1-20 of 29
Amip J. Shah
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Design of a Mobility Mechanism for a Rescue and Surveillance Vehicle

Amip J. Shah, Michael L. Resciniti
Proc. ASME. IMECE2001, Mechanical Engineering Design Education: Issues and Case Studies, 165-173, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/DE-25114
https://doi.org/10.1115/IMECE2001/DE-25114
View Paper titled, Design of a Mobility Mechanism for a Rescue and Surveillance Vehicle
Open the PDF for Design of a Mobility Mechanism for a Rescue and Surveillance Vehicle in another window
Topics: Design, Mechanical admittance, Surveillance, Vehicles
Journal Articles

Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers

David J. Lettieri, Michael M. Toulouse, Cullen E. Bash, Amip J. Shah, Van P. Carey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030903.
Paper No: EP-12-1090
https://doi.org/10.1115/1.4024302
Published Online: July 24, 2013
View Article titled, Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers
Open the PDF for Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers in another window
Topics: Buoyancy, Computational fluid dynamics, Data centers, Flow (Dynamics), Temperature, Vortices, Server racks, Approximation
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041009.
https://doi.org/10.1115/1.4007744
Published Online: November 26, 2012
View Article titled, From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
Open the PDF for From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency in another window
Topics: Cooling, Data centers, Heat sinks, Leakage, Temperature, Energy consumption, Heat
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Brandon Rubenstein, Scot Heath, Niru Kumari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041006.
https://doi.org/10.1115/1.4007110
Published Online: October 30, 2012
View Article titled, From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
Open the PDF for From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency in another window
Topics: Containment, Data centers, Heat, Heat sinks, Temperature, Air flow
Proceedings Papers

Quantifying Equilibria Shifts due to Externalities

Kiara Corrigan, Amip J. Shah
Proc. ASME. ES2011, ASME 2011 5th International Conference on Energy Sustainability, Parts A, B, and C, 925-933, August 7–10, 2011
Publisher: American Society of Mechanical Engineers
Paper No: ES2011-54828
https://doi.org/10.1115/ES2011-54828
View Paper titled, Quantifying Equilibria Shifts due to Externalities
Open the PDF for Quantifying Equilibria Shifts due to Externalities in another window
Topics: Carbon, Chain, Elasticity, Equilibrium (Physics), Modeling, Supply and demand, Supply chains, Sustainability, Valuation
Proceedings Papers

Evaluating Supply Chain Energy Use in a Smart Grid Paradigm

Amip J. Shah, Kiara Corrigan
Proc. ASME. ES2011, ASME 2011 5th International Conference on Energy Sustainability, Parts A, B, and C, 1541-1551, August 7–10, 2011
Publisher: American Society of Mechanical Engineers
Paper No: ES2011-54827
https://doi.org/10.1115/ES2011-54827
View Paper titled, Evaluating Supply Chain Energy Use in a Smart Grid Paradigm
Open the PDF for Evaluating Supply Chain Energy Use in a Smart Grid Paradigm in another window
Topics: Energy consumption, Smart grids, Supply chains, Chain, Approximation, Computers, Data collection, Manufacturing, Optimization, Uncertainty
Proceedings Papers

On the Need for Energy Efficiency Metrics That Span Integrated IT-Facility Infrastructures

Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader, Thomas J. Breen, Ed J. Walsh, Jeff Punch
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 541-551, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52140
https://doi.org/10.1115/IPACK2011-52140
View Paper titled, On the Need for Energy Efficiency Metrics That Span Integrated IT-Facility Infrastructures
Open the PDF for On the Need for Energy Efficiency Metrics That Span Integrated IT-Facility Infrastructures in another window
Topics: Energy efficiency, Data centers, Energy consumption, Traction
Proceedings Papers

Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Niru Kumari, Cullen E. Bash, Scot Heath, Brandon Rubenstein
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 553-563, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52141
https://doi.org/10.1115/IPACK2011-52141
View Paper titled, Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency
Open the PDF for Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency in another window
Topics: Data centers, Energy efficiency, Uncertainty, Stress, Temperature, Design, Experimental analysis, Flow (Dynamics), Air flow, Compressors
Proceedings Papers

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 433-442, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52030
https://doi.org/10.1115/IPACK2011-52030
View Paper titled, From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency
Open the PDF for From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency in another window
Topics: Cooling, Cooling towers, Data centers, Energy efficiency, Leakage, Modeling, Operating temperature, Energy consumption, Heat, Accounting
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy

Ed J. Walsh, Thomas J. Breen, Jeff Punch, Amip J. Shah, Cullen E. Bash
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
https://doi.org/10.1115/1.4004657
Published Online: September 21, 2011
View Article titled, From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy
Open the PDF for From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy in another window
Topics: Cooling, Cooling towers, Data centers, Heat sinks, Temperature, Temperature control, Modeling, Thermal resistance, Flow (Dynamics)
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011004.
https://doi.org/10.1115/1.4003274
Published Online: March 9, 2011
View Article titled, From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet
Open the PDF for From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet in another window
Topics: Cooling, Cooling towers, Data centers, Temperature, Cooling systems, Heat, Modeling, Flow (Dynamics)
Proceedings Papers

From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Brandon Rubenstein, Scot Heath, Niru Kumari
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10074, March 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJTEC2011-44091
https://doi.org/10.1115/AJTEC2011-44091
View Paper titled, From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
Open the PDF for From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency in another window
Topics: Containment, Cooling towers, Data centers, Modeling, Energy efficiency, Cooling systems, Air flow, Computers, Temperature, Cooling
Proceedings Papers

