1-9 of 9
Jaeho Lee
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Shiva Farzinazar, Zongqing Ren, Jungyun Lim, Jae Choon Kim, Jaeho Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021118.
Paper No: EP-21-1038
DOI: https://doi.org/10.1115/1.4053948
Published Online: March 28, 2022
View Article
PDF
Topics: Heat, Optimization, Thermomechanics, Topology, Design, Electronic packaging, Heat sinks
Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. June 2022, 144(2): 020301.
Paper No: EP-21-1158
DOI: https://doi.org/10.1115/1.4053122
Published Online: January 4, 2022
View Article
PDF
Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling
Journal Articles

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. March 2021, 143(1): 010801.
Paper No: EP-20-1051
DOI: https://doi.org/10.1115/1.4047414
Published Online: June 29, 2020
View Article
PDF
Topics: Heat, Metamaterials, Thermal management, Cooling, Temperature, Thermal conductivity, Electronic packaging, Design, Packaging, Anisotropy
Proceedings Papers

Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management

Gary Liang, Ashkan Sadeghifard, Anirudh Krishna, Jaeho Lee, Edwin A. Peraza Hernandez
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 7–9, 2019
Paper No: IPACK2019-6402
DOI: https://doi.org/10.1115/IPACK2019-6402
View Paper
PDF
Topics: Alloys, Modeling, Shapes, Thermal management, Springs, Temperature, Solar energy, Deformation, Irradiation (Radiation exposure), Actuators
Proceedings Papers

Thermal Analysis of 3D ICs With TSVs Placement Optimization

Zongqing Ren, Ayed Alqahtani, Nader Bagherzadeh, Jaeho Lee
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 7–9, 2019
Paper No: IPACK2019-6417
DOI: https://doi.org/10.1115/IPACK2019-6417
View Paper
PDF
Topics: Algorithms, Anisotropy, Delays, Heat transfer, Integrated circuits, Optimization, Power density, Signals, Silicon, Simulated annealing
Proceedings Papers

Thermoelectric Characterization of Ge 2 Sb 2 Te 5 Films for Phase-Change Memory

Jaeho Lee, Takashi Kodama, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 687-693, March 3–6, 2012
Paper No: MNHMT2012-75092
DOI: https://doi.org/10.1115/MNHMT2012-75092
View Paper
PDF
Topics: Crystallization, Electromagnetic scattering, Engineering simulation, Film thickness, Grain boundaries, Optimization, Phase change materials, Radiation scattering, Scattering (Physics), Simulation
Proceedings Papers

Electrothermal Modeling and Design Strategies for Multibit Phase Change Memory

Zijian Li, Rakesh G. D. Jeyasingh, Jaeho Lee, Mehdi Asheghi, H.-S. Philip Wong, Kenneth E. Goodson
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 777-783, March 3–6, 2012
Paper No: MNHMT2012-75129
DOI: https://doi.org/10.1115/MNHMT2012-75129
View Paper
PDF
Topics: Columns (Structural), Computer programming, Crystallization, Design, Dynamics (Mechanics), Electrodes, Heating, Joules, Modeling, Nanoscale phenomena
Proceedings Papers

In-Plane Thermal Conduction and Conductivity Anisotropy in Ge 2 Sb 2 Te 5 Films for Phase Change Memory

Zijian Li, Jaeho Lee, John P. Reifenberg, Mehdi Asheghi, H.-S. Philip Wong, Kenneth E. Goodson
Proc. ASME. IMECE2010, Volume 10: Micro and Nano Systems, 651-658, November 12–18, 2010
Paper No: IMECE2010-40459
DOI: https://doi.org/10.1115/IMECE2010-40459
View Paper
PDF
Topics: Anisotropy, Heat conduction, Thermal conductivity, Thin films, Design, Energy consumption, Heat losses, Thermal conductivity measurement
Proceedings Papers

High Temperature Thermal Characterization of Ge 2 Sb 2 Te 5 for Phase Change Memory

Jaeho Lee, John P. Reifenberg, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T30014, March 13–17, 2011
Paper No: AJTEC2011-44230
DOI: https://doi.org/10.1115/AJTEC2011-44230
View Paper
PDF
Topics: Crystallization, Design, Heating, High temperature, Joules, Phase change materials, Temperature, Temperature measurement, Thermal characterization, Thermal conductivity