Search Results | ASME Digital Collection

1-20 of 44

2 3

Sort by

Sort Order Select

Proceedings Papers

Some Investigations on Flow Through Chevrons of Moisture Separator and Reheater Used in Nuclear Power Plants

V. Keshava Iyer, A. Dasgupta, B. Venkat Rao, R. Srivastava

Proc. ASME. IMECE97, Fluids Engineering, 381-386, November 16–21, 1997

Paper No: IMECE1997-0796

DOI: https://doi.org/10.1115/IMECE1997-0796

View Paper

Topics: Flow (Dynamics), Nuclear power stations, Molten salt reactors, Water, Air flow, Drops, Pressure drop, Probes, Internal flow, Iron

Proceedings Papers

A Generalized Laminate Model for Electro-Mechanical Plates and Shells

C. S. Sealing, A. Dasgupta

Proc. ASME. IMECE2000, Adaptive Structures and Material Systems, 165-172, November 5–10, 2000

Paper No: IMECE2000-1702

DOI: https://doi.org/10.1115/IMECE2000-1702

View Paper

Topics: Laminates, Plates (structures), Shells, Finite element analysis, Electric fields, Materials properties

Proceedings Papers

Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects

J. H. Okura, A. Dasgupta, J. F. J. M. Caers

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 145-151, November 5–10, 2000

Paper No: IMECE2000-2256

DOI: https://doi.org/10.1115/IMECE2000-2256

View Paper

Topics: Durability, Failure mechanisms, Absorption, Cracking (Materials), Diffusion (Physics), Engineering simulation, Finite element analysis, Fracture (Process), Intermetallic compounds, Life testing

Proceedings Papers

Bond Strength Models for Adhesively Bonded Flip-Chip Interconnects

K. Sinha, A. Dasgupta, J. Caers

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 447-457, November 9–15, 2012

Paper No: IMECE2012-89442

DOI: https://doi.org/10.1115/IMECE2012-89442

View Paper

Topics: Bond strength, Flip-chip

Journal Articles

Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta

J. Electron. Packag. December 2011, 133(4): 041012.

DOI: https://doi.org/10.1115/1.4005091

Published Online: December 9, 2011

View Article

Topics: Damping, Finite element analysis, Modeling, Printed circuit boards, Shock (Mechanics), Manufacturing, Simulation, Simulation results, Cycles, Materials properties

Journal Articles

Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results

A. F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta

J. Electron. Packag. December 2011, 133(4): 041010.

DOI: https://doi.org/10.1115/1.4005090

Published Online: December 9, 2011

View Article

Topics: Printed circuit boards, Shock (Mechanics), Manufacturing

Proceedings Papers

Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects

Y. Zhou, M. Al-Bassyiouni, A. Dasgupta

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 143-148, July 19–23, 2009

Paper No: InterPACK2009-89178

DOI: https://doi.org/10.1115/InterPACK2009-89178

View Paper

Topics: Accelerometers, Approximation, Bending (Stress), Damage, Durability, Fatigue, Finite element analysis, Manufacturing, Printed circuit boards, Random excitation

Proceedings Papers

Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems

F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta, S. Tolchinsky, J. Crystal

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 149-154, July 19–23, 2009

Paper No: InterPACK2009-89179

DOI: https://doi.org/10.1115/InterPACK2009-89179

View Paper

Topics: Electronic systems, Modeling, Shock (Mechanics), Simulation, Dynamic response, Batteries, Plastic housings, Circuits, Design, Dynamic testing (Materials)

Proceedings Papers

Test Methodologies for Power Cycling Experiment

K. Sinha, M. Al-Bassyiouni, P. Hansen, A. Dasgupta, P. McCluskey, R. Beaupre, J. Jacobsen

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 35-44, November 13–19, 2009

Paper No: IMECE2009-11074

DOI: https://doi.org/10.1115/IMECE2009-11074

View Paper

Topics: Computer software, Cooling systems, Cycles, Durability, Electronics, Hardware, Heat, Junctions, Semiconductor devices, Stress

Proceedings Papers

Cold Welding Phenomenon in Adhesively Bonded Flip-Chip Interconnects

K. Sinha, D. Farley, T. Kahnert, S. Solares, A. Dasgupta, J. F. J. Caers, X. J. Zhao

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 29-34, November 13–19, 2009

Paper No: IMECE2009-12650

DOI: https://doi.org/10.1115/IMECE2009-12650

View Paper

Topics: Flip-chip, Welding, Temperature, Adhesives, Bonding, Low temperature, Modeling, Bond strength, Compression, Cycles

Proceedings Papers

System-Level Reliability Qualification of Complex Electronic Systems

D. Farley, A. Dasgupta, M. Al-Bassyiouni, J. W. C. de Vries

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 231-237, November 13–19, 2009

Paper No: IMECE2009-11762

DOI: https://doi.org/10.1115/IMECE2009-11762

View Paper

Topics: Electronic systems, Reliability, Cycles, Durability, Failure mechanisms, Simulation, Failure, Stress, Accelerometers, Engineering standards

Proceedings Papers

SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions

G. Plaza, Y. Zhou, M. Osterman, A. Dasgupta

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 515-521, July 8–12, 2007

Paper No: IPACK2007-33095

DOI: https://doi.org/10.1115/IPACK2007-33095

View Paper

Topics: Durability, Temperature, Vibration, Solders, Damage, Finite element analysis, High cycle fatigue, Printed circuit boards, Electrical wires, Excitation

