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Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997

Paper No: IMECE1997-0503

DOI: https://doi.org/10.1115/IMECE1997-0503

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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry

Proceedings Papers

Three-Dimensional Finite Element Modeling of Flip Chip Packages Under Thermal Loading

Qizhou Yao, Jianmin Qu

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 779-787, November 15–20, 1998

Paper No: IMECE1998-1092

DOI: https://doi.org/10.1115/IMECE1998-1092

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Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect

Proceedings Papers

Micromechanical Modeling of Fiber Fragmentation in Single Fiber Composite Specimens

Jean E. Davis, Jianmin Qu

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 203-204, November 15–20, 1998

Paper No: IMECE1998-1174

DOI: https://doi.org/10.1115/IMECE1998-1174

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Topics: Composite materials, Fibers, Modeling, Fracture (Materials), Fracture (Process), Stress, Brittleness, Damage, Elasticity, Finite element methods

Proceedings Papers

On the Steady-State Characteristics of Circumferential Waves in a Two-Layered Cylinder

Christine Valle, Jianmin Qu, Laurence J. Jacobs

Proc. ASME. IMECE99, On the Recent Advances of the Ultrasonic Nondestructive Evaluation and Composite Material Characterization, 99-105, November 14–19, 1999

Paper No: IMECE1999-0895

DOI: https://doi.org/10.1115/IMECE1999-0895

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Topics: Cylinders, Steady state, Waves, Dimensions, Displacement, Elasticity, Fluids, Rayleigh waves, Shear stress, Stress

Proceedings Papers

Effect of Thermal Residual Stresses on Polymer/Metal Interfacial Adhesion

Qizhou Yao, Jianmin Qu

Proc. ASME. IMECE99, Polymeric Systems, 25-28, November 14–19, 1999

Paper No: IMECE1999-1201

DOI: https://doi.org/10.1115/IMECE1999-1201

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Topics: Adhesion, Metals, Polymers, Residual stresses, Adhesives, Stress, Aluminum, Epoxy adhesives, Epoxy resins, Fracture (Materials)

Proceedings Papers

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

Timothy P. Ferguson, Jianmin Qu

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 129-133, November 5–10, 2000

Paper No: IMECE2000-2254

DOI: https://doi.org/10.1115/IMECE2000-2254

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Topics: Adhesion, Solder masks, Fracture toughness, Corrosion, Failure mechanisms, Flow (Dynamics), Fracture (Materials), Microelectronic packaging, Packaging, Polymers

Proceedings Papers

Interfacial Versus Cohesive Failure on Underfill-Aluminum Interface: Effects of Interface Roughness

Qizhou Yao, Jianmin Qu

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 153-160, November 5–10, 2000

Paper No: IMECE2000-2257

DOI: https://doi.org/10.1115/IMECE2000-2257

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Topics: Aluminum, Failure, Interface roughness, Polymers, Adhesion, Metals, Fracture mechanics, Surface roughness, Epoxy adhesives, Epoxy resins

Proceedings Papers

Effects of Cure State on the Ultrasonic Nonlinear Parameter in Adhesive Joints

Guoli Liu, Jianmin Qu, Laurence J. Jacobs

Proc. ASME. IMECE2000, Nondestructive Evaluation and Characterization of Engineering Materials for Reliability and Durability Predictions, 83-94, November 5–10, 2000

Paper No: IMECE2000-1649

DOI: https://doi.org/10.1115/IMECE2000-1649

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Topics: Adhesive joints, Hardening (Curing), Signals, Transducers, Waves, Cycles, Polymers, Temperature

Journal Articles

Frequency-Dependent Tensile and Compressive Effective Moduli of Elastic Solids With Randomly Distributed Two-Dimensional Microcracks

Youxuan Zhao, Yanjun Qiu, Laurence J. Jacobs, Jianmin Qu

J. Appl. Mech. August 2015, 82(8): 081006.

Paper No: JAM-15-1150

DOI: https://doi.org/10.1115/1.4030538

Published Online: August 1, 2015

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Topics: Finite element methods, Fracture (Materials), Micromechanics (Engineering), Microcracks, Solids, Density, Compression

Journal Articles

Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations

Feng Gao, Jianmin Qu, Matthew Yao

J. Electron. Packag. June 2011, 133(2): 020908.

DOI: https://doi.org/10.1115/1.4004095

Published Online: July 1, 2011

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Topics: Carbon nanotubes, Contact resistance, Electrodes, Electron configuration

Proceedings Papers

Molecular Dynamics Simulation of the Thermal Resistance of Carbon Nanotube – Substrate Interfaces

Daniel J. Rogers, Jianmin Qu, Matthew Yao

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 55-61, July 19–23, 2009

Paper No: InterPACK2009-89096

DOI: https://doi.org/10.1115/InterPACK2009-89096

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Topics: Carbon nanotubes, Interfacial thermal resistance, Molecular dynamics simulation, Phonons, Thermal resistance

Proceedings Papers

Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints

Feng Gao, Jianping Jing, Frank Z. Liang, Richard L. Williams, Jianmin Qu

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 729-736, July 19–23, 2009

Paper No: InterPACK2009-89098

DOI: https://doi.org/10.1115/InterPACK2009-89098

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Topics: Brittleness, Failure, Lead-free solders, Solders, Solder joints, Brittle fracture, Failure mechanisms, Design, Dynamic testing (Materials), Finite element analysis

