Search Results | ASME Digital Collection

1-20 of 78

2 3 4

Sort by

Sort Order Select

Proceedings Papers

Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder

Golam Rakib Mazumder, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A002, October 25–27, 2022

Paper No: IPACK2022-93878

DOI: https://doi.org/10.1115/IPACK2022-93878

View Paper

Topics: Creep, Damage, Lead-free solders, Solders

Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997

Paper No: IMECE1997-1220

DOI: https://doi.org/10.1115/IMECE1997-1220

View Paper

Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors

Proceedings Papers

Die Stress Measurements Using High Temperature Die-Attachment Materials

Yida Zou, Jeffrey C. Suhling, Richard C. Jaeger, Shun-Tien Lin, Jeffrey T. Benoit, Richard R. Grzybowski

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 107-117, November 15–20, 1998

Paper No: IMECE1998-0436

DOI: https://doi.org/10.1115/IMECE1998-0436

View Paper

Topics: High temperature, Stress, Temperature, Adhesives, Sensors, Ceramics, Engineering simulation, Finite element analysis, Glass, Packaging

Proceedings Papers

Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 26–28, 2021

Paper No: IPACK2021-73548

DOI: https://doi.org/10.1115/IPACK2021-73548

View Paper

Topics: Alloys, Creep, Lead-free solders, Stress-strain curves, Temperature

Proceedings Papers

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 26–28, 2021

Paper No: IPACK2021-73348

DOI: https://doi.org/10.1115/IPACK2021-73348

View Paper

Topics: Intermetallic compounds, Lead-free solders, Solder joints, Alloys, Reliability, Copper, Elastic moduli, Electronic packaging, Nanoindentation, Polishing

Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021

Paper No: IPACK2021-74044

DOI: https://doi.org/10.1115/IPACK2021-74044

View Paper

Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature

Proceedings Papers

Deformation Behavior of SAC305 Solder Joints With Multiple Grains

Debabrata Mondal, Abdullah Fahim, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 27–29, 2020

Paper No: IPACK2020-2694

DOI: https://doi.org/10.1115/IPACK2020-2694

View Paper

Topics: Anisotropy, Deformation, Grain size, Solder joints

Proceedings Papers

Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading

Abdullah Fahim, Kamrul Hasan, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 27–29, 2020

Paper No: IPACK2020-2655

DOI: https://doi.org/10.1115/IPACK2020-2655

View Paper

Topics: Creep, Nanoindentation, Solder masks

Proceedings Papers

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Jing Wu, Mohammad S. Alam, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020

Paper No: IPACK2020-2695

DOI: https://doi.org/10.1115/IPACK2020-2695

View Paper

Topics: Intermetallic compounds, Lead-free solders, Solders, Particulate matter, Tin, Alloys, Mechanical behavior, Diffusion (Physics), High temperature, Mechanical properties

Proceedings Papers

Determination of Anand Parameters From Creep Testing of SAC305 Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 27–29, 2020

Paper No: IPACK2020-2690

DOI: https://doi.org/10.1115/IPACK2020-2690

View Paper

Topics: Creep, Solder joints, Testing

Proceedings Papers

Study of Lead Free Solder Joints Subjected to Isothermal Mechanical Shear Cycling

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 27–29, 2020

Paper No: IPACK2020-2692

DOI: https://doi.org/10.1115/IPACK2020-2692

View Paper

Topics: Lead-free solders, Recrystallization, Shear (Mechanics)

Proceedings Papers

Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling

S. M. Kamrul Hasan, Abdullah Fahim, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 27–29, 2020

Paper No: IPACK2020-2693

DOI: https://doi.org/10.1115/IPACK2020-2693

View Paper

Topics: Creep, Lead-free solders

Proceedings Papers

Time-Lapse Imagery and Quantitative Analysis of Microstructural Evolution of SAC305 BGA Joints During Extreme High Temperature Aging

KM Rafidh Hassan, Mohammad S. Alam, Jing Wu, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 27–29, 2020

