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F. Patrick McCluskey
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Proceedings Papers

AI-Based Reliability Assessment of Power Electronic Systems

F. Patrick McCluskey, Clifton Buxbaum, Sudip K. Mazumder, Arif Sarwat, Matt Ursino, Miles C. Russell
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A015, October 25–27, 2022
Paper No: IPACK2022-97614
DOI: https://doi.org/10.1115/IPACK2022-97614
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Topics: Digital twin, Electronic systems, Reliability
Proceedings Papers

Reliable Additive Manufacturing Using Transient Liquid Phase Sintering

Gilad Nave, Clifton Buxbaum, F. Patrick McCluskey
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 26–28, 2021
Paper No: IPACK2021-73367
DOI: https://doi.org/10.1115/IPACK2021-73367
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Topics: Additive manufacturing, Sintering, Tension-leg platforms, Transients (Dynamics)
Proceedings Papers

Transient Liquid Phase Sintered Joints for Power Electronic Modules

Hannes Greve, F. Patrick McCluskey
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A004, July 16–18, 2013
Paper No: IPACK2013-73209
DOI: https://doi.org/10.1115/IPACK2013-73209
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Topics: Transients (Dynamics), Melting point, Metals, Shear strength, Sinter (Metallurgy), Temperature, Copper, Shear (Mechanics), Tension-leg platforms, Binders (Materials)
Proceedings Papers

Numerical Study on the Thermal Performance of a Substrate Integrated Thermal Buffer Heat Sink

Nicholas R. Jankowski, F. Patrick McCluskey
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 687-696, November 11–17, 2011
Paper No: IMECE2011-65590
DOI: https://doi.org/10.1115/IMECE2011-65590
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Topics: Heat sinks, Polishing equipment, Transients (Dynamics), Temperature, Design, Stress, Convection, Finite element model, Geometry, Heat
Proceedings Papers

Isothermalization of an IGBT Power Electronic Chip

Peng Wang, F. Patrick McCluskey, Avram Bar-Cohen
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 5-15, November 12–18, 2010
Paper No: IMECE2010-41019
DOI: https://doi.org/10.1115/IMECE2010-41019
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Topics: Cooling, Cooling systems, Design, Electronics, Flux (Metallurgy), Heat, Heat flux, Heat sinks, Hybrid electric vehicles, Microchannels
Proceedings Papers

Electrical Supercooling Mitigation in Erythritol

Nicholas R. Jankowski, F. Patrick McCluskey
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 7, 409-416, August 8–13, 2010
Paper No: IHTC14-22306
DOI: https://doi.org/10.1115/IHTC14-22306
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Topics: Supercooling, Electric current, Nucleation (Physics), Temperature, Electrodes, Crystallization, Cycles, Heat of fusion, Melting, Recrystallization
Proceedings Papers

Physics-of-Failure Design-for-Reliability of a Bidirectional Multi-Output DC-DC Power Converter

Vibhash Jha, F. Patrick McCluskey
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 675-680, August 8–13, 2010
Paper No: IHTC14-23040
DOI: https://doi.org/10.1115/IHTC14-23040
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Topics: Design, Failure, Physics, Power converters, Reliability, Solders, Cycles, Engineering prototypes, Heat sinks, Simulation
Proceedings Papers

Design and Fabrication of a Substrate Integrated Phase Change Thermal Buffer Heat Sink

Nicholas R. Jankowski, Brian C. Morgan, F. Patrick McCluskey
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 75-84, November 13–19, 2009
Paper No: IMECE2009-12713
DOI: https://doi.org/10.1115/IMECE2009-12713
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Topics: Design, Heat sinks, Manufacturing, Polishing equipment, Cooling, Temperature, Transients (Dynamics), Absorption, Army, Bonding
Proceedings Papers

Packaging of an Iron-Gallium Nanowire Acoustic Sensor for Under-Water Applications

Rupal Jain, F. Patrick McCluskey, Alison B. Flatau
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 825-829, July 8–12, 2007
Paper No: IPACK2007-33455
DOI: https://doi.org/10.1115/IPACK2007-33455
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Topics: Acoustics, Gallium, Iron, Nanowires, Packaging, Sensors, Water, Waves, Absorption, Ear
Proceedings Papers

Reliability of Indium Solder for Cold Temperature Packaging

Rui Wu, F. Patrick McCluskey
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 553-556, July 8–12, 2007
Paper No: IPACK2007-33456
DOI: https://doi.org/10.1115/IPACK2007-33456
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Topics: Packaging, Reliability, Solders, Temperature, Stress, Ceramics, Control systems, Damage, Failure, Fatigue
Proceedings Papers

Mechanical Reliability Evaluation of Chip Scale Power Package

Kaushik Ghosh, F. Patrick McCluskey, Victor A. K. Temple
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 77-85, November 5–11, 2005
Paper No: IMECE2005-81111
DOI: https://doi.org/10.1115/IMECE2005-81111
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Topics: Reliability, Failure, Solders, Fatigue, Modeling, Stress analysis (Engineering), Cooling, Creep, Cycles, Damage