Proceedings Papers

Electronic Structure and Contact Resistance at the Interface Between Carbon Nanotubes and Copper Pad

Feng Gao, Jianmin Qu, Matthew Yao

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 543-547, July 19–23, 2009

Paper No: InterPACK2009-89099

DOI: https://doi.org/10.1115/InterPACK2009-89099

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Topics: Carbon nanotubes, Contact resistance, Copper, Electron configuration, Density, Electrodes, Electrons, Density functional theory, Electrical properties, Electronics

Proceedings Papers

Conducting Properties of a Contact Between Open-End Carbon Nanotube and Various Electrodes

Feng Gao, Jianmin Qu, Matthew Yao

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 165-169, November 13–19, 2009

Paper No: IMECE2009-11117

DOI: https://doi.org/10.1115/IMECE2009-11117

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Topics: Carbon nanotubes, Electrodes, Density, Electrical conductance, Electron configuration, Electrons, Metals, Single-walled carbon nanotubes, Density functional theory, Electronics

Proceedings Papers

Elastic Properties of (Cu,Ni) 6 Sn 5 Ternary Crystal Structure Using First-Principle Approach

Feng Gao, Jianmin Qu

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 159-163, November 13–19, 2009

Paper No: IMECE2009-11130

DOI: https://doi.org/10.1115/IMECE2009-11130

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Topics: Crystal structure, Elasticity, Tin, Atoms, Anisotropy, Density, Intermetallic compounds, Density functional theory, Diffusion (Physics), Electronic packaging

Proceedings Papers

A Multiscale Modeling Method for the Creep Behavior of SnAg Solder Alloys

Min Pei, Jianmin Qu

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 115-120, July 8–12, 2007

Paper No: IPACK2007-33703

DOI: https://doi.org/10.1115/IPACK2007-33703

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Topics: Alloys, Creep, Multiscale modeling, Solders, Tin, Particulate matter

Proceedings Papers

Effect of La Doping on SnAg Solder Microstructure Evolution

Min Pei, Jianmin Qu

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 407-413, July 8–12, 2007

Paper No: IPACK2007-33701

DOI: https://doi.org/10.1115/IPACK2007-33701

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Topics: Lead-free solders, Particulate matter, Solders, Temperature, Tin

Proceedings Papers

Simulation of Dynamic Fracture Along Solder-Pad Interfaces Using a Cohesive Zone Model

Jianping Jing, Feng Gao, Janine Johnson, Frank Z. Liang, Richard L. Williams, Jianmin Qu

Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 171-176, October 31–November 6, 2008

Paper No: IMECE2008-68891

DOI: https://doi.org/10.1115/IMECE2008-68891

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Topics: Fracture (Materials), Fracture (Process), Simulation, Solders, Failure, Brittleness, Damage, Finite element methods, Solder joints

Proceedings Papers

Loading Direction Versus Crack Propagation Path in a Lead-Free Single Solder Joint Sample

Feng Gao, Jianping Jing, Janine Johnson, Frank Z. Liang, Richard L. Williams, Jianmin Qu

Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 145-152, October 31–November 6, 2008

Paper No: IMECE2008-68099

DOI: https://doi.org/10.1115/IMECE2008-68099

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Topics: Crack propagation, Solder joints, Solders, Alloys, Failure, Fracture (Materials), Shear (Mechanics), Fracture (Process), Intermetallic compounds

Proceedings Papers

An Engineering Model for Moisture Degradation of Polymer/Metal Interfacial Fracture Toughness

Timothy P. Ferguson, Jianmin Qu

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1661-1664, July 17–22, 2005

Paper No: IPACK2005-73414

DOI: https://doi.org/10.1115/IPACK2005-73414

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Topics: Engineering models, Fracture toughness, Metals, Polymers, Fracture mechanics, Hydrophobicity

Journal citation

NARROW

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Three-Dimensional Finite Element Modeling of Flip Chip Packages Under Thermal Loading

Micromechanical Modeling of Fiber Fragmentation in Single Fiber Composite Specimens

On the Steady-State Characteristics of Circumferential Waves in a Two-Layered Cylinder

Effect of Thermal Residual Stresses on Polymer/Metal Interfacial Adhesion

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

Interfacial Versus Cohesive Failure on Underfill-Aluminum Interface: Effects of Interface Roughness

Effects of Cure State on the Ultrasonic Nonlinear Parameter in Adhesive Joints

Frequency-Dependent Tensile and Compressive Effective Moduli of Elastic Solids With Randomly Distributed Two-Dimensional Microcracks

Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations

Molecular Dynamics Simulation of the Thermal Resistance of Carbon Nanotube – Substrate Interfaces

Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints

Electronic Structure and Contact Resistance at the Interface Between Carbon Nanotubes and Copper Pad

Conducting Properties of a Contact Between Open-End Carbon Nanotube and Various Electrodes

Elastic Properties of (Cu,Ni) 6 Sn 5 Ternary Crystal Structure Using First-Principle Approach

A Multiscale Modeling Method for the Creep Behavior of SnAg Solder Alloys

Effect of La Doping on SnAg Solder Microstructure Evolution

Simulation of Dynamic Fracture Along Solder-Pad Interfaces Using a Cohesive Zone Model

Loading Direction Versus Crack Propagation Path in a Lead-Free Single Solder Joint Sample

An Engineering Model for Moisture Degradation of Polymer/Metal Interfacial Fracture Toughness

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