Paper No: IPACK2020-2691

DOI: https://doi.org/10.1115/IPACK2020-2691

View Paper

Topics: Ball-Grid-Array packaging, High temperature, Lead-free solders, Particulate matter

Proceedings Papers

Atomistic Investigation on Mechanical Properties of Sn-Ag-Cu Based Nanocrystalline Solder Material

Mohammad Motalab, Rafsan A. S. I. Subad, Ayesha Ahmed, Pritom Bose, Ratul Paul, Jeffrey C. Suhling

Proc. ASME. IMECE2019, Volume 12: Advanced Materials: Design, Processing, Characterization, and Applications, V012T10A035, November 11–14, 2019

Paper No: IMECE2019-12109

DOI: https://doi.org/10.1115/IMECE2019-12109

View Paper

Topics: Mechanical properties, Solders, Tin, Tensile strength, Simulation, Temperature, Atoms, Crystals, Ductility, Electrical components

Proceedings Papers

Investigation of the Effects of High Temperature Aging on Mechanical Behavior and Microstructural Changes in Lead Free Solders

Jing Wu, Mohammad S. Alam, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 7–9, 2019

Paper No: IPACK2019-6571

DOI: https://doi.org/10.1115/IPACK2019-6571

View Paper

Topics: Intermetallic compounds, Lead-free solders, Mechanical behavior, Temperature effects

Proceedings Papers

Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading

Abdullah Fahim, S. M. Kamrul Hasan, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 7–9, 2019

Paper No: IPACK2019-6471

DOI: https://doi.org/10.1115/IPACK2019-6471

View Paper

Topics: Creep, Nanoindentation, Solder joints, Testing

Proceedings Papers

Evolution of the Microstructure of Lead Free Solders Subjected to Both Aging and Cyclic Loading

Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Jeffrey C. Suhling, Sa’d Hamasha, Pradeep Lall

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 7–9, 2019

Paper No: IPACK2019-6560

DOI: https://doi.org/10.1115/IPACK2019-6560

View Paper

Topics: Lead-free solders

Proceedings Papers

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019

Paper No: IPACK2019-6561

DOI: https://doi.org/10.1115/IPACK2019-6561

View Paper

Topics: Fatigue life, Finite element analysis, Materials properties, Modeling, Stress, Viscoelasticity, Temperature, Polymers, Simulation, Relaxation (Physics)

Proceedings Papers

Effects of Test Temperature and Prior Aging on the Cyclic Stress-Strain Behavior of Lead Free Solders

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 7–9, 2019

Paper No: IPACK2019-6562

DOI: https://doi.org/10.1115/IPACK2019-6562

View Paper

Topics: Lead-free solders, Stress, Temperature

Proceedings Papers

Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects

Tusher Ahmed, Mohammad Motalab, Jeffrey C. Suhling

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A024, October 7–9, 2019

Paper No: IPACK2019-6521

DOI: https://doi.org/10.1115/IPACK2019-6521

View Paper

Topics: Electrodiffusion, Failure, Lead-free solders

2 3 4

Journal citation

NARROW

Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder

Advances in Stress Test Chips

Die Stress Measurements Using High Temperature Die-Attachment Materials

Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

Deformation Behavior of SAC305 Solder Joints With Multiple Grains

Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Determination of Anand Parameters From Creep Testing of SAC305 Solder Joints

Study of Lead Free Solder Joints Subjected to Isothermal Mechanical Shear Cycling

Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling

Time-Lapse Imagery and Quantitative Analysis of Microstructural Evolution of SAC305 BGA Joints During Extreme High Temperature Aging

Atomistic Investigation on Mechanical Properties of Sn-Ag-Cu Based Nanocrystalline Solder Material

Investigation of the Effects of High Temperature Aging on Mechanical Behavior and Microstructural Changes in Lead Free Solders

Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading

Evolution of the Microstructure of Lead Free Solders Subjected to Both Aging and Cyclic Loading

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

Effects of Test Temperature and Prior Aging on the Cyclic Stress-Strain Behavior of Lead Free Solders

Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only