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Proc. ASME. SBC2013, Volume 1A: Abdominal Aortic Aneurysms; Active and Reactive Soft Matter; Atherosclerosis; BioFluid Mechanics; Education; Biotransport Phenomena; Bone, Joint and Spine Mechanics; Brain Injury; Cardiac Mechanics; Cardiovascular Devices, Fluids and Imaging; Cartilage and Disc Mechanics; Cell and Tissue Engineering; Cerebral Aneurysms; Computational Biofluid Dynamics; Device Design, Human Dynamics, and Rehabilitation; Drug Delivery and Disease Treatment; Engineered Cellular Environments, V01AT06A002, June 26–29, 2013

Paper No: SBC2013-14069

DOI: https://doi.org/10.1115/SBC2013-14069

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Topics: Biomechanics, Design, Engineering education, Students, Engineering degrees, Internships, Actuators, Biomechanical engineering, Energy (Physics), Engineering students

Proceedings Papers

Characterization of Non-Conductive Adhesives

Daniel Farley, Abhijit Dasgupta, J. F. J. M. Caers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1365-1370, July 17–22, 2005

Paper No: IPACK2005-73021

DOI: https://doi.org/10.1115/IPACK2005-73021

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Topics: Adhesives, Manufacturing, Stress, Metals, Modeling, Contact resistance, Simulation, Temperature, Bonding, Compression

Proceedings Papers

Characterization of Anisotropic Conductive Adhesives

Abhijit Dasgupta, J. Caers, Preethi Iyer, Pascal Baumgaertner, Daniel Farley

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 19-26, November 15–21, 2003

Paper No: IMECE2003-42022

DOI: https://doi.org/10.1115/IMECE2003-42022

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Topics: Adhesives, Anisotropy, Bonding, Design, Pressure, Reliability, Shear (Mechanics), Shear stress, Stress analysis (Engineering), Testing

Proceedings Papers

Qualification of a System-in-Package (SiP): A Physics-of-Failure (PoF) Perspective

Daniel Farley, Abhijit Dasgupta, Jo Caers

Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 321-327, November 5–10, 2006

Paper No: IMECE2006-14706

DOI: https://doi.org/10.1115/IMECE2006-14706

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Topics: Failure, Physics, System-in-package, Testing, Cycles, Damage, Design, Epoxy adhesives, Epoxy resins, Failure mechanisms

Journal citation

NARROW

Validation of Feedback Control Approach for an Implantable Limb Lengthening Device

Evaluation of Extension Mechanism in an Implantable Limb Lengthening Device

Feedback Control for Patient Specific Limb Lengthening and Limb Deformity Correction

Towards a Novel, Implantable Limb Lengthening Device

RescuShell: A Biomechanical Design Epistemic Game for First-Year Engineering Education and Potentially Increased Retention of Women

Characterization of Non-Conductive Adhesives

Characterization of Anisotropic Conductive Adhesives

Qualification of a System-in-Package (SiP): A Physics-of-Failure (PoF) Perspective

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