Integrated Design and Management of a Sustainable Data Center

Brian J. Watson, Amip J. Shah, Manish Marwah, Cullen E. Bash, Ratnesh K. Sharma, Christopher E. Hoover, Tom W. Christian, Chandrakant D. Patel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 635-644, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89032
https://doi.org/10.1115/InterPACK2009-89032
View Paper titled, Integrated Design and Management of a Sustainable Data Center
Open the PDF for Integrated Design and Management of a Sustainable Data Center in another window
Topics: Data centers, Design, Sustainability, Blocks (Building materials), Collaboration, Visualization
Proceedings Papers

An Exergy-Based Framework for Assessing Sustainability of IT Systems

Amip J. Shah, Milton Meckler
Proc. ASME. ES2009, ASME 2009 3rd International Conference on Energy Sustainability, Volume 1, 823-832, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: ES2009-90028
https://doi.org/10.1115/ES2009-90028
View Paper titled, An Exergy-Based Framework for Assessing Sustainability of IT Systems
Open the PDF for An Exergy-Based Framework for Assessing Sustainability of IT Systems in another window
Topics: Exergy, Sustainability, Boundary-value problems, Cycles, Life cycle assessment, Thermodynamics
Proceedings Papers

Use of Thermodynamics, Engineering Economics and Probabilistic Risk Assessment in Evaluating Climate Change Decisions

Milton Meckler, Amip J. Shah
Proc. ASME. IMECE2009, Volume 8: Engineering to Address Climate Change; Sustainable Products and Processes, 27-34, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-10182
https://doi.org/10.1115/IMECE2009-10182
View Paper titled, Use of Thermodynamics, Engineering Economics and Probabilistic Risk Assessment in Evaluating Climate Change Decisions
Open the PDF for Use of Thermodynamics, Engineering Economics and Probabilistic Risk Assessment in Evaluating Climate Change Decisions in another window
Topics: Climate change, Engineering economy, Probabilistic risk assessment, Thermodynamics, Design, Power stations, Cogeneration plants, Electric power generation, Electricity (Physics), Electronic systems
Proceedings Papers

Exergy-Based Environmental Design of a Computer Room Air Conditioning Unit

David J. Lettieri, Amip J. Shah, Van P. Carey
Proc. ASME. IMECE2009, Volume 6: Emerging Technologies: Alternative Energy Systems; Energy Systems: Analysis, Thermodynamics and Sustainability, 411-420, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11461
https://doi.org/10.1115/IMECE2009-11461
View Paper titled, Exergy-Based Environmental Design of a Computer Room Air Conditioning Unit
Open the PDF for Exergy-Based Environmental Design of a Computer Room Air Conditioning Unit in another window
Topics: Air conditioning, Computers, Design, Exergy, Data centers, Energy consumption, Manufacturing, Raw materials, Transportation systems
Journal Articles

Exergo-Thermo-Volumes: An Approach for Environmentally Sustainable Thermal Management of Energy Conversion Devices

Amip J. Shah, Chandrakant D. Patel
Journal: Journal of Energy Resources Technology
Publisher: ASME
Article Type: Research Papers
J. Energy Resour. Technol. June 2010, 132(2): 021002.
https://doi.org/10.1115/1.4001569
Published Online: May 17, 2010
View Article titled, Exergo-Thermo-Volumes: An Approach for Environmentally Sustainable Thermal Management of Energy Conversion Devices
Open the PDF for Exergo-Thermo-Volumes: An Approach for Environmentally Sustainable Thermal Management of Energy Conversion Devices in another window
Topics: Cooling, Design, Energy conversion, Exergy, Fuel cells, Heat, Sustainability, Thermal management, Energy consumption, Cycles
Proceedings Papers

Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages

Jason M. Brand, Salvatore A. Ruggero, Amip J. Shah
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 887-894, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33044
https://doi.org/10.1115/IPACK2007-33044
View Paper titled, Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages
Open the PDF for Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages in another window
Topics: Cavities, Compression, Deformation, Packaging, Vehicles
Proceedings Papers

Optimization of Thermoelectric Modules for Computer System Thermal Management and Infrastructure Energy Efficiency

Amip J. Shah, Anita Rogacs, Chandrakant D. Patel
Proc. ASME. HT2008, Heat Transfer: Volume 2, 653-662, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56210
https://doi.org/10.1115/HT2008-56210
View Paper titled, Optimization of Thermoelectric Modules for Computer System Thermal Management and Infrastructure Energy Efficiency
Open the PDF for Optimization of Thermoelectric Modules for Computer System Thermal Management and Infrastructure Energy Efficiency in another window
Topics: Computers, Energy efficiency, Optimization, Thermal management, Cooling, Data centers, Density, Energy consumption, Temperature, Compacting
Proceedings Papers

Designing Environmentally Sustainable Electronic Cooling Systems Using Exergo-Thermo-Volumes

Amip J. Shah, Chandrakant D. Patel
Proc. ASME. ES2008, ASME 2008 2nd International Conference on Energy Sustainability, Volume 1, 19-27, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: ES2008-54089
https://doi.org/10.1115/ES2008-54089
View Paper titled, Designing Environmentally Sustainable Electronic Cooling Systems Using Exergo-Thermo-Volumes
Open the PDF for Designing Environmentally Sustainable Electronic Cooling Systems Using Exergo-Thermo-Volumes in another window
Topics: Computer cooling, Design, Sustainability, Exergy, Cooling, Entropy, Energy consumption, Engineers, Flow (Dynamics), Fluid dynamics