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Proceedings Papers

Lamb Waves in a Double-Layer Plate with Nonlinear Spring Interface

Junzhen Wang, Jianmin Qu
Proc. ASME. QNDE2023, 2023 50th Annual Review of Progress in Quantitative Nondestructive Evaluation, V001T04A003, July 24–27, 2023
Publisher: American Society of Mechanical Engineers
Paper No: QNDE2023-117735
https://doi.org/10.1115/QNDE2023-117735
View Paper titled, Lamb Waves in a Double-Layer Plate with Nonlinear Spring Interface
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Topics: Composite materials, Springs, Waves
Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0503
https://doi.org/10.1115/IMECE1997-0503
View Paper titled, Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation
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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry
Proceedings Papers

Micromechanical Modeling of Fiber Fragmentation in Single Fiber Composite Specimens

Jean E. Davis, Jianmin Qu
Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 203-204, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1174
https://doi.org/10.1115/IMECE1998-1174
View Paper titled, Micromechanical Modeling of Fiber Fragmentation in Single Fiber Composite Specimens
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Topics: Composite materials, Fibers, Modeling, Fracture (Materials), Fracture (Process), Stress, Brittleness, Damage, Elasticity, Finite element methods
Proceedings Papers

Three-Dimensional Finite Element Modeling of Flip Chip Packages Under Thermal Loading

Qizhou Yao, Jianmin Qu
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 779-787, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1092
https://doi.org/10.1115/IMECE1998-1092
View Paper titled, Three-Dimensional Finite Element Modeling of Flip Chip Packages Under Thermal Loading
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Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect
Proceedings Papers

On the Steady-State Characteristics of Circumferential Waves in a Two-Layered Cylinder

Christine Valle, Jianmin Qu, Laurence J. Jacobs
Proc. ASME. IMECE99, On the Recent Advances of the Ultrasonic Nondestructive Evaluation and Composite Material Characterization, 99-105, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0895
https://doi.org/10.1115/IMECE1999-0895
View Paper titled, On the Steady-State Characteristics of Circumferential Waves in a Two-Layered Cylinder
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Topics: Cylinders, Steady state, Waves, Dimensions, Displacement, Elasticity, Fluids, Rayleigh waves, Shear stress, Stress
Proceedings Papers

Effect of Thermal Residual Stresses on Polymer/Metal Interfacial Adhesion

Qizhou Yao, Jianmin Qu
Proc. ASME. IMECE99, Polymeric Systems, 25-28, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1201
https://doi.org/10.1115/IMECE1999-1201
View Paper titled, Effect of Thermal Residual Stresses on Polymer/Metal Interfacial Adhesion
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Topics: Adhesion, Metals, Polymers, Residual stresses, Adhesives, Stress, Aluminum, Epoxy adhesives, Epoxy resins, Fracture (Materials)
Proceedings Papers

Effects of Cure State on the Ultrasonic Nonlinear Parameter in Adhesive Joints

Guoli Liu, Jianmin Qu, Laurence J. Jacobs
Proc. ASME. IMECE2000, Nondestructive Evaluation and Characterization of Engineering Materials for Reliability and Durability Predictions, 83-94, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1649
https://doi.org/10.1115/IMECE2000-1649
View Paper titled, Effects of Cure State on the Ultrasonic Nonlinear Parameter in Adhesive Joints
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Topics: Adhesive joints, Hardening (Curing), Signals, Transducers, Waves, Cycles, Polymers, Temperature
Proceedings Papers

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

Timothy P. Ferguson, Jianmin Qu
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 129-133, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2254
https://doi.org/10.1115/IMECE2000-2254
View Paper titled, Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface
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Topics: Adhesion, Solder masks, Fracture toughness, Corrosion, Failure mechanisms, Flow (Dynamics), Fracture (Materials), Microelectronic packaging, Packaging, Polymers
Proceedings Papers

Interfacial Versus Cohesive Failure on Underfill-Aluminum Interface: Effects of Interface Roughness

Qizhou Yao, Jianmin Qu
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 153-160, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2257
https://doi.org/10.1115/IMECE2000-2257
View Paper titled, Interfacial Versus Cohesive Failure on Underfill-Aluminum Interface: Effects of Interface Roughness
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Topics: Aluminum, Failure, Interface roughness, Polymers, Adhesion, Metals, Fracture mechanics, Surface roughness, Epoxy adhesives, Epoxy resins
Journal Articles

Frequency-Dependent Tensile and Compressive Effective Moduli of Elastic Solids With Randomly Distributed Two-Dimensional Microcracks

Youxuan Zhao, Yanjun Qiu, Laurence J. Jacobs, Jianmin Qu
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. August 2015, 82(8): 081006.
Paper No: JAM-15-1150
https://doi.org/10.1115/1.4030538
Published Online: August 1, 2015
View Article titled, Frequency-Dependent Tensile and Compressive Effective Moduli of Elastic Solids With Randomly Distributed Two-Dimensional Microcracks
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Topics: Finite element methods, Fracture (Materials), Micromechanics (Engineering), Microcracks, Solids, Density, Compression
Journal Articles

Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations

Feng Gao, Jianmin Qu, Matthew Yao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020908.
https://doi.org/10.1115/1.4004095
Published Online: July 1, 2011
View Article titled, Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations
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Topics: Carbon nanotubes, Contact resistance, Electrodes, Electron configuration
Proceedings Papers

Molecular Dynamics Simulation of the Thermal Resistance of Carbon Nanotube – Substrate Interfaces

Daniel J. Rogers, Jianmin Qu, Matthew Yao
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 55-61, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89096
https://doi.org/10.1115/InterPACK2009-89096
View Paper titled, Molecular Dynamics Simulation of the Thermal Resistance of Carbon Nanotube – Substrate Interfaces
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Topics: Carbon nanotubes, Interfacial thermal resistance, Molecular dynamics simulation, Phonons, Thermal resistance
Proceedings Papers

Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints

Feng Gao, Jianping Jing, Frank Z. Liang, Richard L. Williams, Jianmin Qu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 729-736, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89098
https://doi.org/10.1115/InterPACK2009-89098
View Paper titled, Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints
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Topics: Brittleness, Failure, Lead-free solders, Solders, Solder joints, Brittle fracture, Failure mechanisms, Design, Dynamic testing (Materials), Finite element analysis
Proceedings Papers

Electronic Structure and Contact Resistance at the Interface Between Carbon Nanotubes and Copper Pad

Feng Gao, Jianmin Qu, Matthew Yao
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 543-547, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89099
https://doi.org/10.1115/InterPACK2009-89099
View Paper titled, Electronic Structure and Contact Resistance at the Interface Between Carbon Nanotubes and Copper Pad
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Topics: Carbon nanotubes, Contact resistance, Copper, Electron configuration, Density, Electrodes, Electrons, Density functional theory, Electrical properties, Electronics
Proceedings Papers

Elastic Properties of (Cu,Ni) 6 Sn 5 Ternary Crystal Structure Using First-Principle Approach

Feng Gao, Jianmin Qu
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 159-163, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11130
https://doi.org/10.1115/IMECE2009-11130
View Paper titled, Elastic Properties of (Cu,Ni) 6 Sn 5 Ternary Crystal Structure Using First-Principle Approach
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Topics: Crystal structure, Elasticity, Tin, Atoms, Anisotropy, Density, Intermetallic compounds, Density functional theory, Diffusion (Physics), Electronic packaging
Proceedings Papers

Conducting Properties of a Contact Between Open-End Carbon Nanotube and Various Electrodes

Feng Gao, Jianmin Qu, Matthew Yao
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 165-169, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11117
https://doi.org/10.1115/IMECE2009-11117
View Paper titled, Conducting Properties of a Contact Between Open-End Carbon Nanotube and Various Electrodes
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Topics: Carbon nanotubes, Electrodes, Density, Electrical conductance, Electron configuration, Electrons, Metals, Single-walled carbon nanotubes, Density functional theory, Electronics
Journal Articles

Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint

Feng Gao, Jianping Jing, Frank Z. Liang, Richard L. Williams, Jianmin Qu
Journal: Journal of ASTM International
Publisher: ASTM International
Article Type: Research-Article
J. ASTM Int.. May 2010, 7(5): 1–15.
https://doi.org/10.1520/JAI103021
Published Online: May 1, 2010
View Article titled, Loading Mixity on the Interfacial Failure Mode in Lead-Free Solder Joint
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Proceedings Papers

A Multiscale Modeling Method for the Creep Behavior of SnAg Solder Alloys

Min Pei, Jianmin Qu
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 115-120, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33703
https://doi.org/10.1115/IPACK2007-33703
View Paper titled, A Multiscale Modeling Method for the Creep Behavior of SnAg Solder Alloys
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Topics: Alloys, Creep, Multiscale modeling, Solders, Tin, Particulate matter
Proceedings Papers

Effect of La Doping on SnAg Solder Microstructure Evolution

Min Pei, Jianmin Qu
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 407-413, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33701
https://doi.org/10.1115/IPACK2007-33701
View Paper titled, Effect of La Doping on SnAg Solder Microstructure Evolution
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Topics: Lead-free solders, Particulate matter, Solders, Temperature, Tin
Proceedings Papers

Simulation of Dynamic Fracture Along Solder-Pad Interfaces Using a Cohesive Zone Model

Jianping Jing, Feng Gao, Janine Johnson, Frank Z. Liang, Richard L. Williams, Jianmin Qu
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 171-176, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-68891
https://doi.org/10.1115/IMECE2008-68891
View Paper titled, Simulation of Dynamic Fracture Along Solder-Pad Interfaces Using a Cohesive Zone Model
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Topics: Fracture (Materials), Fracture (Process), Simulation, Solders, Failure, Brittleness, Damage, Finite element methods, Solder joints