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Proceedings Papers

Comparison of First-Order Shear and Plane Strain Assumptions in Warpage of Simply Supported Printed Wiring Boards

Yarom Polsky, I. Charles Ume

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 789-794, November 15–20, 1998

Paper No: IMECE1998-1093

DOI: https://doi.org/10.1115/IMECE1998-1093

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Topics: Plane strain, Printed circuit boards, Shear (Mechanics), Warping, Deflection, Temperature, Lamination, Materials properties, Mechanical properties, Modeling

Proceedings Papers

Design of Laser Ultrasonic System for In-Process Weld Penetration Monitoring and Control

Sandra N. Hopko, I. Charles Ume, Dathan S. Erdahl

Proc. ASME. IMECE99, Manufacturing Science and Engineering, 659-668, November 14–19, 1999

Paper No: IMECE1999-0727

DOI: https://doi.org/10.1115/IMECE1999-0727

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Topics: Design, Lasers, Fibers, Optical fiber, Ablation (Vaporization technology), Inspection, High temperature, Nondestructive evaluation, Probes, Testing

Proceedings Papers

In-Situ Warpage Measurement During Thermal Cycling of Dielectric Coated SS Substrate for Large Area MCM-D Packaging

Anh X. H. Dang, I. Charles Ume, Swapan K. Bhattacharya

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 169-179, November 14–19, 1999

Paper No: IMECE1999-0930

DOI: https://doi.org/10.1115/IMECE1999-0930

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Topics: Packaging, Warping, Dielectric materials, Lasers, Stainless steel, Temperature, Thin films, Vehicles

Proceedings Papers

Warpage Analysis of Wafers With Film Coating

Hai Ding, I. Charles Ume, Cheng Zhang

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 1-7, November 11–16, 2001

Paper No: IMECE2001/EPP-24700

DOI: https://doi.org/10.1115/IMECE2001/EPP-24700

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Topics: Coating processes, Coatings, Semiconductor wafers, Warping, Finite element analysis, Packaging, Shades and shadows, Young's modulus, Delamination, Design

Proceedings Papers

Development of Undergraduate Mechatronics Course in the School of Mechanical Engineering at Georgia Tech

I. Charles Ume, Akio Kita

Proc. ASME. IMECE2001, Mechanical Engineering Design Education: Issues and Case Studies, 31-35, November 11–16, 2001

Paper No: IMECE2001/DE-23284

DOI: https://doi.org/10.1115/IMECE2001/DE-23284

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Topics: Mechanical engineering, Mechatronics education, Undergraduate students, Students, Mechatronics, Engineering education

Proceedings Papers

Application of a Novel Flip Chip Solder Joint Inspection System to Chips on an FR-4 Substrate

Dathan S. Erdahl, Sheng Liu, I. Charles Ume

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 189-195, November 5–10, 2000

Paper No: IMECE2000-2262

DOI: https://doi.org/10.1115/IMECE2000-2262

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Topics: Flip-chip devices, Inspection, Solder joints, Solders, Vibration, Ball-Grid-Array packaging, Lasers, Ultrasound, Displacement, Interferometers

Proceedings Papers

Vibration Analysis Based Modeling and Defect Recognition for Flip Chip Solder Joint Inspection

Sheng Liu, Dathan Erdahl, I. Charles Ume

Proc. ASME. IMECE2000, Manufacturing Engineering, 405-412, November 5–10, 2000

Paper No: IMECE2000-1835

DOI: https://doi.org/10.1115/IMECE2000-1835

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Topics: Flip-chip, Flip-chip devices, Inspection, Modeling, Solder joints, Vibration analysis, Vibration, Oscillating frequencies, Solders, Ball-Grid-Array packaging

Journal Articles

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Sungbum Kang, I. Charles Ume

J. Electron. Packag. September 2014, 136(3): 031007.

Paper No: EP-13-1074

DOI: https://doi.org/10.1115/1.4027425

Published Online: May 12, 2014

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Topics: Diffraction gratings, Lasers, Resolution (Optics), Warping, Printed circuit boards, Accuracy and precision

