Self-propagating exothermic reaction bonding (SERB) technique with Al/Ni multilayer film is fascinating in the viewpoint of lots of outstanding features, such as atmosphere-independent exothermic reaction and its self-propagation. The reactively bonded solder joints with high bonded strength are required for practical use in semiconductor devices. We have investigated the fracture strength of rectangular-solid specimens with reactively bonded solder joint (Sn–3.5Ag solder/reacted NiAl/Sn–3.5Ag solder) sandwiched by single crystal silicon (SCS). In this paper, the influence of bonding atmosphere on the fracture behavior is discussed by means of four-point bending testing and fracture surface observation. The fracture strength increases with increasing pressure load during bonding. The strength of the vacuum-bonded specimens is found to be higher than that of the air-bonded specimens. The fracture surface observation results suggest that Al oxide and intermetallic compounds (IMCs) formed at the reacted NiAl layer and the SnAg solder layer, respectively, would have affected the strength of the Al/Ni SERB joints.
Issue Section:
Research Papers
References
1.
Sakuyama
, S.
, 1999
, “Infrared Reflow Soldering Technology
,” J. Jpn. Inst. Electron. Packag.
, 2
(7
), pp. 561
–565
(in Japanese).2.
Rogachev
, A. S.
, Vadchenko
, S. G.
, Baras
, F.
, Politano
, O.
, Rouvimov
, S.
, Sachkova
, N. V.
, and Mukasyan
, A. S.
, 2014
, “Structure Evolution and Reaction Mechanism in the Ni/Al Reactive Multilayer Nanofoils
,” Acta Mater.
, 66
, pp. 86
–96
.3.
Wang
, J.
, Besnoin
, E.
, Duckham
, A.
, Spey
, S. J.
, Reiss
, M. E.
, Knio
, O. M.
, and Weihs
, T. P.
, 2004
, “Joining of Stainless-Steel Specimens With Nanostructured Al/Ni Foils
,” J. Appl. Phys.
, 95
(1
), pp. 248
–256
.4.
Wang
, L.
, He
, B.
, and Jiang
, X. H.
, 2010
, “Modeling the Velocity of Self-Propagating Exothermic Reactions in Multilayer Foils
,” Combust Sci. Technol.
, 182
(8
), pp. 1000
–1008
.5.
Jayaraman
, S.
, Knio
, O. M.
, Mann
, A. B.
, and Weihs
, T. P.
, 1999
, “Numerical Predictions of Oscillatory Combustion in Reactive Multilayers
,” J. Appl. Phys.
, 86
(2
), pp. 800
–809
.6.
Cao
, J.
, Song
, X. G.
, Wu
, L. Z.
, Qi
, J. L.
, and Feng
, J. C.
, 2012
, “Sputtering Deposition and Characterization of Zirconium Nitride and Oxynitride Films
,” Thin Solid Films
, 520
(9
), pp. 3532
–3538
.7.
Namazu
, T.
, Takemoto
, H.
, Fujita
, H.
, Nagai
, Y.
, and Inoue
, S.
, 2006
, “Self-Propagating Explosive Reactions in Nanostructured Al/Ni Multilayer Films as a Localized Heat Process Technique for MEMS
,” 19th IEEE
International Conference on Micro Electro Mechanical Systems
, Istanbul, Turkey, Jan. 22–26, pp. 286
–289
.8.
Fujita
, H.
, Namazu
, T.
, and Inoue
, S.
, 2007
, “MEMS Hermetic Package With Lead-Free Solder Film Line Heated by Al/Ni Exothermic Structure
,” 7th International Conference of Advanced Technology in Experimental Mechanics
, Paper No. OS05-3-1.9.
Namazu
, T.
, 2008
, “Micro/Nano-Materials for MEMS Applications—Al/Ni Exothermic Reactive Film as a Heat Source for MEMS Packaging
,” 16th Annual International Conference on Composites/Nano Engineering (ICCE-16)
, pp. 507
–510
.10.
Ohtani
, K.
, Yamano
, Y.
, Namazu
, T.
, and Inoue
, S.
, 2009
, “Strength Evaluation of Lead-Free Solder Joint Fabricated by Exothermic Film Local Heating
,” 15th International Conference on Solid-State Sensors, Actuators and Microsystems
, Denver, CO, June 21–25, pp. 172
–175
.11.
Namazu
, T.
, Ohtani
, K.
, Yoshiki
, K.
, and Inoue
, S.
, 2011
, “Crack Propagation Direction Control of Crack-Less Solder Bonding Using AlNi Flash Heating Technique
,” 16th International Conference on Solid-State Sensors, Actuators and Microsystems
, Beijing, June 5–9, pp. 1368
–1371
.12.
Namazu
, T.
, Ohtani
, K.
, Yoshiki
, K.
, and Inoue
, S.
, 2011
, “Crack-Less Wafer-Level Packaging Using Flash Heating Technique for Micro Devices
,” International Conference Processing and Manufacturing of Advanced Materials
, pp. 1979
–1983
.13.
Ito
, S.
, Morikaku
, T.
, Inoue
, S.
, and Namazu
, T.
