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Proceedings Papers

A Study on Digital Twin for Autonomous Robotic Chip Removal Deep Learning Framework on CNC Machine

Changheon Han, Hojun Lee, Jiho Lee, Martin Byung-Guk Jun, Huitaek Yun
Proc. ASME. MSEC2024, Volume 1: Additive Manufacturing; Advanced Materials Manufacturing; Biomanufacturing; Life Cycle Engineering, V001T02A003, June 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2024-124383
https://doi.org/10.1115/MSEC2024-124383
View Paper titled, A Study on Digital Twin for Autonomous Robotic Chip Removal Deep Learning Framework on CNC Machine
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Topics: Computer numerical control machine tools, Deep learning, Digital twin, Machinery, Robotics, Virtual reality, Algorithms, Machining, Computers, Coolants
Journal Articles

Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies

Fengfeng Zhou, Xingyu Fu, Siying Chen, Changheon Han, Martin B. G. Jun
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070907.
Paper No: MANU-23-1611
https://doi.org/10.1115/1.4065523
Published Online: June 3, 2024
View Article titled, Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies
Open the PDF for Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies in another window
Topics: Fibers, Flaw detection, Interferometers, Semiconductor wafers, Leakage, Optical fiber, Refractive index, Wavelength
Journal Articles

Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation

Changheon Han, Heebum Chun, Jiho Lee, Fengfeng Zhou, Huitaek Yun, ChaBum Lee, Martin B.G. Jun
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070906.
Paper No: MANU-23-1591
https://doi.org/10.1115/1.4065276
Published Online: May 9, 2024
View Article titled, Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation
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Topics: Resolution (Optics), Semiconductor wafers, Inspection
Proceedings Papers

Stroboscopic Data-Driven, Integrated, and Intelligent Machine Learning-Based Algorithms for Semiconductor Wafer Inspection

Changheon Han, Heebum Chun, ChaBum Lee, Martin Byung-Guk Jun
Proc. ASME. MSEC2023, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T09A003, June 12–16, 2023
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2023-101213
https://doi.org/10.1115/MSEC2023-101213
View Paper titled, Stroboscopic Data-Driven, Integrated, and Intelligent Machine Learning-Based Algorithms for Semiconductor Wafer Inspection
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Topics: Algorithms, Computers, Inspection, Intelligent machines, Machine learning, Manufacturing, Semiconductor wafers, Particulate matter, Machinery, Human factors
Journal Articles

Autonomous Robotic Bin Picking Platform Generated From Human Demonstration and YOLOv5

Jinho Park, Changheon Han, Martin B. G. Jun, Huitaek Yun
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. December 2023, 145(12): 121006.
Paper No: MANU-22-1685
https://doi.org/10.1115/1.4063107
Published Online: August 28, 2023
View Article titled, Autonomous Robotic Bin Picking Platform Generated From Human Demonstration and YOLOv5
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Topics: Algorithms, Grasping, Robotics, Robots, Grippers