying Chen, Changheon Han, Martin B. G. Jun

J. Manuf. Sci. Eng. July 2024, 146(7): 070907. doi: https://doi.org/10.1115/1.4065523

Abstracts

View articletitled, Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies

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Topics: Fibers , Flaw detection , Interferometers , Semiconductor wafers , Leakage , Optical fiber , Refractive index , Wavelength

Wafer Edge Metrology and Inspection Technique Using Curved-Edge Diffractive Fringe Pattern Analysis

Kuan Lu, Zhikun Wang, Heebum Chun, ChaBum Lee

J. Manuf. Sci. Eng. July 2024, 146(7): 070908. doi: https://doi.org/10.1115/1.4065639

Abstracts

View articletitled, Wafer Edge Metrology and Inspection Technique Using Curved-Edge Diffractive Fringe Pattern Analysis

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Topics: Diffraction patterns , Imaging , Inspection , Metrology , Semiconductor wafers , Feature extraction , Particulate matter

Research Papers

Investigation of Fiber Orientation of Fused Filament Fabricated CFRP Composites via an External Magnetic Field

Haoran Zhang, Kaifeng Wang

J. Manuf. Sci. Eng. July 2024, 146(7): 071001. doi: https://doi.org/10.1115/1.4065354

Abstracts

View articletitled, Investigation of Fiber Orientation of Fused Filament Fabricated CFRP Composites via an External Magnetic Field

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Topics: Carbon reinforced plastics , Composite materials , Fibers , Magnetic fields , Nickel

Multi-Pass Laser Polishing of As-Built Directed Energy Deposition Surfaces

Arpan Patel, Samantha Webster, Jian Cao, Kornel Ehmann

J. Manuf. Sci. Eng. July 2024, 146(7): 071002. doi: https://doi.org/10.1115/1.4065361

Abstracts

View articletitled, Multi-Pass Laser Polishing of As-Built Directed Energy Deposition Surfaces

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Topics: Laser micro polishing , Lasers , Microhardness , Polishing , Surface roughness , Particulate matter , Heat , Laser beams

Warm Air Bending of AZ31B Sheets Based on an Online Local Contact Heating Method

Xu Wang, Tong Wen, Feng Liu, Yin Zhou

J. Manuf. Sci. Eng. July 2024, 146(7): 071003. doi: https://doi.org/10.1115/1.4065484

Abstracts

View articletitled, Warm Air Bending of AZ31B Sheets Based on an Online Local Contact Heating Method

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Topics: Finite element analysis , Heat transfer , Heating , Temperature , Thermomechanics

Digital Twin in Process Planning of the Additive and Subtractive Process Chain for Laser Metal Deposition and Micro Milling of Stainless Steel

Berend Denkena, Marcel Wichmann, Talash Malek, Hai Nam Nguyen, Makoto Kato, Kaito Isshiki, Ryo Koike, Yasuhiro Kakinuma

J. Manuf. Sci. Eng. July 2024, 146(7): 071004. doi: https://doi.org/10.1115/1.4065415

Abstracts

View articletitled, Digital Twin in Process Planning of the Additive and Subtractive Process Chain for Laser Metal Deposition and Micro Milling of Stainless Steel

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Topics: Additive manufacturing , Chain , Cutting , Digital twin , Geometry , Lasers , Machining , Milling , Production planning , Surface roughness

Influence of Mechanical Properties of Tube on Forming Limits and Deformation Characteristics in an Expansion Drawing Process

S. L. Zhang, T. Kuboki, M. Akiyama, S. Kajikawa

J. Manuf. Sci. Eng. July 2024, 146(7): 071005. doi: https://doi.org/10.1115/1.4065409

Abstracts

View articletitled, Influence of Mechanical Properties of Tube on Forming Limits and Deformation Characteristics in an Expansion Drawing Process

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Topics: Deformation , Finite element methods , Forming limit diagrams , Friction , Stress , Artificial neural networks

Non-Gaussian Multivariate Process Capability Based on the Copulas Method: An Application to Aircraft Engine Fan Blades

Cyprien Ferraris, Mohamed Achibi

J. Manuf. Sci. Eng. July 2024, 146(7): 071006. doi: https://doi.org/10.1115/1.4065456

Abstracts

View articletitled, Non-Gaussian Multivariate Process Capability Based on the Copulas Method: An Application to Aircraft Engine Fan Blades

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Topics: Aircraft engines , Approximation , Blades , Computation , Dimensions , Gaussian distribution , Simulation , Theorems (Mathematics) , Engineering simulation , Manufacturing

Surface Roughness Model of Ground 4H-SiC Considering Ductile and Brittle Removal

Hongyi Xiang, Haoxiang Wang, Renke Kang, Shang Gao

J. Manuf. Sci. Eng. July 2024, 146(7): 071007. doi: https://doi.org/10.1115/1.4065455

Abstracts

View articletitled, Surface Roughness Model of Ground 4H-SiC Considering Ductile and Brittle Removal

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Topics: Brittleness , Grinding , Semiconductor wafers , Silicon carbide , Surface roughness , Cutting , Grinding wheels

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Special Section: Semiconductor

Measurement of Thermal Field Temperature Distribution Inside Reaction Chamber for Epitaxial Growth of Silicon Carbide Layer

Classification of Chip-Level Defect Types in Wafer Bin Maps Using Only Wafer-Level Labels

Few-Shot Classification of Wafer Bin Maps Using Transfer Learning and Ensemble Learning

Auto-Labeling for Pattern Recognition of Wafer Defect Maps in Semiconductor Manufacturing

Hole Edge Metrology and Inspection by Edge Diffractometry

Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation

Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies

Wafer Edge Metrology and Inspection Technique Using Curved-Edge Diffractive Fringe Pattern Analysis

Research Papers

Investigation of Fiber Orientation of Fused Filament Fabricated CFRP Composites via an External Magnetic Field

Multi-Pass Laser Polishing of As-Built Directed Energy Deposition Surfaces

Warm Air Bending of AZ31B Sheets Based on an Online Local Contact Heating Method

Digital Twin in Process Planning of the Additive and Subtractive Process Chain for Laser Metal Deposition and Micro Milling of Stainless Steel

Influence of Mechanical Properties of Tube on Forming Limits and Deformation Characteristics in an Expansion Drawing Process

Non-Gaussian Multivariate Process Capability Based on the Copulas Method: An Application to Aircraft Engine Fan Blades

Surface Roughness Model of Ground 4H-SiC Considering Ductile and Brittle Removal

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