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Proceedings Papers

Hyperq/Plastics: An Expert System for Plastic Material and Process Selection

Kurt Beiter, Steven Krizan, Kosuke Ishii, Lee Hornberger
Proc. ASME. CIE91, ASME 1991 Computers in Engineering Conference: Volume 1 — Artificial Intelligence; Expert Systems; CAD/CAM/CAE; Computational Fluid/Thermal Engineering, 71-76, August 18–22, 1991
Paper No: CIE1991-0010
DOI: https://doi.org/10.1115/CIE1991-0010
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Topics: Expert systems, Plastics, Engineers, Design
Proceedings Papers

Geometry-Based Index for Predicting Sink Mark in Plastic Parts

Kurt Beiter, Kosuke Ishii, Lee Hornberger
Proc. ASME. DETC91, 3rd International Conference on Design Theory and Methodology, 111-118, September 22–25, 1991
Paper No: DETC1991-0037
DOI: https://doi.org/10.1115/DETC1991-0037
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Topics: Geometry, Design, Engineers, Packing (Shipments), Packings (Cushioning), Plastics, Pressure
Proceedings Papers

Toward Critical Thinking Mechanical Designers

Timothy K. Hight, Lee Hornberger, Lilia A. Sanchez
Proc. ASME. DETC93, 5th International Conference on Design Theory and Methodology, 189-193, September 19–22, 1993
Paper No: DETC1993-0020
DOI: https://doi.org/10.1115/DETC1993-0020
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Topics: Design engineering, Quality management
Proceedings Papers

Manufacturability: Metrics and Perceptions

Tim Hight, Lee Hornberger, Melissa Last
Proc. ASME. DETC95, Volume 2: 11th Biennial Conference on Reliability, Stress Analysis, and Failure Prevention; 7th International Conference on Design Theory and Methodology; JSME Symposium on Design and Production; Mechanical Design Education and History; Computer-Integrated Concurrent Design Conference, 495-498, September 17–20, 1995
Paper No: DETC1995-0182
DOI: https://doi.org/10.1115/DETC1995-0182
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Topics: Concurrent engineering, Design, Manufacturing, Microelectromechanical systems, Teams
Proceedings Papers

Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept

Dagmar Beyerlein, Lee Hornberger
Proc. ASME. IDETC-CIE2000, Volume 1: 20th Computers and Information in Engineering Conference, 655-662, September 10–13, 2000
Paper No: DETC2000/CIE-14654
DOI: https://doi.org/10.1115/DETC2000/CIE-14654
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Topics: Computer simulation, Design, Electronic packaging, Integrated circuits, Packaging, Computer software, Engineering prototypes, Raw materials, Simulation