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M. T. A. Saif
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Proceedings Papers

Investigation of Micro-Scale Materials Behavior With MEMS

M. A. Haque, M. T. A. Saif
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 283-288, November 14–19, 1999
Paper No: IMECE1999-0281
DOI: https://doi.org/10.1115/IMECE1999-0281
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Topics: Microelectromechanical systems, Microscale devices, Actuators, Aluminum, Force measurement, Polymers, Tensile testing, Testing
Proceedings Papers

A Novel MEMS-Based Technique for In-Situ Characterization of Freestanding Nanometer Scale Thin Films Inside SEM and TEM

M. A. Haque, M. T. A. Saif
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 15-20, November 11–16, 2001
Paper No: IMECE2001/MEMS-23802
DOI: https://doi.org/10.1115/IMECE2001/MEMS-23802
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Topics: Microelectromechanical systems, Nanoscale phenomena, Thin films, Tensile testing, Aluminum, Displacement, Force sensors, Stress, Testing
Proceedings Papers

Length-Scale Dependence of Elasticity in Nanocrystalline Materials for MEMS Applications

M. A. Haque, M. T. A. Saif
Proc. ASME. IMECE2002, Microelectromechanical Systems, 161-164, November 17–22, 2002
Paper No: IMECE2002-33297
DOI: https://doi.org/10.1115/IMECE2002-33297
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Topics: Elasticity, Microelectromechanical systems, Nanocrystals, Thin films
Journal Articles

Asymptotic Stress Field of a Mode III Crack Growing Along an Elastic/Elastic Power-Law Creeping Bimaterial Interface

C.-Y. Hui, M. T. A. Saif
Journal: Journal of Applied Mechanics
Article Type: Research Papers
J. Appl. Mech. June 1994, 61(2): 384–389.
DOI: https://doi.org/10.1115/1.2901455
Published Online: June 1, 1994
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Topics: Fracture (Materials), Stress, Materials properties, Shear (Mechanics)