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Keywords: diamond
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2023, 145(7): 071006.
Paper No: MANU-22-1408
Published Online: March 21, 2023
...Song Yuan; Xiaoguang Guo; Hao Wang; Shang Gao Diamond has attracted extensive attention from many scholars due to its characteristics, whereas the high-efficiency and ultra-low damage machining regarding diamond is still a bottleneck restricting its applications. Herein, a new polishing equipment...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. January 2019, 141(1): 014504.
Paper No: MANU-18-1016
Published Online: November 26, 2018
... simulation has been carried out to analyze the process behavior and its effects on abrasive particles. After simulation, it is observed that the finishing force and velocity damage the abrasive particle by changing its phase from diamond cubic to graphite. Thus, the abrasive particles need replacement...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. August 2011, 133(4): 041012.
Published Online: August 11, 2011
...Jiaqing Wu; Weilong Cong; Robert E. Williams; Z. J. Pei Rotary ultrasonic machining (RUM) is a hybrid machining approach that combines two material removal mechanisms, namely, diamond grinding and ultrasonic machining. This paper presents the results of dynamic process modeling for RUM of alumina...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. April 2011, 133(2): 024504.
Published Online: March 25, 2011
...JiAn Duan; DeFu Liu The purpose of this paper is to reveal material removal mechanisms of optical fiber end-surface in lapping processes. The lapping process experiments are conducted using fixed diamond abrasive lapping films with various particle sizes of 6 μ m , 3 μ m , 1 μ m , and 0.5 μ m...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. June 2010, 132(3): 031003.
Published Online: April 29, 2010
... report the design and implementation of this new system. Experimental results demonstrate the effectiveness of the system and show that the microplasma can be used in various applications including localized etching of silicon and diamond and localized patterning of photoresist. The processing...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. December 2008, 130(6): 064501.
Published Online: October 9, 2008
...Chun-Hsi Su; Chii-Ruey Lin; Guo-Tsai Liau; Ching-Yu Chang Microwave plasma jet chemical vapor deposition is used to grow array types of carbon nanotubes and diamond films on silicon substrates. In this study, we report a patterned growth of carbon nanotubes and diamond films using the barrier layer...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. May 2005, 127(2): 277–279.
Published Online: April 25, 2005
... by the Manufacturing Engineering Division for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING . Manuscript received April 5, 2002; revised March 6, 2004. Associate Editor: M. Davies. 05 April 2002 06 March 2004 25 04 2005 boron compounds diamond cutting tools cutting...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. November 2004, 126(4): 760–765.
Published Online: February 4, 2005
...Masahiko Yoshino; Sivanandam Aravindan This paper reports on nanosurface fabrication of hard brittle materials by structured diamond tool imprinting. Ultrafine structured surfaces were fabricated on soda glass, firelite glass, quartz glass, quartz wafer, and silicon. A specially designed...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. August 2003, 125(3): 628–630.
Published Online: July 23, 2003
...J. M. Rodrı´guez Lelis; J. Colı´n Ocempo; J. Porcayo Caldero´n; J. M. Robles In the present work, it is shown that friction can be used to deposit diamond in a substrate of copper. Here it was found through electronic scan microscopy that a composite material film that varies from 27 to 30 microns...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. May 2001, 123(2): 319–324.
Published Online: July 1, 2000
...Albert J. Shih A new regulating wheel truing method for through-feed centerless grinding is presented. In conventional regulating wheel truing systems, a single-point diamond tool is traversed across the regulating wheel in a straight line. The interference between the regulating wheel...
Topics: Grinding, Wheels
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. February 2001, 123(1): 13–22.
Published Online: March 1, 2000
... with longer contact lengths. For sawing, the normal force per grain was nearly proportional to the calculated undeformed chip thickness. The G -ratios at different sawing rates reached a maximum value at the same intermediate undeformed chip thickness, which was attributed to a transition in the diamond wear...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. February 2000, 122(1): 32–41.
Published Online: June 1, 1999
...T. W. Hwang; C. J. Evans; E. P. Whitenton; S. Malkin, Distinguished Professor, Fellow of ASME, An investigation is reported on high speed grinding of silicon nitride using electroplated single-layer diamond wheels. This article is concerned with wheel wear and wheel life, and a second paper (ASME J...