, 2013
, “Influence of Bonded Area Size on Cracking in Reactive Soldering With Al/Ni Multilayer Films
,” 26th International Microprocesses and Nanotechnology Conference
, Paper No. 8P-11-109.14.
Miyake
, S.
, Kanetsuki
, S.
, Morino
, K.
, Kuroishi
, J.
, and Namazu
, T.
, 2014
, “Thermal Resistance Analysis of Solder Joints Fabricated by Self-Propagating Exothermic Reaction
,” 27th International Microprocesses and Nanotechnology Conference
, Paper No. 6P-7-93.15.
Namazu
, T.
, Ohtani
, K.
, Inoue
, S.
, and Miyake
, S.
, 2015
, “Influence of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints
,” ASME J. Eng. Mater. Technol.
, 137
(3
), p. 031011
.16.
Namazu
, T.
, Maruo
, N.
, and Inoue
, S.
, 2012
, “Influences of Film Composition and Annealing on the Mechanical and Electrical Properties of W-Mo Thin Films
,” J. Mater. Sci.
47
(6
), pp. 2725
–2730
.17.
Huurman
, M.
, and Pronk
, A. C.
, 2009
, “Theoretical Analysis of the 4 Point Bending Test
,” Advanced Testing and Characterization of Bituminous Materials
, Vol. 2, A
. Loizos.
, M. N
. Partl.
, T
. Scarpas.
, and I. L
. Al-Qadi.
, eds., CRC Press
, Boca Raton
, pp. 749
–760
.18.
Kim
, K. S.
, Huh
, S. H.
, and Suganuma
, K.
, 2003
, “Effect of Intermetallic Compounds on Properties of Sn–Ag–Cu Lead-Free Soldered Joints
,” J. Alloys Compd.
, 352
(1–2
), pp. 226
–236
.19.
Kim
, K. S.
, Huh
, S. H.
, and Suganuma
, K.
, 2003
, “Effects of Fourth Alloying Additive on Microstructures and Tensile Properties of Sn–Ag–Cu Alloy and Joints With Cu
,” Microelectron. Reliab.
, 43
(2
), pp. 259
–267
.20.
Chang
, T. C.
, Hon
, M. H.
, and Wang
, M. C.
, 2003
, “Intermetallic Compounds Formation and Interfacial Adhesion Strength of Sn–9Zn–0.5Ag Solder Alloy Hot-Dipped on Cu Substrate
,” J. Alloys Compd.
, 352
(1–2
), pp. 168
–174
.21.
Lee
, H. T.
, Chen
, M. H.
, Jao
, H. M.
, and Liao
, T. L.
, 2003
, “Influence of Interfacial Intermetallic Compound on Fracture Behavior of Solder Joints
,” Mater. Sci. Eng. A
, 358
(1–2
), pp. 134
–141
.22.
Lee
, H. T.
, and Chen
, M. H.
, 2002
, “Influence of Intermetallic Compounds on the Adhesive Strength of Solder Joints
,” Mater. Sci. Eng. A
, 333
(1–2
), pp. 24
–34
.23.
Jeong
, S.
, Murata
, N.
, Sato
, Y.
, Suzuki
, K.
, and Miura
, H.
, 2009
, “Effect of Copper-Tin Intermetallic Compound on Reliability of Fine Bump Joint Structures
,” J. Soc. Mater. Sci. Jpn.
, 58
(10
), pp. 827
–832
.24.
Jang
, G. Y.
, Lee
, J. W.
, and Duh
, J. G.
, 2004
, “The Nanoindentation Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds in the Solder Bump
,” J. Electron. Mater.
, 33
(10
), pp. 1103
–1110
.25.
Lucas
, J. P.
, Rhee
, H.
, Guo
, F.
, and Subramanian
, K. N.
, 2003
, “Mechanical Properties of Intermetallic Compounds Associated With Pb-Free Solder Joints Using Nanoindentation
,” J. Electron. Mater.
, 32
(12
), pp. 1375
–1383
.26.
Suganuma
, K.
, and Nakamura
, Y.
, 1995
, “Microstructure and Strength of Interface Between Sn–Ag Eutectic Solder and Cu
,” J. Jpn. Inst. Met.
, 59
(12
), pp. 1299
–1305
.27.
Suga
, T.
, 1992
, “The Feasibility of Room Temperature Joining
,” J. Jpn. Weld. Soc.
, 61
(2
), pp. 98
–106
(in Japanese).28.
Watanabe
, H.
, 2005
, “The Lead-Free Solder of Addition Micro-Elements in Industrial Products
,” J. Jpn. Inst. Electron. Packag.
, 8
(3
), pp. 183
–187
(in Japanese).29.
Hirose
, A.
, 2007
, “A Novel Bonding Process Using Ag Nanoparticles—Application to Electronics Assembly as Alternative to Microsoldering Using Lead-Rich Solders
,” J. Jpn. Weld. Soc.
, 76
(3
), pp. 163
–167
(in Japanese).30.
Yamashita
, M.
, Shiokawa
, K.
, and Ueda
, A.
, 2000
, “Evaluation Technology of Lead-Free Solders
,” Fuji Electric J.
, 73
(9
), pp. 483
–492
(in Japanese).Copyright © 2016 by ASME
You do not currently have access to this content.
