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Proceedings Papers

Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Edward Davis
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A009, October 25–27, 2022
Paper No: IPACK2022-97433
DOI: https://doi.org/10.1115/IPACK2022-97433
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Topics: High temperature, Modeling, Reliability, Flip-chip, Solder joints, Ball-Grid-Array packaging, Electronics, Fatigue failure, Fatigue life, Materials degradation
Journal Articles

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021113.
Paper No: EP-21-1059
DOI: https://doi.org/10.1115/1.4052715
Published Online: January 4, 2022
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Topics: Flip-chip, Glass transition, High temperature, Mechanical properties, Oxidation, Solders, Storage, Temperature, Viscoelasticity, Optical microscopes
Proceedings Papers

Evolution of Prony Parameters for Underfills Subjected to High Temperature Long Term Aging

Pradeep Lall, Yunli Zhang, Haotian Wu, Jeff Suhling, Edward Davis
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A024, October 26–28, 2021
Paper No: IPACK2021-74076
DOI: https://doi.org/10.1115/IPACK2021-74076
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Topics: High temperature, Reliability
Proceedings Papers

Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging

Pradeep Lall, Yunli Zhang, Haotian Wu, Jeff Suhling, Edward Davis, Jaimal Williamson
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A023, October 26–28, 2021
Paper No: IPACK2021-74075
DOI: https://doi.org/10.1115/IPACK2021-74075
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Topics: Epoxy adhesives, Epoxy resins, High temperature, Molding, Viscoelasticity
Proceedings Papers

Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A017, October 26–28, 2021
Paper No: IPACK2021-74061
DOI: https://doi.org/10.1115/IPACK2021-74061
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Topics: High temperature, Relaxation (Physics), Reliability, Storage, Temperature, Viscoelasticity, Electronics, Glass transition, Materials properties, Mechanical properties
Proceedings Papers

Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C

Pradeep Lall, Yunli Zhang, Haotian Wu, Ed Davis, Jeff Suhling
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 27–29, 2020
Paper No: IPACK2020-2677
DOI: https://doi.org/10.1115/IPACK2020-2677
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Topics: Damage, Design, Elastic moduli, Electronic components, Electronic packaging, Elongation, High temperature, Mechanical properties, Mechanical testing, Operating temperature
Proceedings Papers

Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Ed Davis, Jeff Suhling
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 27–29, 2020
Paper No: IPACK2020-2675
DOI: https://doi.org/10.1115/IPACK2020-2675
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Topics: Glass transition, High temperature, Mechanical properties, Optical microscopes, Oxidation, Viscoelasticity, Electronics, Operating temperature, Reliability, Storage
Proceedings Papers

Model-Based Design and Evaluation of Electric Vehicle Powertrain With Independent Driving Motors

Haotian Wu, Haiyan Zhang
Proc. ASME. IDETC-CIE2015, Volume 3: 17th International Conference on Advanced Vehicle Technologies; 12th International Conference on Design Education; 8th Frontiers in Biomedical Devices, V003T01A047, August 2–5, 2015
Paper No: DETC2015-47980
DOI: https://doi.org/10.1115/DETC2015-47980
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Topics: Design, Electric vehicles, Motors, Wheels, Batteries, Braking, Energy consumption, Roads, Stability, Torque