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Cullen E. Bash
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030903.
Paper No: EP-12-1090
Published Online: July 24, 2013
Proceedings Papers
Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 751-757, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58403
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041009.
Published Online: November 26, 2012
Journal Articles
Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Brandon Rubenstein, Scot Heath, Niru Kumari
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041006.
Published Online: October 30, 2012
Proceedings Papers
Proc. ASME. IMECE2011, Volume 4: Energy Systems Analysis, Thermodynamics and Sustainability; Combustion Science and Engineering; Nanoengineering for Energy, Parts A and B, 739-746, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-62506
Proceedings Papers
Proc. ASME. IMECE2010, Volume 11: New Developments in Simulation Methods and Software for Engineering Applications; Safety Engineering, Risk Analysis and Reliability Methods; Transportation Systems, 173-179, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40210
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 541-551, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52140
Proceedings Papers
Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Niru Kumari, Cullen E. Bash, Scot Heath, Brandon Rubenstein
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 553-563, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52141
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 433-442, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52030
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
Published Online: September 21, 2011
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011004.
Published Online: March 9, 2011
Proceedings Papers
Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Brandon Rubenstein, Scot Heath, Niru Kumari
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10074, March 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJTEC2011-44091
Proceedings Papers
Brian J. Watson, Amip J. Shah, Manish Marwah, Cullen E. Bash, Ratnesh K. Sharma, Christopher E. Hoover, Tom W. Christian, Chandrakant D. Patel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 635-644, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89032
Proceedings Papers
Proc. ASME. ES2009, ASME 2009 3rd International Conference on Energy Sustainability, Volume 1, 833-842, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: ES2009-90067
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 215-224, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73138
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 205-213, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73137
Proceedings Papers
Proc. ASME. HT-FED2004, Volume 1, 965-971, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56528
Proceedings Papers
Proc. ASME. HT-FED2004, Volume 3, 479-486, July 11–15, 2004
Publisher: American Society of Mechanical Engineers
Paper No: HT-FED2004-56183
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 119-127, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35058
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 129-137, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35059
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