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Masumi Saka
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Proceedings Papers

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 87-92, November 15–20, 1998
Paper No: IMECE1998-0433
Journal Articles
Journal Articles
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 207-211, July 6–8, 2011
Paper No: IPACK2011-52112
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 709-712, July 6–8, 2011
Paper No: IPACK2011-52071
Proceedings Papers

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 589-592, June 3–5, 2008
Paper No: MicroNano2008-70073
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1689-1693, July 17–22, 2005
Paper No: IPACK2005-73061
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 61-64, July 6–11, 2003
Paper No: IPACK2003-35117
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 765-768, July 6–11, 2003
Paper No: IPACK2003-35118