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Masumi Saka
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Proceedings Papers
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 169-174, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0513
Proceedings Papers
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 145-152, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0510
Proceedings Papers
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 83-85, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0432
Proceedings Papers
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 87-92, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0433
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021008.
Paper No: EP-18-1073
Published Online: April 10, 2019
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Micro Nano-Manuf. June 2013, 1(2): 024501.
Paper No: JMNM-12-1009
Published Online: April 17, 2013
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 709-712, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52071
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 207-211, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52112
Proceedings Papers
Evaluating the Dominant Factor for Electromigration in High Purities Al Film Deposited by Sputtering
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 397-400, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89282
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 749-753, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89148
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 563-567, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89122
Proceedings Papers
Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 611-615, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33264
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 9-12, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33562
Proceedings Papers
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 589-592, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70073
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1147-1152, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73133
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1955-1958, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73433
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1689-1693, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73061
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 61-64, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35117
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 765-768, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35118
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 717-722, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35064
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