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Michael Mayer
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Journal Articles

Fully Consolidated Deposits From Oxide Dispersion Strengthened and Silicon Steel Powders Via Friction Surfacing

Aishwarya Deshpande, Christian Baumann, Patrick Faue, Michael Mayer, Gerald Ressel, Friedrich Bleicher, Frank E. Pfefferkorn
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. October 2024, 146(10): 101005.
Paper No: MANU-24-1162
https://doi.org/10.1115/1.4066040
Published Online: August 29, 2024
View Article titled, Fully Consolidated Deposits From Oxide Dispersion Strengthened and Silicon Steel Powders Via Friction Surfacing
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Topics: Friction, Silicon steel, Stainless steel, Rods, Alloys, Feedstock
Journal Articles

Effect of Surface Curvature on Contact Resistance Between Cylinders

Michael Mayer, Marc Hodes, Toby Kirk, Darren Crowdy
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. March 2019, 141(3): 032002.
Paper No: HT-18-1469
https://doi.org/10.1115/1.4042441
Published Online: February 4, 2019
View Article titled, Effect of Surface Curvature on Contact Resistance Between Cylinders
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Topics: Boundary-value problems, Contact resistance, Cylinders, Heat flux, Temperature, Heat, Geometry, Thermal resistance
Journal Articles

Development of Accelerated Method for Thermal Cycling in Electronic Packaging Application

Michael Mayer, Michael McCracken, John Persic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021007.
Paper No: EP-12-1096
https://doi.org/10.1115/1.4023911
Published Online: March 28, 2013
View Article titled, Development of Accelerated Method for Thermal Cycling in Electronic Packaging Application
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Topics: Temperature, Wire, Cycles, Polysilicon
Journal Articles

Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls

Wan Ho Song, Ali Karimi, Yan Huang, Michael Mayer, Norman Zhou, Jae Pil Jung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041007.
https://doi.org/10.1115/1.4000281
Published Online: October 29, 2009
View Article titled, Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls
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Topics: Bonding, Displacement, Elastic moduli, Finite element analysis, Modeling, Sensitivity analysis, Simulation, Stress, Finite element model