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Proceedings Papers

Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints

Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A003, October 25–27, 2022

Paper No: IPACK2022-94505

DOI: https://doi.org/10.1115/IPACK2022-94505

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Topics: Anisotropy, Crystals, Electron backscatter diffraction, Shear (Mechanics), Solder joints

Proceedings Papers

Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods

David Leslie, Abhijit Dasgupta, Andrei Damian

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 25–27, 2022

Paper No: IPACK2022-97363

DOI: https://doi.org/10.1115/IPACK2022-97363

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Topics: Creep, Silver

Proceedings Papers

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 25–27, 2022

Paper No: IPACK2022-97382

DOI: https://doi.org/10.1115/IPACK2022-97382

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Topics: Durability, Failure, Domes (Structural elements), Cantilever beams, Disks, Silver, Additive manufacturing, Bending (Stress), Clamps (Tools), Damage

Proceedings Papers

Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods

Beihan Zhao, Aniket Ajitkumar Bharamgonda, Eric Jennings, Robert G. Utter, Michael Osterman, Michael H. Azarian, Siddhartha Das, Abhijit Dasgupta, Jason Fleischer, Edwin Quinn, Daniel Hines

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A001, October 25–27, 2022

Paper No: IPACK2022-92306

DOI: https://doi.org/10.1115/IPACK2022-92306

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Topics: Aerosols, Drops, Electronics, Silver, Temperature, Testing, Water

Proceedings Papers

Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics

Beihan Zhao, Christopher Riso, David Leslie, Abhijit Dasgupta, Siddhartha Das, Jason Fleischer, Daniel Hines

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 26–28, 2021

Paper No: IPACK2021-73197

DOI: https://doi.org/10.1115/IPACK2021-73197

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Topics: Aerosols, Electronics, Finite element methods, Finite element model, Modeling, Printing, Silver, Temperature

Proceedings Papers

Mechanical Behavior of Heat Activated Film Adhesives

Prabhat Janamanchi, Abhijit Dasgupta, Narendra Singh

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 26–28, 2021

Paper No: IPACK2021-69719

DOI: https://doi.org/10.1115/IPACK2021-69719

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Topics: Adhesives, Heat, Mechanical behavior, Mechanical properties, Phase transitions

Proceedings Papers

Durability Properties Characterization of Sn62Pb36Ag2 Solder Alloy

Peter Haswell, Abhijit Dasgupta

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 181-187, November 5–10, 2000

Paper No: IMECE2000-2261

DOI: https://doi.org/10.1115/IMECE2000-2261

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Topics: Alloys, Durability, Solders, Damage, Failure, Cycles, Displacement, Shear (Mechanics), Temperature, Tin

Proceedings Papers

Thermomechanical Durability of High I/O BGA Packages

Pavan Davuluri, Abhijit Dasgupta, Steven Young

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 121-127, November 5–10, 2000

Paper No: IMECE2000-2253

DOI: https://doi.org/10.1115/IMECE2000-2253

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Topics: Ball-Grid-Array packages, Durability, Thermomechanics, Ball-Grid-Array packaging, Solder joints, Failure, Solders, Cycles, Damage, Failure data

Proceedings Papers

Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling

Pradeep Sharma, Abhijit Dasgupta

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 173-179, November 5–10, 2000

Paper No: IMECE2000-2260

DOI: https://doi.org/10.1115/IMECE2000-2260

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Topics: Creep, Damage, Fatigue, Micromechanics (Engineering), Solders, Tin, Stress, Aeroelasticity, Damage mechanics, Fatigue damage

Journal Articles

Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints

Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta, Ulrich Becker

J. Electron. Packag. September 2022, 144(3): 031006.

Paper No: EP-21-1025

DOI: https://doi.org/10.1115/1.4051647

Published Online: September 15, 2021

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Topics: Damage, Durability, Fatigue, Shear (Mechanics), Solder joints, Solders, Stress, Finite element analysis, Fatigue damage, Hydrostatics

Proceedings Papers

A Fiber Optic Conjugate-Stress Sensor for Prognostic Health Monitoring of Fatigue

Jonathan Kordell, Miao Yu, Abhijit Dasgupta

Proc. ASME. SMASIS2020, ASME 2020 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, V001T05A011, September 15, 2020

Paper No: SMASIS2020-2424

DOI: https://doi.org/10.1115/SMASIS2020-2424

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Topics: Fatigue, Fibers, Sensors, Stress

Journal Articles

Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink

Neil Dalal, Yuan Gu, Guang Chen, Daniel R. Hines, Abhijit Dasgupta, Siddhartha Das

J. Electron. Packag. March 2020, 142(1): 011012.

Paper No: EP-19-1002

DOI: https://doi.org/10.1115/1.4044960

Published Online: November 14, 2019

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Topics: Aerosols, Electrical conductivity, Flow (Dynamics), Gas flow, Inks, Magnification, Nanoparticles, Printing, Silver, Agglomeration (Materials)

Includes: Supplementary data

Proceedings Papers

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Hao Huang, Qian Jiang, Abhijit Dasgupta, Ehsan Mirbagheri, Krishna Darbha

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018

Paper No: IPACK2018-8345

DOI: https://doi.org/10.1115/IPACK2018-8345

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Topics: Adhesives, Creep, Pressure, Stress, Bonding, Hydrostatics, Temperature, Cavitation, Cavities, Design

Proceedings Papers

Jingshi Meng, Abhijit Dasgupta

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A042, July 6–9, 2015

Paper No: IPACK2015-48669

DOI: https://doi.org/10.1115/IPACK2015-48669

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Topics: Failure mechanisms, Resonance, Reflection, Stress, Circuits, Diluents, Disperse systems, Electrical wires, Impulse (Physics), Microelectromechanical systems

Proceedings Papers

Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders

Qian Jiang, Subhasis Mukherjee, Bastian Vogt, Abhijit Dasgupta, David Shaddock, Liang Yin

Paper No: IPACK2015-48708

DOI: https://doi.org/10.1115/IPACK2015-48708

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Topics: High temperature, Solders, Temperature, Stress, Creep, Equipment performance, Mechanical properties, Melting, Wire

Journal citation

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Supplemental Material

Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints

Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods

Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics

Mechanical Behavior of Heat Activated Film Adhesives

Durability Properties Characterization of Sn62Pb36Ag2 Solder Alloy

Thermomechanical Durability of High I/O BGA Packages

Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling

Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints

A Fiber Optic Conjugate-Stress Sensor for Prognostic Health Monitoring of Fatigue

Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

Electroplated Connections Between Carbon Fiber and Nickel

Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies

Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High-Frequency “Breathing Mode” Deformations in the Printed Wiring Board

Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency

Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders

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