Proceedings Papers

Quality Evaluation of Solder Bump in PBGA Package for Commercial Product Application Using Laser Ultrasonic Technique

Jie Gong, I. Charles Ume, Kola Akinade, Amiya Ray Chaudhuri

Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A084, November 15–21, 2013

Paper No: IMECE2013-66484

DOI: https://doi.org/10.1115/IMECE2013-66484

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Topics: Lasers, Solders, Natural language interfaces, Displacement, Transients (Dynamics), Ultrasound, Ball-Grid-Array packaging, Capacitors, Flip-chip devices, Inspection

Proceedings Papers

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Sungbum Kang, I. Charles Ume

Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A081, November 15–21, 2013

Paper No: IMECE2013-65072

DOI: https://doi.org/10.1115/IMECE2013-65072

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Topics: Lasers, Warping, Printed circuit boards, Manufacturing, Reliability, Resolution (Optics), Accuracy and precision, Density, Electronic packages, Thermomechanics

Proceedings Papers

Void Inspection in Lead-Free Solder Bumps on Ball Grid Array (BGA) Packages Using Laser Ultrasound Technique

Jie Gong, I. Charles Ume

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 941-948, November 11–17, 2011

Paper No: IMECE2011-63147

DOI: https://doi.org/10.1115/IMECE2011-63147

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Topics: Ball-Grid-Array packaging, Inspection, Lasers, Lead-free solders, Ultrasound, Solders, X-rays, Interferometers, Solder joints, Transients (Dynamics)

Proceedings Papers

Determination of Optimum Values of Control Parameters to Reduce Laser Speckle Noise for Projection Moire´ System

Sungbum Kang, Jie Gong, I. Charles Ume

Proc. ASME. IMECE2011, Volume 1: Advances in Aerospace Technology; Energy Water Nexus; Globalization of Engineering; Posters, 743-749, November 11–17, 2011

Paper No: IMECE2011-62766

DOI: https://doi.org/10.1115/IMECE2011-62766

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Topics: Laser speckle, Noise (Sound), Errors, Lasers, Noise control, Regression analysis, Design, Diffraction gratings, Displacement, Electronic packaging

Proceedings Papers

Investigation of Interaction of Laser Generated Lamb Waves With Structures of Interest

Lei Yang, I. Charles Ume

Proc. ASME. IMECE2011, Volume 3: Design and Manufacturing, 431-439, November 11–17, 2011

Paper No: IMECE2011-62972

DOI: https://doi.org/10.1115/IMECE2011-62972

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Topics: Lasers, Waves, Signals, Nondestructive evaluation, Acoustics, Aluminum plate, Fourier transforms, Inspection, Transducers, Welded joints

Proceedings Papers

Laser Ultrasonic Inspection of Solder Bumps in Flip Chip Packages Using Virtual Package Device as Reference

I. Charles Ume, Jie Gong, Razid Ahmad, Abel Valdes

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 507-516, November 12–18, 2010

Paper No: IMECE2010-39970

DOI: https://doi.org/10.1115/IMECE2010-39970

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Topics: Flip-chip packages, Inspection, Lasers, Solders, Signals, Vibration, Flip-chip devices, Interferometers, Manufacturing industry, Silicon

Proceedings Papers

Measurement of Weld Dimensions of Butt Joint Welding in Thin Plates Using Superimposed Laser Sources

Tsun-Yen Wu, I. Charles Ume

Proc. ASME. IMECE2010, Volume 3: Design and Manufacturing, Parts A and B, 549-561, November 12–18, 2010

Paper No: IMECE2010-38212

DOI: https://doi.org/10.1115/IMECE2010-38212

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Topics: Dimensions, Lasers, Plates (structures), Welding, Waves, Gas metal arc welding, Signals, Wavelength, Reflectance, Welded joints

