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Journal Articles

Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material

Zongrong Liu, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. December 2006, 128(4): 319–323.

https://doi.org/10.1115/1.2351895

Published Online: June 1, 2006

View Article titled, Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material

Topics: Boron, Contact resistance, Paraffin wax, Particulate matter, Pressure, Temperature, Thermal conductivity, Electrical conductance, Copper

Journal Articles

Effect of Stress on the Dielectric Constant of Alumina

Sihai Wen, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. September 2005, 127(3): 235–236.

https://doi.org/10.1115/1.1939029

Published Online: August 24, 2004

View Article titled, Effect of Stress on the Dielectric Constant of Alumina

Topics: Stress, Compressive stress

Journal Articles

Thermoelectric Behavior of Solder

Taejin Kim and, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. March 2003, 125(1): 161–162.

https://doi.org/10.1115/1.1536952

Published Online: March 14, 2003

View Article titled, Thermoelectric Behavior of Solder

Topics: Solders

Journal Articles

Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

Yunsheng Xu, Xiangcheng Luo, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 188–191.

https://doi.org/10.1115/1.1477191

Published Online: July 26, 2002

View Article titled, Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

Topics: Boron, Contact resistance, Lithium, Particulate matter, Ions, Sodium, Silicones, Solders, Thermal conductivity, Water

Journal Articles

Erratum: “Development of Glass-Free Metal Electrically Conductive Thick Films” [ASME J. Electron. Packag., 123 , No. 1, pp. 64–69]

Zongrong Liu and, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. June 2001, 123(2): 159.

https://doi.org/10.1115/1.1371772

Published Online: June 1, 2001

View Article titled, Erratum: “Development of Glass-Free Metal Electrically Conductive Thick Films” [ASME J. Electron. Packag., 123 , No. 1, pp. 64–69]

Topics: Electrons, Glass, Metals, Thick films, Adhesion, Electrical resistance, Packaging, Titanium alloys

Journal Articles

Erratum: “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductances” [ASME J. Electron. Packag., 122 , No. 2, pp. 128–131]

Yunsheng Xu,, Xiangcheng Luo, and, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. June 2001, 123(2): 159.

https://doi.org/10.1115/1.1371771

Published Online: June 1, 2001

View Article titled, Erratum: “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductances” [ASME J. Electron. Packag., 122 , No. 2, pp. 128–131]

Topics: Electrons, Interface phenomena, Sodium, Sodium compounds, Thermal conductivity

Journal Articles

Tribology of Graphite and Concrete, Studied by Contact Electrical Resistance Measurement During Cyclic Compression

Xiangcheng Luo, Ph.D. Graduate Student, D. D. L. Chung, Niagara Mohawk Endowed Chair Professor

Publisher: ASME

J. Tribol. October 2001, 123(4): 682–685.

https://doi.org/10.1115/1.1353588

Published Online: December 6, 2000

View Article titled, Tribology of Graphite and Concrete, Studied by Contact Electrical Resistance Measurement During Cyclic Compression

Topics: Compression, Concretes, Contact resistance, Deformation, Electrical resistance, Graphite, Stress, Tribology

Journal Articles

Development of Glass-Free Metal Electrically Conductive Thick Films

Zongrong Liu, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. March 2001, 123(1): 64–69.

https://doi.org/10.1115/1.1329131

Published Online: July 13, 2000

View Article titled, Development of Glass-Free Metal Electrically Conductive Thick Films

Topics: Electrical resistivity, Glass, Metals, Thick films, Adhesion, Alloys

Journal Articles

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Xiangcheng Luo,, Yunsheng Xu, and, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. September 2001, 123(3): 309–311.

https://doi.org/10.1115/1.1371925

Published Online: June 26, 2000

View Article titled, Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Topics: Contact resistance, Copper, Cycles, Disks, Electrical conductance, Heating, Silicones, Sodium, Thermal conductivity, Thermal stability

Journal Articles

Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance

Yunsheng Xu, Xiangcheng Luo, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. June 2000, 122(2): 128–131.

https://doi.org/10.1115/1.483144

Published Online: December 28, 1999

View Article titled, Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance

Topics: Contact resistance, Particulate matter, Silicones, Sodium, Thermal conductivity, Boron, Water, Copper, Fillers (Materials), Solders

Journal Articles

Z -Axis Anisotropic Electrically Conducting Polymer-Matrix Composite Film

L. Li, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. December 1997, 119(4): 255–259.

https://doi.org/10.1115/1.2792246

Published Online: December 1, 1997

View Article titled, Z -Axis Anisotropic Electrically Conducting Polymer-Matrix Composite Film

Topics: Anisotropy, Composite materials, Polymers, Electrical resistivity, Particulate matter, Pressure, Copper, Relaxation (Physics), Stress

Journal Articles

0.4 μm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding

Xiaoping Shui, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. December 1997, 119(4): 236–238.

https://doi.org/10.1115/1.2792242

Published Online: December 1, 1997

View Article titled, 0.4 μm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding

Topics: Composite materials, Electromagnetic interference, Nickel, Silicones, Cables, Electrical resistivity, Gaskets

Journal Articles

Nickel Fiber Silicone-Matrix Composites as Resilient Electrical Conductors

Mingguang Zhu, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. December 1991, 113(4): 417–420.

https://doi.org/10.1115/1.2905429

Published Online: December 1, 1991

View Article titled, Nickel Fiber Silicone-Matrix Composites as Resilient Electrical Conductors

Topics: Composite materials, Fibers, Nickel, Silicones, Electrical resistivity, Compression, Copper, Electromagnetic interference, Gaskets, Heating

Journal citation

NARROW

Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material

Effect of Stress on the Dielectric Constant of Alumina

Thermoelectric Behavior of Solder

Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

Erratum: “Development of Glass-Free Metal Electrically Conductive Thick Films” [ASME J. Electron. Packag., 123 , No. 1, pp. 64–69]

Erratum: “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductances” [ASME J. Electron. Packag., 122 , No. 2, pp. 128–131]

Tribology of Graphite and Concrete, Studied by Contact Electrical Resistance Measurement During Cyclic Compression

Development of Glass-Free Metal Electrically Conductive Thick Films

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance

Z -Axis Anisotropic Electrically Conducting Polymer-Matrix Composite Film

0.4 μm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding

Nickel Fiber Silicone-Matrix Composites as Resilient Electrical Conductors

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