Plasmonic lithography may become a mainstream nanofabrication technique in the future. Experimental results show that feature size with 22 nm resolution can be achieved by plasmonic lithography. In the experiment, a plasmonic lens (PL) is used to focus the laser energy with resolution much higher than the diffraction limit and features are created in the thermally sensitive phase-change material (PCM) layer. The energy transport mechanisms are still not fully understood in the lithography process. In order to predict the lithography resolution and explore the energy transport mechanisms involved in the process, customized electromagnetic wave (EMW) and heat transfer (HT) models were developed in comsol. Parametric studies on both operating parameters and material properties were performed to optimize the lithography process. The parametric studies show that the lithography process can be improved by either reducing the thickness of the phase-change material layer or using a material with smaller real refractive index for that layer.
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September 2014
Research-Article
A Coupled Electromagnetic and Thermal Model for Picosecond and Nanometer Scale Plasmonic Lithography Process
Ion-Hong Chao,
Ion-Hong Chao
Mechanical and Aerospace Engineering Department,
e-mail: dennischao@ucla.edu
University of California
, Los Angeles,Los Angeles, CA 90024
e-mail: dennischao@ucla.edu
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Liang Pan,
Liang Pan
Mechanical Engineering Department,
e-mail: liangpan@purdue.edu
Purdue University
,West Lafayette, IN 47907
e-mail: liangpan@purdue.edu
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Cheng Sun,
Cheng Sun
Mechanical Engineering Department,
e-mail: c-sun@northwestern.edu
Northwestern University
,Evanston, IL 60208
e-mail: c-sun@northwestern.edu
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Xiang Zhang,
Xiang Zhang
Mechanical Engineering Department,
e-mail: xzhang@me.berkeley.edu
University of California
, Berkeley,Berkeley, CA 94709
e-mail: xzhang@me.berkeley.edu
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Adrienne S. Lavine
Adrienne S. Lavine
Mechanical and Aerospace Engineering Department,
e-mail: lavine@seas.ucla.edu
University of California
, Los Angeles,Los Angeles, CA 90024
e-mail: lavine@seas.ucla.edu
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Ion-Hong Chao
Mechanical and Aerospace Engineering Department,
e-mail: dennischao@ucla.edu
University of California
, Los Angeles,Los Angeles, CA 90024
e-mail: dennischao@ucla.edu
Liang Pan
Mechanical Engineering Department,
e-mail: liangpan@purdue.edu
Purdue University
,West Lafayette, IN 47907
e-mail: liangpan@purdue.edu
Cheng Sun
Mechanical Engineering Department,
e-mail: c-sun@northwestern.edu
Northwestern University
,Evanston, IL 60208
e-mail: c-sun@northwestern.edu
Xiang Zhang
Mechanical Engineering Department,
e-mail: xzhang@me.berkeley.edu
University of California
, Berkeley,Berkeley, CA 94709
e-mail: xzhang@me.berkeley.edu
Adrienne S. Lavine
Mechanical and Aerospace Engineering Department,
e-mail: lavine@seas.ucla.edu
University of California
, Los Angeles,Los Angeles, CA 90024
e-mail: lavine@seas.ucla.edu
Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MICRO- AND NANO-MANUFACTURING. Manuscript received March 1, 2014; final manuscript received April 30, 2014; published online July 8, 2014. Editor: Jian Cao.
J. Micro Nano-Manuf. Sep 2014, 2(3): 031003 (10 pages)
Published Online: July 8, 2014
Article history
Received:
March 1, 2014
Revision Received:
April 30, 2014
Citation
Chao, I., Pan, L., Sun, C., Zhang, X., and Lavine, A. S. (July 8, 2014). "A Coupled Electromagnetic and Thermal Model for Picosecond and Nanometer Scale Plasmonic Lithography Process." ASME. J. Micro Nano-Manuf. September 2014; 2(3): 031003. https://doi.org/10.1115/1.4027589
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