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1-14 of 14
J. Lau
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Proceedings Papers
Proc. ASME. DETC95, Volume 2: 11th Biennial Conference on Reliability, Stress Analysis, and Failure Prevention; 7th International Conference on Design Theory and Methodology; JSME Symposium on Design and Production; Mechanical Design Education and History; Computer-Integrated Concurrent Design Conference, 243-247, September 17–20, 1995
Publisher: American Society of Mechanical Engineers
Paper No: DETC1995-0158
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041002.
Published Online: August 29, 2012
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 83-89, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52286
Proceedings Papers
Proc. ASME. IMECE2002, Applied Mechanics and Biomedical Technology, 45-54, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-32862
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 367–373.
Published Online: October 6, 2004
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 148–158.
Published Online: April 30, 2004
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. February 2003, 125(1): 120–127.
Published Online: March 4, 2003
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 403–410.
Published Online: December 12, 2002
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 242–248.
Published Online: December 1, 1999
Journal Articles
D. Barker, S. Burchett, H. Conrad, A. Dasgupta, P. Engel, J. Lau, Y. Pao, A. Rafanelli, R. Ross, Jr.
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 1995, 117(2): 93.
Published Online: June 1, 1995
Topics:
Surface mount assemblies
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 184–190.
Published Online: September 1, 1994
Journal Articles
J. Lau, T. Marcotte, J. Severine, A. Lee, S. Erasmus, T. Baker, J. Moldaschel, M. Sporer, G. Burward-Hoy
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 180–188.
Published Online: June 1, 1993
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 169–176.
Published Online: June 1, 1992
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 138–148.
Published Online: June 1, 1991