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Proceedings Papers

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Ved Soni, Kartik Goyal, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 25–27, 2022

Paper No: IPACK2022-97437

DOI: https://doi.org/10.1115/IPACK2022-97437

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Topics: Artificial neural networks, Geometry, Inks, Printing, Dimensions, Particulate matter, Computer software, Control algorithms, Electronics, Regression models

Proceedings Papers

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Pradeep Lall, Kartik Goyal, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 25–27, 2022

Paper No: IPACK2022-97430

DOI: https://doi.org/10.1115/IPACK2022-97430

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Topics: Circuits, Electronics, Temperature, Surface mount components, Filters, Manufacturing, Printing, Wearable devices, Energy dissipation, Heat

Proceedings Papers

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Pradeep Lall, Kartik Goyal, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 25–27, 2022

Paper No: IPACK2022-97428

DOI: https://doi.org/10.1115/IPACK2022-97428

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Topics: Circuits, Drops, Electronics, Equipment performance, Experimental design, Inks, Manufacturing, Materials properties, Mechanical properties, Nanoparticles

Journal Articles

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Pradeep Lall, Kartik Goyal, Curtis Hill

J. Electron. Packag. June 2023, 145(2): 021011.

Paper No: EP-22-1029

DOI: https://doi.org/10.1115/1.4055986

Published Online: November 23, 2022

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Topics: Copper, Sintering, Surface mount devices, Electrical resistivity, Printing, Drops, Electronics

Journal Articles

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Pradeep Lall, Kartik Goyal, Scott Miller

J. Electron. Packag. June 2022, 144(2): 021119.

Paper No: EP-21-1057

DOI: https://doi.org/10.1115/1.4054131

Published Online: April 22, 2022

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Topics: Aerosols, Sintering, Metals, Inks, Stress, Shear (Mechanics), Failure, Design, Temperature

Proceedings Papers

Additively Printed Flexible Temperature Sensor for Wearable Applications

Pradeep Lall, Hyesoo Jang, Jinesh Narangaparambil, Kartik Goyal, Curtis Hill

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 26–28, 2021

Paper No: IPACK2021-74071

DOI: https://doi.org/10.1115/IPACK2021-74071

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Topics: Reliability, Temperature sensors

Proceedings Papers

Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

Pradeep Lall, Kartik Goyal, Kyle Schulze, Curtis Hill

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 26–28, 2021

Paper No: IPACK2021-74063

DOI: https://doi.org/10.1115/IPACK2021-74063

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Topics: Copper, Electronics, Inks, Sintering

Proceedings Papers

Process-Consistency in Additive Printed Multilayer Substrates With Offset-Vias Using Aerosol Jet Technology

Pradeep Lall, Kartik Goyal, Scott Miller

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 27–29, 2020

Paper No: IPACK2020-2680

DOI: https://doi.org/10.1115/IPACK2020-2680

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Topics: Aerosols, Electronics, Sintering

Journal Articles

Additively Printed Multilayer Substrate Using Aerosol-Jet Technique

Pradeep Lall, Kartik Goyal, Nakul Kothari, Benjamin Leever, Scott Miller

J. Electron. Packag. December 2020, 142(4): 041110.

Paper No: EP-20-1002

DOI: https://doi.org/10.1115/1.4047473

Published Online: June 29, 2020

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Topics: Aerosols, Inks, Sintering, Design, Modeling

Proceedings Papers

Effect of Process Parameters on Aerosol Jet Printing of Multi-Layer Circuitry

Pradeep Lall, Kartik Goyal, Nakul Kothari, Ben Leever, Scott Miller

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 7–9, 2019

Paper No: IPACK2019-6574

DOI: https://doi.org/10.1115/IPACK2019-6574

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Topics: Aerosols, Printing

Proceedings Papers

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

Pradeep Lall, Kartik Goyal

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, August 29–September 1, 2017

Paper No: IPACK2017-74264

DOI: https://doi.org/10.1115/IPACK2017-74264

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Topics: Printed circuit boards, Reliability, Solders, X-rays, Deformation, Electronics, Manufacturing, Solder joints, Computerized tomography, Heating

Journal citation

NARROW

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Additively Printed Flexible Temperature Sensor for Wearable Applications

Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

Process-Consistency in Additive Printed Multilayer Substrates With Offset-Vias Using Aerosol Jet Technology

Additively Printed Multilayer Substrate Using Aerosol-Jet Technique

Effect of Process Parameters on Aerosol Jet Printing of Multi-Layer Circuitry

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

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