1-7 of 7
Keywords: lapping (machining)
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. June 2011, 133(3): 031006.
Published Online: June 8, 2011
... machining (FAM) process are studied using a single-sided wafer-lapping machine. Under the same slurry density, a parametric experimental study employing different mixing ratios of large and small abrasive grits and various normal loadings on the wafer surface applied through a jig is conducted. Observations...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. April 2011, 133(2): 021012.
Published Online: March 23, 2011
... Engineering Mathematics , Harcourt/Academic , San Diego . 09 03 2010 27 01 2011 23 03 2011 23 03 2011 cutting Galerkin method Gaussian processes lapping (machining) manufacturing processes partial differential equations random noise sawing machines wire saw...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. June 2008, 130(3): 034504.
Published Online: June 3, 2008
... to obtain fiber connectors with 90% overall yield using two-step process. 16 10 2006 17 02 2008 03 06 2008 grinding lapping (machining) optical interconnections Surging demand for a wide variety of data and telecommunication services that use interconnection components...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. October 2007, 129(5): 961–964.
Published Online: March 9, 2007
... magnetorheological finishing deformed surface layer subsurface damage magnetic materials magnetorheology intelligent materials magnetic materials surface finishing grinding lapping (machining) surface roughness tungsten compounds cobalt 30 10 2006 09 03 2007 2007 American...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. June 2007, 129(3): 502–512.
Published Online: November 21, 2006
...Masahiro Mizuno; Toshirou Iyama; Susumu Sugawara; Bi Zhang A prototype lapping machine, which finishes surfaces by applying elliptical motions to a lapping tool in the presence of diamond compound, is developed. This paper describes the structure of the lapping machine, the 2-dimensional tool...
Topics: Grinding