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Journal Articles

Experimental Investigation for Flow Regime Identification Using Probability Density Function of Void Fraction Signals

Min-Song Lin, Shao-Wen Chen, Feng-Jiun Kuo, Yen-Shih Cheng, Pei-Syuan Ruan, Yon-Min Hsu, Jin-Der Lee, Bau-Shei Pei
Journal: Journal of Fluids Engineering
Article Type: Research-Article
J. Fluids Eng. June 2020, 142(6): 061404.
Paper No: FE-19-1567
DOI: https://doi.org/10.1115/1.4046372
Published Online: March 5, 2020
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Topics: Density, Flow (Dynamics), Porosity, Probability, Signals, Transients (Dynamics), Two-phase flow, Slug flows
Proceedings Papers

Power Uprate Impact Evaluations on Waste Heat of Nuclear Power Plants in Taiwan

Jinn-Jer Peir, Chun-Kuan Shih, Bau-Shei Pei, Yuh-Ming Ferng, Wen-Sheng Hsu
Proc. ASME. ICONE17, Volume 1: Plant Operations, Maintenance, Engineering, Modifications and Life Cycle; Component Reliability and Materials Issues; Next Generation Systems, 201-207, July 12–16, 2009
Paper No: ICONE17-75885
DOI: https://doi.org/10.1115/ICONE17-75885
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Topics: Nuclear power stations, Power uprate, Waste heat, Water, Temperature, Water temperature, Boiling water reactors, Coolants, Economics , Measurement uncertainty
Proceedings Papers

CFD Investigating the Changes of FAC Wear Sites Due to the Power Uprate of Nuclear Power Plant

Tsun Fu Hung, Yuh Ming Ferng, Bing Hong Lin, Chunkuan Shih, Bau-Shei Pei
Proc. ASME. ICONE17, Volume 5: Fuel Cycle and High and Low Level Waste Management and Decommissioning; Computational Fluid Dynamics (CFD), Neutronics Methods and Coupled Codes; Instrumentation and Control, 229-237, July 12–16, 2009
Paper No: ICONE17-75049
DOI: https://doi.org/10.1115/ICONE17-75049
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Topics: Computational fluid dynamics, Nuclear power stations, Power uprate, Wear, Boiling water reactors, Simulation results, Two-phase flow, Computation, Corrosion, Flow (Dynamics)
Journal Articles

Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection

Yung-Shin Tseng, Tzu-Chen Hung, Bau-Shei Pei
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011006.
DOI: https://doi.org/10.1115/1.2837524
Published Online: January 31, 2008
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Topics: Computational fluid dynamics, Cooling, Heat transfer, Natural convection, Temperature, Flow (Dynamics), Thermal resistance, Computer cooling, Simulation
Journal Articles

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

Yen-Shu Chen, Kuo-Hsiang Chien, Chi-Chuan Wang, Tzu-Chen Hung, Yuh-Ming Ferng, Bau-Shei Pei
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 348–355.
DOI: https://doi.org/10.1115/1.2753970
Published Online: December 19, 2006
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Topics: Heat, Heat conduction, Plates (structures), Temperature, Temperature distribution, Thermal resistance, Vapors, Heat transfer, Flat heat pipes, Computer simulation