Proceedings Papers

Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique

Jie Gong, I. Charles Ume

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 95-103, July 6–8, 2011

Paper No: IPACK2011-52294

DOI: https://doi.org/10.1115/IPACK2011-52294

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Topics: Ball-Grid-Array packages, Lasers, Lead-free solders, Ultrasound, Wetting, Solders, Inspection, Transients (Dynamics), Ball-Grid-Array packaging, Displacement

Proceedings Papers

Detection of Defects in Welded Structures With Complex Geometry Using Statistical Method Based on Discrete Wavelet Transform

Tsun-Yen Wu, I. Charles Ume, Matthew D. Rogge

Proc. ASME. IMECE2009, Volume 4: Design and Manufacturing, 419-425, November 13–19, 2009

Paper No: IMECE2009-10831

DOI: https://doi.org/10.1115/IMECE2009-10831

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Topics: Discrete wavelet transforms, Geometry, Inspection, Flaw detection, Signals, Acoustics, Sensors, Transducers, Ultrasound, Wavelets

Journal Articles

Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System

Jin Yang, Lizheng Zhang, I. Charles Ume, Camil Ghiu, George White

J. Electron. Packag. June 2010, 132(2): 021006.

DOI: https://doi.org/10.1115/1.4001832

Published Online: June 23, 2010

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Topics: Cycles, Inspection, Lasers, Reliability, Solder joints, Ultrasound, X-rays, Fracture (Materials)

Proceedings Papers

Quality Inspection of Flip Chip Solder Bump Using Analytical, Numerical and Experimental Modal Analyses

Jin Yang, I. Charles Ume

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 365-374, July 8–12, 2007

Paper No: IPACK2007-33542

DOI: https://doi.org/10.1115/IPACK2007-33542

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Topics: Flip-chip, Flip-chip devices, Inspection, Modal analysis, Solders, Computer simulation, Dynamic response, Electronics, Experimental methods, Interferometry

Proceedings Papers

Warpage Measurement Using Projection Moire´ System and Two Automatic Image Segmentation Algorithms

Wei Tan, I. Charles Ume

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 427-434, November 11–15, 2007

Paper No: IMECE2007-43650

DOI: https://doi.org/10.1115/IMECE2007-43650

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Topics: Algorithms, Image segmentation, Warping, Printed circuit boards, Displacement, Electronic packages, Reliability, Composite materials, Electronic packaging, Manufacturing

Journal citation

NARROW

Comparison of First-Order Shear and Plane Strain Assumptions in Warpage of Simply Supported Printed Wiring Boards

Design of Laser Ultrasonic System for In-Process Weld Penetration Monitoring and Control

In-Situ Warpage Measurement During Thermal Cycling of Dielectric Coated SS Substrate for Large Area MCM-D Packaging

Warpage Analysis of Wafers With Film Coating

Development of Undergraduate Mechatronics Course in the School of Mechanical Engineering at Georgia Tech

Application of a Novel Flip Chip Solder Joint Inspection System to Chips on an FR-4 Substrate

Vibration Analysis Based Modeling and Defect Recognition for Flip Chip Solder Joint Inspection

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Quality Evaluation of Solder Bump in PBGA Package for Commercial Product Application Using Laser Ultrasonic Technique

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Void Inspection in Lead-Free Solder Bumps on Ball Grid Array (BGA) Packages Using Laser Ultrasound Technique

Determination of Optimum Values of Control Parameters to Reduce Laser Speckle Noise for Projection Moire´ System

Investigation of Interaction of Laser Generated Lamb Waves With Structures of Interest

Laser Ultrasonic Inspection of Solder Bumps in Flip Chip Packages Using Virtual Package Device as Reference

Measurement of Weld Dimensions of Butt Joint Welding in Thin Plates Using Superimposed Laser Sources

Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique

Detection of Defects in Welded Structures With Complex Geometry Using Statistical Method Based on Discrete Wavelet Transform

Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System

Quality Inspection of Flip Chip Solder Bump Using Analytical, Numerical and Experimental Modal Analyses

Warpage Measurement Using Projection Moire´ System and Two Automatic Image Segmentation Algorithms

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