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Proceedings Papers

Particle Inspection by Single Camera-Based 3D Stereoscopy

Hyun Jae Lee, Gugyeong Sung, Heebum Chun, ChaBum Lee
Proc. ASME. MSEC2024, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality & Reliability, V002T05A007, June 17–21, 2024
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2024-125207
https://doi.org/10.1115/MSEC2024-125207
View Paper titled, Particle Inspection by Single Camera-Based 3D Stereoscopy
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Topics: Inspection, Particulate matter, Semiconductor wafers, Stereoscopy
Journal Articles

Wafer Edge Metrology and Inspection Technique Using Curved-Edge Diffractive Fringe Pattern Analysis

Kuan Lu, Zhikun Wang, Heebum Chun, ChaBum Lee
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070908.
Paper No: MANU-23-1366
https://doi.org/10.1115/1.4065639
Published Online: June 10, 2024
View Article titled, Wafer Edge Metrology and Inspection Technique Using Curved-Edge Diffractive Fringe Pattern Analysis
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Topics: Diffraction patterns, Imaging, Inspection, Metrology, Semiconductor wafers, Feature extraction, Particulate matter
Journal Articles

Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation

Changheon Han, Heebum Chun, Jiho Lee, Fengfeng Zhou, Huitaek Yun, ChaBum Lee, Martin B.G. Jun
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070906.
Paper No: MANU-23-1591
https://doi.org/10.1115/1.4065276
Published Online: May 9, 2024
View Article titled, Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation
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Topics: Resolution (Optics), Semiconductor wafers, Inspection
Journal Articles

Nondestructive Surface Profiling and Inspection by Using a Single Unit Magneto-Eddy-Current Sensor

Jungsub Kim, Heebum Chun, ChaBum Lee
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. June 2024, 146(6): 064501.
Paper No: MANU-21-1527
https://doi.org/10.1115/1.4053810
Published Online: April 9, 2024
View Article titled, Nondestructive Surface Profiling and Inspection by Using a Single Unit Magneto-Eddy-Current Sensor
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Topics: Eddies (Fluid dynamics), Inspection, Sensors, Nondestructive evaluation, Steel, Copper, Aluminum, Magnets, Rivets
Proceedings Papers

Stroboscopic Data-Driven, Integrated, and Intelligent Machine Learning-Based Algorithms for Semiconductor Wafer Inspection

Changheon Han, Heebum Chun, ChaBum Lee, Martin Byung-Guk Jun
Proc. ASME. MSEC2023, Volume 2: Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T09A003, June 12–16, 2023
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2023-101213
https://doi.org/10.1115/MSEC2023-101213
View Paper titled, Stroboscopic Data-Driven, Integrated, and Intelligent Machine Learning-Based Algorithms for Semiconductor Wafer Inspection
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Topics: Algorithms, Computers, Inspection, Intelligent machines, Machine learning, Manufacturing, Semiconductor wafers, Particulate matter, Machinery, Human factors
Proceedings Papers

In-Process Machining Process Monitoring Method Based on Impedance Model of Dielectric Coating Layer at Tool-Chip Interface

Heebum Chun, Jungsub Kim, Jungsoo Nam, Songhyun Ju, ChaBum Lee
Proc. ASME. MSEC2022, Volume 1: Additive Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation; Nano/Micro/Meso Manufacturing, V001T04A017, June 27–July 1, 2022
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2022-85794
https://doi.org/10.1115/MSEC2022-85794
View Paper titled, In-Process Machining Process Monitoring Method Based on Impedance Model of Dielectric Coating Layer at Tool-Chip Interface
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Topics: Coating processes, Coatings, Machining, Process monitoring
Proceedings Papers

CFRP Milling and Drilling Process Monitoring by Using a Spindle-Integrated Three Axis Force Sensor

Jungsub Kim, Heebum Chun, ChaBum Lee
Proc. ASME. MSEC2022, Volume 1: Additive Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation; Nano/Micro/Meso Manufacturing, V001T04A018, June 27–July 1, 2022
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2022-85799
https://doi.org/10.1115/MSEC2022-85799
View Paper titled, CFRP Milling and Drilling Process Monitoring by Using a Spindle-Integrated Three Axis Force Sensor
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Topics: Carbon, Carbon reinforced plastics, Cutting, Drilling, Fiber reinforced plastics, Force sensors, Milling, Process monitoring, Sensors
Journal Articles

Damping Characteristics of Fluidic Pressure-Fed Mechanism for Positioning Applications

Heebum Chun, Jungsub Kim, Hyo-Young Kim, ChaBum Lee
Journal: Journal of Dynamic Systems, Measurement, and Control
Publisher: ASME
Article Type: Research-Article
J. Dyn. Sys., Meas., Control. November 2021, 143(11): 111001.
Paper No: DS-20-1413
https://doi.org/10.1115/1.4051294
Published Online: June 28, 2021
View Article titled, Damping Characteristics of Fluidic Pressure-Fed Mechanism for Positioning Applications
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Topics: Damping, Pressure, Dynamic systems, Vibration, Fluids, Water, Stiffness