Proceedings Papers

Mechanical Strength of Copper-Silicon Interface of Planar Metallization Power Modules

K. Sinha, A. Dasgupta, R. Beaupre, A. Gowda

Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 87-93, October 31–November 6, 2008

Paper No: IMECE2008-67367

DOI: https://doi.org/10.1115/IMECE2008-67367

View Paper

Topics: Copper, Silicon, Strength (Materials), Stress, Delamination, Risk, Thermomechanics, Adhesion, Degrees of freedom, Failure mechanisms

Proceedings Papers

Partitioned Cyclic Fatigue Damage Evolution Model for PB-Free Solder Materials

Leila J. Ladani, A. Dasgupta

Proc. ASME. PVP2007, Volume 9: Eighth International Conference on Creep and Fatigue at Elevated Temperatures, 119-125, July 22–26, 2007

Paper No: CREEP2007-26306

DOI: https://doi.org/10.1115/CREEP2007-26306

View Paper

Topics: Constitutive equations, Damage, Fatigue damage, Lead-free solders, Stress, Creep, Deformation, Dislocations, Microscale devices, Diffusion (Physics)

Proceedings Papers

An Analytic Model for PTH/PWB Stress Due to Three-Dimensional Forces Generated by Symmetric Compliant-Pins

S. Roettele, A. Dasgupta

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 407-411, November 11–15, 2007

Paper No: IMECE2007-43491

DOI: https://doi.org/10.1115/IMECE2007-43491

View Paper

Topics: Pins (Engineering), Printed circuit boards, Stress, Design, Geometry, Construction, Deformation, Fourier series, Friction, Materials properties

Proceedings Papers

Qualification of SiP Products: Quasi-Static Cyclic Mechanical Bending

D. Farley, Y. Zhou, A. Dasgupta, J. F. J. Caers, J. W. C. de Vries

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 451-458, November 11–15, 2007

Paper No: IMECE2007-43898

DOI: https://doi.org/10.1115/IMECE2007-43898

View Paper

Topics: Bending (Stress), Design, Engineering simulation, Epoxy adhesives, Epoxy resins, Failure, Failure analysis, Failure mechanisms, Fatigue, Flip-chip

Proceedings Papers

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

J. Varghese, A. Dasgupta

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 845-848, July 17–22, 2005

Paper No: IPACK2005-73014

DOI: https://doi.org/10.1115/IPACK2005-73014

View Paper

Topics: Electrical wires, Failure, Testing, Durability, Intermetallic compounds, Solders, Damage, Surface mount packaging, Brittleness, Deformation

Journal Articles

Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation

Y. Zhou, M. Al-Bassyiouni, A. Dasgupta

J. Electron. Packag. March 2009, 131(1): 011016.

DOI: https://doi.org/10.1115/1.3078195

Published Online: February 25, 2009

View Article

Topics: Durability, Excitation, Fatigue, Printed circuit boards, Solders, Vibration, Finite element analysis, Failure

Proceedings Papers

Flow Studies on a Centrifugal Compressor Stage With Low Solidity Diffuser Vanes

Prasad Mukkavilli, G. Rama Raju, A. Dasgupta, G. V. Ramana Murty, K. V. Jagadeshwar Chary

Proc. ASME. GT2002, Volume 5: Turbo Expo 2002, Parts A and B, 587-595, June 3–6, 2002

Paper No: GT2002-30386

DOI: https://doi.org/10.1115/GT2002-30386

View Paper

Topics: Compressors, Diffusers, Flow (Dynamics)

Proceedings Papers

Test Methodology for Impact Testing of Portable Electronic Products

J. Varghese, A. Dasgupta

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 71-77, November 15–21, 2003

Paper No: IMECE2003-41844

DOI: https://doi.org/10.1115/IMECE2003-41844

View Paper

Topics: Damage, Electronic products, Impact testing, Testing

2 3

Journal citation

NARROW

Some Investigations on Flow Through Chevrons of Moisture Separator and Reheater Used in Nuclear Power Plants

A Generalized Laminate Model for Electro-Mechanical Plates and Shells

Effect of Moisture on Durability of Flip-Chip-on-Board (FCOB) Interconnects

Bond Strength Models for Adhesively Bonded Flip-Chip Interconnects

Shock and Dynamic Loading in Portable Electronic Assemblies: Modeling and Simulation Results

Shock and Dynamic Loading in Portable Electronic Assemblies: Experimental Results

Sources of Fatigue in Random-Vibration Durability of Surface Mount Interconnects

Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems

Test Methodologies for Power Cycling Experiment

Cold Welding Phenomenon in Adhesively Bonded Flip-Chip Interconnects

System-Level Reliability Qualification of Complex Electronic Systems

SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions

Mechanical Strength of Copper-Silicon Interface of Planar Metallization Power Modules

Partitioned Cyclic Fatigue Damage Evolution Model for PB-Free Solder Materials

An Analytic Model for PTH/PWB Stress Due to Three-Dimensional Forces Generated by Symmetric Compliant-Pins

Qualification of SiP Products: Quasi-Static Cyclic Mechanical Bending

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation

Flow Studies on a Centrifugal Compressor Stage With Low Solidity Diffuser Vanes

Test Methodology for Impact Testing of Portable Electronic Products

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only