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Krishna Bhavana Sivaraju
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Proceedings Papers

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 25–27, 2022
Paper No: IPACK2022-97429
DOI: https://doi.org/10.1115/IPACK2022-97429
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Topics: Building renovation, Computational fluid dynamics, Coolants, Cooling, Data centers, Flow (Dynamics), Fluids, Geometry, Heat, Heat transfer
Proceedings Papers

CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server

Prajwal Murthy, Gautam Gupta, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Pratik Bansode, Himanshu Modi, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 25–27, 2022
Paper No: IPACK2022-97402
DOI: https://doi.org/10.1115/IPACK2022-97402
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Topics: Computational fluid dynamics, Cooling, Fluids, Forced convection, Power density, Simulation, Temperature, Thermal conductivity
Proceedings Papers

Impact of Immersion Cooling on Thermomechanical Properties of Non-Halogenated Substrate

Rabin Bhandari, Akshay Boovanahally Lakshminarayana, Krishna Bhavana Sivaraju, Pratik Vithoba Bansode, Ephrem Kejela, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A007, October 25–27, 2022
Paper No: IPACK2022-97423
DOI: https://doi.org/10.1115/IPACK2022-97423
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Topics: Cooling, Thermomechanics
Proceedings Papers

Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center

Vibin Shalom Simon, Himanshu Modi, Krishna Bhavana Sivaraju, Pratik Bansode, Satyam Saini, Pardeep Shahi, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 25–27, 2022
Paper No: IPACK2022-97494
DOI: https://doi.org/10.1115/IPACK2022-97494
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Topics: Cooling, Data centers, Density, Doors, Heat exchangers