1-11 of 11
Liang Gong
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit

Ping Sun, Bing-Huan Huang, Kui Li, Liang Gong, Chuan-Yong Zhu, Ying Zheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011005.
Paper No: EP-22-1080
https://doi.org/10.1115/1.4062531
Published Online: June 6, 2023
View Article titled, Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit
Open the PDF for Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit in another window
Topics: Flow (Dynamics), Heat transfer, Microchannels, Shapes, Temperature, Fins, Circuits, Cooling, Integrated circuits
Journal Articles

Investigation on Thermal Performance of a Novel Passive Phase Change Material-Based Fin Heat Exchanger

De-Xin Zhang, Chuan-Yong Zhu, Liang Gong, Bin Ding, Ming-Hai Xu
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. February 2023, 15(2): 021007.
Paper No: TSEA-22-1182
https://doi.org/10.1115/1.4056009
Published Online: November 8, 2022
View Article titled, Investigation on Thermal Performance of a Novel Passive Phase Change Material-Based Fin Heat Exchanger
Open the PDF for Investigation on Thermal Performance of a Novel Passive Phase Change Material-Based Fin Heat Exchanger in another window
Topics: Heat exchangers, Heat flux, Temperature, Phase change materials, Temperature control, Heat, Shock (Mechanics), Fins, Melting
Journal Articles

A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling

Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2021, 143(3): 030801.
Paper No: EP-19-1124
https://doi.org/10.1115/1.4048861
Published Online: January 19, 2021
View Article titled, A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling
Open the PDF for A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling in another window
Topics: Heat sinks, Metal foams, Heat transfer
Journal Articles

Application of a Hybrid Digital Twin Concept for Factory Layout Planning

Daniel Nåfors, Jonatan Berglund, Liang Gong, Björn Johansson, Thomas Sandberg, Jesper Birberg
Journal: Smart and Sustainable Manufacturing Systems
Publisher: ASTM International
Article Type: Technical Papers
Smart Sustain. Manuf. Syst.. July 2020, 4(2): 231–244.
Paper No: SSMS20190033
https://doi.org/10.1520/SSMS20190033
Published Online: July 29, 2020
View Article titled, Application of a Hybrid Digital Twin Concept for Factory Layout Planning
Open the PDF for Application of a Hybrid Digital Twin Concept for Factory Layout Planning in another window
Journal Articles

Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling

Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011006.
Paper No: EP-19-1100
https://doi.org/10.1115/1.4046756
Published Online: June 4, 2020
View Article titled, Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling
Open the PDF for Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling in another window
Topics: Heat flux, Heat sinks, Metal foams, Heat transfer, Temperature, Fluids
Journal Articles

Thermal Performance Analysis of Biporous Metal Foam Heat Sink

Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2017, 139(5): 052005.
Paper No: HT-16-1326
https://doi.org/10.1115/1.4035999
Published Online: March 15, 2017
View Article titled, Thermal Performance Analysis of Biporous Metal Foam Heat Sink
Open the PDF for Thermal Performance Analysis of Biporous Metal Foam Heat Sink in another window
Topics: Density, Heat sinks, Metal foams, Porosity, Thermal resistance, Heat transfer, Flow (Dynamics)
Proceedings Papers

Thermal Performance Analysis of Bi-Porous Metal Foam Heat Sink

Yongtong Li, Liang Gong, Minghai Xu, Yogendra Joshi
Proc. ASME. MNHMT2016, Volume 2: Micro/Nano-Thermal Manufacturing and Materials Processing; Boiling, Quenching and Condensation Heat Transfer on Engineered Surfaces; Computational Methods in Micro/Nanoscale Transport; Heat and Mass Transfer in Small Scale; Micro/Miniature Multi-Phase Devices; Biomedical Applications of Micro/Nanoscale Transport; Measurement Techniques and Thermophysical Properties in Micro/Nanoscale; Posters, V002T11A027, January 4–6, 2016
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2016-6707
https://doi.org/10.1115/MNHMT2016-6707
View Paper titled, Thermal Performance Analysis of Bi-Porous Metal Foam Heat Sink
Open the PDF for Thermal Performance Analysis of Bi-Porous Metal Foam Heat Sink in another window
Topics: Heat sinks, Metal foams, Porosity, Convection, Density, Equilibrium (Physics), Fluid dynamics, Heat transfer, Momentum, Thermal resistance
Journal Articles

Nonequilibrium Thermal Response of Porous Media in Unsteady Heat Conduction With Sinusoidally Changing Boundary Temperature

Huijin Xu, Liang Gong, Changying Zhao, Ying Yin
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2015, 137(11): 112601.
Paper No: HT-14-1641
https://doi.org/10.1115/1.4030905
Published Online: August 4, 2015
View Article titled, Nonequilibrium Thermal Response of Porous Media in Unsteady Heat Conduction With Sinusoidally Changing Boundary Temperature
Open the PDF for Nonequilibrium Thermal Response of Porous Media in Unsteady Heat Conduction With Sinusoidally Changing Boundary Temperature in another window
Topics: Heat conduction, Porous materials, Temperature
Proceedings Papers

Thermal Performance of Microchannels With Dimples for Electronics Cooling

Hui Lu, Liang Gong, Minghai Xu
Proc. ASME. MNHMT2013, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T11A010, December 11–14, 2013
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2013-22198
https://doi.org/10.1115/MNHMT2013-22198
View Paper titled, Thermal Performance of Microchannels With Dimples for Electronics Cooling
Open the PDF for Thermal Performance of Microchannels With Dimples for Electronics Cooling in another window
Topics: Computer cooling, Microchannels
Proceedings Papers

Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls

Liang Gong, Krishna Kota, Wenquan Tao, Yogendra Joshi
Proc. ASME. IMECE2010, Volume 7: Fluid Flow, Heat Transfer and Thermal Systems, Parts A and B, 1365-1373, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40788
https://doi.org/10.1115/IMECE2010-40788
View Paper titled, Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls
Open the PDF for Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls in another window
Topics: Flow (Dynamics), Heat transfer, Microchannels, Fluid dynamics, Heat flux, Cooling, Electronics, Heat sinks, Reynolds number, Wavelength
Journal Articles

Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls

Liang Gong, Krishna Kota, Wenquan Tao, Yogendra Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 2011, 133(5): 051702.
https://doi.org/10.1115/1.4003284
Published Online: February 4, 2011
View Article titled, Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls
Open the PDF for Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls in another window
Topics: Flow (Dynamics), Heat transfer, Microchannels, Wavelength, Pressure drop