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Proceedings Papers

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Y. Zou, J. C. Suhling, R. C. Jaeger, S. T. Lin, L. Nguyen, S. A. Gee
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 15-21, November 16–21, 1997
Paper No: IMECE1997-1222
DOI: https://doi.org/10.1115/IMECE1997-1222
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Topics: Silicon, Stress, Finite element analysis, Temperature, Constitutive equations, Electronic packaging, Engineering simulation, Packaging, Sensors, Shear stress
Proceedings Papers

Hydrostatic Response of Piezoresistive Stress Sensors

Y. Kang, A. K. M. Mian, J. C. Suhling, R. C. Jaeger
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 29-36, November 16–21, 1997
Paper No: IMECE1997-1224
DOI: https://doi.org/10.1115/IMECE1997-1224
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Topics: Hydrostatics, Sensors, Stress, Hydrostatic testing, Resistors, Calibration, Manufacturing, Pressure, Pressure vessels, Semiconductor wafers
Proceedings Papers

Evaluation of Die Stress Using van der Pauw Sensors

A. K. M. Mian, J. C. Suhling, R. C. Jaeger, B. M. Wilamowski
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 59-67, November 16–21, 1997
Paper No: IMECE1997-1228
DOI: https://doi.org/10.1115/IMECE1997-1228
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Topics: Sensors, Stress, Resistors, Silicon, Anisotropy, Electronic packaging, Heat conduction, Semiconductor wafers, Simulation results, Temperature
Proceedings Papers

Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers

Jun Chen, R. C. Jaeger, J. C. Suhling
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A019, October 7–9, 2019
Paper No: IPACK2019-6461
DOI: https://doi.org/10.1115/IPACK2019-6461
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Topics: Semiconductor wafers, Sensors, Silicon, Stress, Calibration, Errors, Approximation, Design, Electronics, High temperature
Proceedings Papers

Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling

Chaobo Shen, Zhou Hai, Cong Zhao, Jiawei Zhang, M. J. Bozack, J. C. Suhling, John L. Evans
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A033, July 6–9, 2015
Paper No: IPACK2015-48009
DOI: https://doi.org/10.1115/IPACK2015-48009
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Topics: Event history analysis, Solder joints, Tin, Ball-Grid-Array packaging, Fatigue failure, Finishes, Intermetallic compounds, Solders
Proceedings Papers

Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints

N. Islam, J. C. Suhling, P. Lall, T. Shete, H. S. Gale, R. W. Johnson, M. J. Bozack, P. Seto, T. Gupta, J. R. Thompson
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 225-228, November 15–21, 2003
Paper No: IMECE2003-42117
DOI: https://doi.org/10.1115/IMECE2003-42117
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Topics: Lead-free solders, Reliability, Resistors, Solders, Alloys, Fatigue, Solder joints, Temperature
Journal Articles

Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

D. A. Bittle, J. C. Suhling, R. E. Beaty, R. C. Jaeger, R. W. Johnson
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 203–215.
DOI: https://doi.org/10.1115/1.2905397
Published Online: September 1, 1991
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Topics: Electronic packages, Sensors, Stress, Structural analysis, Semiconductor wafers, Crystals, Design, Diamonds, Heat conduction, Integrated circuits