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Journal Articles

Achieving Ultra-Omniphilic Wettability on Copper Using a Facile, Scalable, Tuned Bulk Micromanufacturing Approach

Nicholas Clegg, Krishna Kota, Xin He, Sean Ross
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Research-Article
J. Micro Nano-Manuf. September 2017, 5(3): 031003.
Paper No: JMNM-16-1041
https://doi.org/10.1115/1.4036446
Published Online: May 17, 2017
View Article titled, Achieving Ultra-Omniphilic Wettability on Copper Using a Facile, Scalable, Tuned Bulk Micromanufacturing Approach
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Topics: Copper, Water, Micromanufacturing, Surface roughness, Drops, Etching, Coatings, Polishing
Proceedings Papers

Design of a High-Effective Wavy Channel Heat Exchanger for Cryogenic Applications

Jason L. Shelby, Krishna Kota
Proc. ASME. IMECE2015, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A051, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-52833
https://doi.org/10.1115/IMECE2015-52833
View Paper titled, Design of a High-Effective Wavy Channel Heat Exchanger for Cryogenic Applications
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Topics: Design, Heat exchangers, Heat, Heat transfer, Temperature, Flow (Dynamics), Pressure drop, Fluids, Propellants, Boiling
Proceedings Papers

A Critical Review of Drag Reduction in Channel Flows and Numerical Study of Forced Convective Transport in a Channel With Conducting-Lubricating (CO-LUB) Surfaces

Jessica Reyes, Krishna Kota
Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T04A045, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2015-48799
https://doi.org/10.1115/ICNMM2015-48799
View Paper titled, A Critical Review of Drag Reduction in Channel Flows and Numerical Study of Forced Convective Transport in a Channel With Conducting-Lubricating (CO-LUB) Surfaces
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Topics: Channel flow, Drag reduction, Heat transfer, Flow (Dynamics), Dimensions, Engineering simulation, Fluids, Forced convection, Heat conduction, Heat flux
Proceedings Papers

Review of Geothermal and Solar Thermal Power Plants and a Comparative Design Analysis

Roberto Venegas, Sarada Kuravi, Krishna Kota, Troy Nguyen, Mary McCay
Proc. ASME. POWER2015, ASME 2015 Power Conference, V001T01A013, June 28–July 2, 2015
Publisher: American Society of Mechanical Engineers
Paper No: POWER2015-49526
https://doi.org/10.1115/POWER2015-49526
View Paper titled, Review of Geothermal and Solar Thermal Power Plants and a Comparative Design Analysis
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Topics: Design, Geothermal engineering, Solar thermal power, Temperature, Parabolic troughs, Solar energy, Combined cycles, Concentrating solar power, Cycles, Energy conversion
Proceedings Papers

Understanding the Impact of Flow Bypass on the Thermal Performance of Air Cooled Heat Sinks

Krishna Kota, Mohamed M. Awad
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A083, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-37521
https://doi.org/10.1115/IMECE2014-37521
View Paper titled, Understanding the Impact of Flow Bypass on the Thermal Performance of Air Cooled Heat Sinks
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Topics: Flow (Dynamics), Heat sinks, Thermal resistance, Energy conservation, Junctions, Modeling
Proceedings Papers

Novel Immersion Cooling Technique for a 3D Chip Stack

Ashish Sinha, Krishna Kota, Pablo Hidalgo, Yogendra Joshi, Ari Glezer
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73039
https://doi.org/10.1115/IPACK2013-73039
View Paper titled, Novel Immersion Cooling Technique for a 3D Chip Stack
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Topics: Cooling, Fluids, Electronics, Heat, Copper, Water, Convection, Energy dissipation, Heat conduction, Heat sinks
Journal Articles

Performance of an Air-Cooled Heat Sink Channel With Microscale Dimples Under Transitional Flow Conditions

Krishna Kota, Ludovic Burton, Yogendra Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2013, 135(11): 111005.
Paper No: HT-12-1147
https://doi.org/10.1115/1.4024598
Published Online: September 23, 2013
View Article titled, Performance of an Air-Cooled Heat Sink Channel With Microscale Dimples Under Transitional Flow Conditions
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Microscale devices, Computer simulation, Design, Optimization, Pressure drop
Proceedings Papers

Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls

Liang Gong, Krishna Kota, Wenquan Tao, Yogendra Joshi
Proc. ASME. IMECE2010, Volume 7: Fluid Flow, Heat Transfer and Thermal Systems, Parts A and B, 1365-1373, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40788
https://doi.org/10.1115/IMECE2010-40788
View Paper titled, Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls
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Topics: Flow (Dynamics), Heat transfer, Microchannels, Fluid dynamics, Heat flux, Cooling, Electronics, Heat sinks, Reynolds number, Wavelength
Journal Articles

Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls

Liang Gong, Krishna Kota, Wenquan Tao, Yogendra Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 2011, 133(5): 051702.
https://doi.org/10.1115/1.4003284
Published Online: February 4, 2011
View Article titled, Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls
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Topics: Flow (Dynamics), Heat transfer, Microchannels, Wavelength, Pressure drop
eBook Chapter

Optimization of Film Condensation Driven Thermal Energy Storage Containers

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2009
ISBN: 9780791802908
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Topics: Containers, Film condensation, Optimization, Thermal energy storage